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1. 发明授权

US4999077A Method of fabricating full width scanning or imaging arrays from subunits 失效
标题翻译：从子单元制作全幅扫描或成像阵列的方法
公开(公告)号：US4999077A
公开(公告)日：1991-03-12
申请号：US401379
申请日：1989-08-31
申请人： Donald J. Drake , Michael R. Campanelli , Cathie J. Burke , Diane Atkinson
发明人： Donald J. Drake , Michael R. Campanelli , Cathie J. Burke , Diane Atkinson
IPC分类号： H01L27/14 , H01L25/04 , H01L27/148 , H04N1/024
CPC分类号： H01L27/148 , H01L25/042 , H04N1/024 , H01L2924/0002 , H04N2201/02402 , Y10T156/1077 , Y10T156/1092 , Y10T29/49133 , Y10T29/49895
摘要： A method for fabricating a coplanar full width scanning array from a plurality of relatively short scanning subunits for reading and writing images. The subunits are fixedly mounted in an end-to-end relationship on a flat structural member with the subunit surfaces containing the scanning elements all being coplanar even though at least some of the subunits have varying thickness. This is accomplished by forming from a photopatternable thick film layer one or more keys on the subunit surface having the scanning elements and associated circuitry and positioning the keys into keyways produced from a photopatternable thick film layer on a flat surface of an alignment fixture. A conformal adhesive bonds a structural member to the assembled subunits to form the full width scanning array.

2. 发明授权

US5943076A Printhead for thermal ink jet devices 失效
标题翻译：用于热喷墨设备的打印头
公开(公告)号：US5943076A
公开(公告)日：1999-08-24
申请号：US805098
申请日：1997-02-24
申请人： Cathie J. Burke , Michael P. O'Horo , Donald J. Drake , Alan D. Raisanen
发明人： Cathie J. Burke , Michael P. O'Horo , Donald J. Drake , Alan D. Raisanen
IPC分类号： B41J2/05 , B41J2/14 , B41J2/16
CPC分类号： B41J2/1626 , B41J2/14129 , B41J2/1601 , B41J2/1642 , B41J2202/03 , B41J2202/11
摘要： The nucleation efficiency of a thermal ink jet printhead is improved by forming a heater element with a planar surface. A heater resistor, polysilicon in a preferred embodiment, has an irregular surface which can trap gas or vapors in the cracks or crevices. When the heater resistor is pulsed, the nucleation temperature is reduced by these trapped vapors requiring an increase in electrical input to the resistors, thereby reducing efficiency. The invention recognizes that a heater resistor with a planar surface in contact with an ink layer results in a higher nucleation temperature and increased efficiency. In one embodiment, a phosphosilicate glass (PSG) is flowed directly onto the resistor surface forming a planarization layer. Subsequent deposition of tantalum substantially replicates the underlying topography creating a heater resistor with a smooth surface adjacent the ink.In a second embodiment, a diffusion layer which is conformal is formed on the resistor surface with the PSG layer formed on the oxide layer. The diffusion layer can be a pyrolytic CVD deposited silicon nitride or a thermally grown oxide layer. The PSG layer has a planarized surface to which the tantalum conforms.
摘要翻译：通过形成具有平坦表面的加热器元件来改善热喷墨打印头的成核效率。加热电阻器，多晶硅在优选实施例中具有不规则的表面，其可以在裂纹或缝隙中捕获气体或蒸汽。当加热电阻器被脉冲时，通过这些被捕获的蒸汽减少成核温度，这需要增加对电阻器的电输入，从而降低效率。本发明认识到，具有与油墨层接触的平坦表面的加热电阻器导致更高的成核温度和更高的效率。在一个实施例中，磷硅玻璃（PSG）直接流到形成平坦化层的电阻器表面上。随后的钽的沉积基本上复制了底层的形貌，形成了具有与墨水相邻的光滑表面的加热电阻器。在第二实施例中，在电阻器表面上形成具有共形的扩散层，其中形成在氧化物层上的PSG层。扩散层可以是热解CVD沉积的氮化硅或热生长的氧化物层。 PSG层具有钽符合的平坦化表面。

