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1. 发明授权

US4873136A Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom 失效
标题翻译：制备用于随后镀覆聚合物表面的方法以及由其制成的改进的金属镀塑料制品
公开(公告)号：US4873136A
公开(公告)日：1989-10-10
申请号：US207462
申请日：1988-06-16
申请人： Donald F. Foust , Edward J. Lamby , Bradley R. Karas , William V. Dumas , Elihu C. Jerabek
发明人： Donald F. Foust , Edward J. Lamby , Bradley R. Karas , William V. Dumas , Elihu C. Jerabek
IPC分类号： C23C18/24 , C23C18/22 , H05K3/18 , H05K3/38
CPC分类号： H05K3/381 , C23C18/22 , H05K3/181 , Y10S205/926 , Y10S428/901 , Y10T428/12396 , Y10T428/12569 , Y10T428/24917 , Y10T428/31681 , Y10T428/31725
摘要： An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.

2. 发明授权

US5529805A Method for manufacturing a diamond article 失效
标题翻译：金刚石制品的制造方法
公开(公告)号：US5529805A
公开(公告)日：1996-06-25
申请号：US310449
申请日：1994-09-22
申请人： Charles D. Iacovangelo , Elihu C. Jerabek
发明人： Charles D. Iacovangelo , Elihu C. Jerabek
IPC分类号： C04B41/52 , C04B41/89 , C23C26/00 , C23C30/00 , C23C16/00
CPC分类号： C04B41/009 , C04B41/52 , C04B41/89 , C23C26/00 , C23C30/005
摘要： A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a chromium bonding layer and a protective braze compatible overcoat, such as a Ni overcoat. The interface between the Cr layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the Cr layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert comprises the steps of depositing a chromium metal layer on a diamond substrate, depositing a substantially non-oxidizable protective layer on the metal layer and heating the dual-coated diamond article at a temperature for a sufficient time. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.
摘要翻译：金刚石制品，例如可在空气中钎焊的片状金刚石工具刀片。金刚石片具有双层涂层，铬结合层和保护性钎焊兼容的外涂层，例如Ni外涂层。 Cr层和金刚石基底之间的界面包括足够的金属碳化物组分以提供粘附。一旦涂覆有Cr层和保护外涂层，双涂层金刚石插入件可以在制造环境中使用标准钎焊气氛钎焊到工具衬底，而不需要真空炉或特殊气氛。用于制造金刚石刀片的方法包括以下步骤：在金刚石衬底上沉积铬金属层，在金属层上沉积基本上不可氧化的保护层，并在温度下加热双重涂覆的金刚石制品足够的时间。将金刚石刀片涂覆并在无氧和无氮气氛中进行热处理，以在金刚石涂层界面处形成金属碳化物。

3. 发明授权

US5647878A Fabrication of brazable in air diamond tool inserts and inserts fabricated thereby 失效
标题翻译：制造由此制造的空气金刚石工具刀片和刀片中的钎焊
公开(公告)号：US5647878A
公开(公告)日：1997-07-15
申请号：US583360
申请日：1996-01-05
申请人： Charles D. Iacovangelo , Elihu C. Jerabek
发明人： Charles D. Iacovangelo , Elihu C. Jerabek
IPC分类号： C23C14/02 , C23C14/18 , C23C14/58 , B24D11/02
CPC分类号： C23C14/5806 , C23C14/021 , C23C14/185 , C23C14/58 , C23C14/5893 , Y10T407/27
摘要： A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a WTi bonding layer and a protective braze compatible overcoat, such as a Ag overcoat. The interface between the WTi layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the WTi layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert is also disclosed. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.
摘要翻译：金刚石制品，例如可在空气中钎焊的片状金刚石工具刀片。金刚石片具有双层涂层，WTi粘合层和保护性钎焊兼容外涂层，例如Ag外涂层。 WTi层和金刚石基底之间的界面包括足够的金属碳化物组分以提供粘附。一旦涂覆有WTi层和保护外涂层，双涂层金刚石插入件可以在制造环境中使用标准钎焊而无需真空炉或特殊气氛将其钎焊到工具衬底。还公开了一种用于制造金刚石刀片的方法。将金刚石刀片涂覆并在无氧和无氮气氛中进行热处理，以在金刚石涂层界面处形成金属碳化物。