3. 发明授权

US5124717A Ink jet printhead having integral filter 失效
标题翻译：具有整体式过滤器的喷墨打印头
公开(公告)号：US5124717A
公开(公告)日：1992-06-23
申请号：US624390
申请日：1990-12-06
申请人： Michael R. Campanelli , William G. Hawkins , Donald J. Drake , James F. O'Neill
发明人： Michael R. Campanelli , William G. Hawkins , Donald J. Drake , James F. O'Neill
IPC分类号： B41J2/05 , B41J2/16
CPC分类号： B41J2/1604 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1642 , B41J2002/14403
摘要： An ink jet printhead having an integral membrane filter fabricated over the surface of the printhead containing the ink inlet is disclosed. The individual printheads are obtained by a sectioning operation which cuts aligned and bonded channel and heater wafers. The mated wafers contain a plurality of printheads and must be separated. The integral membrane filter is formed on the channel wafer after it is anisotropically etched incorporating the etch resistant mask layer and prior to mating with the heater wafer. A patternable layer is deposited over the etch resistant masking layer and exposed, patterned and developed to establish the mesh filter. In one embodiment, the side of the channel wafer not patterned and etched is heavily doped to form an etch stop which increases the robustness of the membrane filter by ensuring that the masking layer remains intact during subsequent fabricating steps. This doped region beneath the patternable layer is then etched using the membrane filter as a mask to open the filter pores through the doped layer of the channel wafer, thereby increasing the filter thickness and its overall strength.
摘要翻译：公开了一种在包含墨水入口的打印头的表面上制造的具有整体膜过滤器的喷墨打印头。单个打印头通过切割对准和粘合的通道和加热器晶片的切片操作获得。配对的晶片包含多个打印头，必须分开。整体膜过滤器在其各向异性蚀刻之后形成在通道晶片上，其包含耐蚀刻掩模层并且在与加热器晶片配合之前。将可图案层沉积在抗蚀刻掩模层上，并进行曝光，图案化和显影以建立网状过滤器。在一个实施例中，未图案化和蚀刻的沟道晶片的侧面被重掺杂以形成蚀刻停止件，其通过确保掩模层在随后的制造步骤期间保持完整而增加了膜过滤器的鲁棒性。然后使用膜过滤器作为掩模蚀刻可图案层下面的该掺杂区域，以通过通道晶片的掺杂层打开过滤器孔，从而增加过滤器厚度及其整体强度。

4. 发明授权

US4678529A Selective application of adhesive and bonding process for ink jet printheads 失效
标题翻译：选择性应用喷墨打印头的粘合剂和粘合工艺
公开(公告)号：US4678529A
公开(公告)日：1987-07-07
申请号：US881414
申请日：1986-07-02
申请人： Donald J. Drake , Michael R. Campanelli , Dale R. Ims
发明人： Donald J. Drake , Michael R. Campanelli , Dale R. Ims
IPC分类号： B41J2/05 , B41J2/16 , C09J5/00 , C09J5/06 , B32B31/00
CPC分类号： B41J2/1628 , B41J2/1604 , B41J2/1623 , B41J2/1629 , B41J2/1635 , B41J2/1642 , B41J2/1645 , Y10T156/1059
摘要： A method of bonding ink jet printhead components together by coating a flexible substrate with a relatively thin, uniform layer of an adhesive having an intermediate non-tacky curing stage with a shelf life with around one month for ease of alignment of the parts and ease of storage of the components having the adhesive thereon. Transferring about half of the adhesive layer on the flexible substrate to the high points or lands of one of the printhead components within a predetermined time of the coating of the flexible substrate by placing it in contact therewith and applying a predetermined temperature and pressure to the flexible substrate prior to peeling it from the printhead component. This causes the adhesive to fail cohesively in the liquid state, assuring that about half of the thickness of the adhesive layer stays with the flexible substrate and is discarded therewith, leaving a very thin uniform layer of adhesive on the printhead component lands. The transferred adhesive layer remaining on the printhead component enters an intermediate non-tacky curing stage to assist in subsequent alignment of the printhead components. The printhead components are aligned and the adhesive layer cured to complete fabrication of the printhead.
摘要翻译：通过用相对薄的均匀的粘合剂层将粘合喷墨打印头部件的方法粘合在一起，该粘合剂具有中间非粘性固化阶段，其具有大约一个月的保质期，以便部件的对准和易于在其上存储具有粘合剂的部件。通过使其与其接触并将其预定的温度和压力施加到柔性基板上，将柔性基板上的粘合剂层的大约一半转移到柔性基板的涂覆的预定时间内的一个打印头部件的高点或平台上在将其从打印头部件剥离之前的基板。这导致粘合剂在液体状态下内聚失效，确保粘合剂层的厚度的大约一半与柔性基材保持并被丢弃，在打印头部件焊盘上留下非常薄的均匀的粘合剂层。残留在打印头组件上的转移的粘合剂层进入中间非粘性固化阶段以帮助打印头组件的随后对准。打印头组件对准并且粘合剂层固化以完成打印头的制造。

5. 发明授权

US4601777A Thermal ink jet printhead and process therefor 失效
标题翻译：热喷墨打印头及其工艺
公开(公告)号：US4601777A
公开(公告)日：1986-07-22
申请号：US719410
申请日：1985-04-03
申请人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
发明人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
IPC分类号： B41J2/01 , B41J2/015 , B41J2/05 , B41J2/16 , H01L49/02 , H01L21/306 , B44C1/22 , C03C15/00 , C23F1/02
CPC分类号： B41J2/1623 , B41J2/1604 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642 , H01L49/02
摘要： Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.
摘要翻译：公开了用于喷墨打印头的若干制造方法，每个打印头由对准和粘合在一起的两个部件组成。一部分是在其表面上包含加热元件和寻址电极的线阵列的基本平坦的基板，并且第二部分是具有各向异性蚀刻在其中的至少一个凹部的基板，以当两部分为结合在一起在第二部分中形成一系列平行的凹槽，使得凹槽的一端与歧管凹槽连通，另一端打开以用作墨滴排出喷嘴。许多打印头可以通过在硅晶片上产生多组加热元件阵列与其寻址电极并通过在预定位置放置对准标记而同时制造。在第二硅晶片中产生相应的多组通道和相关联的歧管，并且在一个实施例中，在预定位置处蚀刻对准开口。两个晶片通过对准开口和对准标记对齐，然后粘合在一起并切成许多单独的打印头。许多打印头可以固定地安装在页宽配置中，该宽度配置面对用于页宽打印的移动记录介质，或者单独的打印头可适用于支架式喷墨打印。

6. 发明授权

US4975143A Keyway alignment substrates 失效
标题翻译：键槽对准基板
公开(公告)号：US4975143A
公开(公告)日：1990-12-04
申请号：US440211
申请日：1989-11-22
申请人： Donald J. Drake , Michael R. Campanelli , Thomas A. Tellier
发明人： Donald J. Drake , Michael R. Campanelli , Thomas A. Tellier
IPC分类号： B41J2/05 , H01L21/68 , H01L31/02 , H04N1/028
CPC分类号： H01L21/68 , H01L2224/16 , H01L2924/01014 , H01L2924/10253 , Y10T156/1092 , Y10T156/1744
摘要： The vacuum hold down alignment substrate is formed as an array of precisely aligned alignment substrate subunits. Each subunit is formed with an alignment pattern formed in a photo-patternable or electroformable material. When the plurality of alignment substrate subunits are formed into an array to produce the alignment substrate, the alignment patterns are aligned to receive corresponding patterns in discrete subunit devices which are aligned into an array on the alignment substrate.
摘要翻译：真空压紧对准基板形成为精确对准的对准衬底子单元的阵列。每个子单元形成有形成在可光图案化或可电铸材料中的对准图案。当多个对准衬底子单元形成为阵列以产生对准衬底时，对准图案对齐以在离散子单元器件中接收对准到对准衬底上的阵列中的对应图案。

7. 发明授权

US4822755A Method of fabricating large area semiconductor arrays 失效
标题翻译：制造大面积半导体阵列的方法
公开(公告)号：US4822755A
公开(公告)日：1989-04-18
申请号：US185600
申请日：1988-04-25
申请人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
发明人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
IPC分类号： H01L21/302 , B41J2/16 , H01L21/301 , H01L21/306 , H01L29/06 , H01L21/00 , H01L21/02 , H01L21/72 , H01L21/98
CPC分类号： B41J2/1628 , B41J2/1601 , B41J2/1623 , B41J2/1629 , B41J2/1642 , H01L21/30604 , B41J2202/13 , H01L29/0657 , Y10S438/928
摘要： A method for separating chips formed on a silicon substrate is provided which uses a combination of reactive ion etching techniques combined with orientation etching to yield integrated chips having edges which can be more precisely butted together to form large area arrays.

8. 再颁专利

USRE32572E Thermal ink jet printhead and process therefor 失效
标题翻译：热喷墨打印头及其工艺
公开(公告)号：USRE32572E
公开(公告)日：1988-01-05
申请号：US947020
申请日：1986-12-29
申请人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
发明人： William G. Hawkins , Donald J. Drake , Michael R. Campanelli
IPC分类号： B41J2/16
CPC分类号： B41J2/1623 , B41J2/1604 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1635 , B41J2/1642
摘要： Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.

9. 发明授权

US5034083A Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array 失效
标题翻译：用于将较小扫描或打印阵列组装在一起以形成扩展阵列的方法和装置
公开(公告)号：US5034083A
公开(公告)日：1991-07-23
申请号：US422220
申请日：1989-10-16
申请人： Michael R. Campanelli , Donald J. Drake
发明人： Michael R. Campanelli , Donald J. Drake
IPC分类号： H04N1/024 , H01L21/58 , H01L27/14 , H04N1/03
CPC分类号： B41J2/155 , H01L24/75 , H01L24/83 , H04N1/03 , B41J2002/14362 , B41J2202/20 , H01L2224/8319 , H01L2224/83224 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H04N2201/02456 , H04N2201/02487 , Y10T156/1089
摘要： Process and apparatus for fabricating an extended scanning or printing array in which plural smaller scanning or printing chips are bonded end-to-end onto the surface of a glass substrate having an opaque thermally and/or electrically conductive coating thereon, with the coating removed at discrete sites to allow a photocurable adhesive placed at the sites to be cured through exposure to UV light from underneath the substrate, the photocurable adhesive holding the chips in place while a chip bonding adhesive deposited on the conductive coating where the chips are located is cured to provide a permanent structure.

10. 发明授权

US4961821A Ode through holes and butt edges without edge dicing 失效
标题翻译：通过孔和对接边缘没有边缘切割
公开(公告)号：US4961821A
公开(公告)日：1990-10-09
申请号：US440296
申请日：1989-11-22
申请人： Donald J. Drake , William G. Hawkins , Michael R. Campanelli , Thomas A. Tellier
发明人： Donald J. Drake , William G. Hawkins , Michael R. Campanelli , Thomas A. Tellier
IPC分类号： B41J2/05 , B41J2/135 , B41J2/16 , H01L21/301 , H01L21/306 , H01L21/308 , H01L21/768
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1629 , H01L21/30608 , H01L21/3081 , H01L21/76898
摘要： At least one through opening of predetermined location and dimensions is fabricated in a (100) silicon wafer by orientation dependent etching method after completion of integrated circuits on the wafer, the opening extending through the wafer between a circuit surface of the wafer and an opposite parallel base surface of the wafer and having a predetermined location relative to the integrated circuit on the circuit surface of the wafer. The method includes the steps of fabricating the integrated circuit on the circuit surface of the wafer; applying an etch resistant layer of plasma solicon nitride on the circuit and base surfaces of the wafer; patterning the etch resistant plasma silicon nitride layer on the circuit surface to define an upper etch opening having a location and dimensions which define the predetermined location and dimensions of the through opening; and patterning the plasma silicon nitride layer on the base surface to produce a lower etch opening aligned with the upper etch opening within a predetermined tolerance. The wafer is then anisotropically etched to produce a first recess corresponding to the upper etch opening in the circuit surface and a second recess corresponding to the lower etch opening in the base surface, each of the first and second recesses being bounded by (111) plane side walls. The anisotropic etching of the second recess intersects the first recess to form the through opening bounded by (111) plane side walls and has its predetermined dimensions and location defined by the patterning of the upper etch opening.

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