4. 发明授权

US5500248A Fabrication of air brazable diamond tool 失效
标题翻译：空气钎焊金刚石工具的制造
公开(公告)号：US5500248A
公开(公告)日：1996-03-19
申请号：US286076
申请日：1994-08-04
申请人： Charles D. Iacovangelo , Elihu C. Jerabek
发明人： Charles D. Iacovangelo , Elihu C. Jerabek
IPC分类号： C23C14/02 , C23C14/18 , C23C14/58 , C23C16/00 , B05D3/02
CPC分类号： C23C14/5806 , C23C14/021 , C23C14/185 , C23C14/58 , C23C14/5893 , Y10T407/27
摘要： A diamond article, for example, a sheet-form diamond tool insert brazable in air. The diamond sheet has a dual layer coating, a WTi bonding layer and a protective braze compatible overcoat, such as a Ag overcoat. The interface between the WTi layer and the diamond substrate includes sufficient metal carbide component to provide adhesion. Once coated with the WTi layer and the protective overcoat, the dual-coated diamond insert may be air brazed to a tool substrate in a manufacturing environment using a standard braze without a vacuum furnace or special atmosphere. A method for manufacturing the diamond insert is also disclosed. The diamond insert is coated and heat treated in an oxygen- and nitrogen-free atmosphere to create metal carbide at the diamond-coating interface.
摘要翻译：金刚石制品，例如可在空气中钎焊的片状金刚石工具刀片。金刚石片具有双层涂层，WTi粘合层和保护性钎焊兼容外涂层，例如Ag外涂层。 WTi层和金刚石基底之间的界面包括足够的金属碳化物组分以提供粘附。一旦涂覆有WTi层和保护外涂层，双涂层金刚石插入件可以在制造环境中使用标准钎焊而无需真空炉或特殊气氛将其钎焊到工具衬底。还公开了一种用于制造金刚石刀片的方法。将金刚石刀片涂覆并在无氧和无氮气氛中进行热处理，以在金刚石涂层界面处形成金属碳化物。

5. 发明授权

US5328715A Process for making metallized vias in diamond substrates 失效
标题翻译：在金刚石基底中制作金属化通孔的工艺
公开(公告)号：US5328715A
公开(公告)日：1994-07-12
申请号：US16367
申请日：1993-02-11
申请人： Charles D. Iacovangelo , Elihu C. Jerabek , Ronald H. Wilson , Peter C. Schaefer
发明人： Charles D. Iacovangelo , Elihu C. Jerabek , Ronald H. Wilson , Peter C. Schaefer
IPC分类号： B23K26/00 , C23C16/04 , C23C16/06 , C30B29/04 , C30B33/00 , H01L21/28 , H01L21/48 , H01L23/14 , H05K1/03 , H05K3/40 , B05D5/12
CPC分类号： C23C16/045 , H01L21/486 , H01L23/14 , H01L2924/0002 , H05K1/0306 , H05K3/4076
摘要： A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.
摘要翻译：公开了一种在金刚石基底中制造金属化通孔的方法。该方法包括在CVD金刚石基底中激光钻孔多个孔，并通过低压CVD沉积在孔中的钨或类似难熔金属，以提供基本无空隙的金属化通孔。还公开了具有金属化通孔的金刚石基底。这些结构对于制作高速率计算机的多芯片模块是有用的。

6. 发明授权

US5382758A Diamond substrates having metallized vias 失效
标题翻译：具有金属化通孔的金刚石基底
公开(公告)号：US5382758A
公开(公告)日：1995-01-17
申请号：US188877
申请日：1994-01-31
申请人： Charles D. Iacovangelo , Elihu C. Jerabek , Ronald H. Wilson , Peter C. Schaefer
发明人： Charles D. Iacovangelo , Elihu C. Jerabek , Ronald H. Wilson , Peter C. Schaefer
IPC分类号： B23K26/00 , C23C16/04 , C23C16/06 , C30B29/04 , C30B33/00 , H01L21/28 , H01L21/48 , H01L23/14 , H05K1/03 , H05K3/40 , H05K1/00
CPC分类号： C23C16/045 , H01L21/486 , H01L23/14 , H01L2924/0002 , H05K1/0306 , H05K3/4076
摘要： A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.
摘要翻译：公开了一种在金刚石基底中制造金属化通孔的方法。该方法包括在CVD金刚石基底中激光钻孔多个孔，并通过低压CVD沉积在孔中的钨或类似难熔金属，以提供基本无空隙的金属化通孔。还公开了具有金属化通孔的金刚石基底。这些结构对于制作高速率计算机的多芯片模块是有用的。

7. 发明授权

US5336368A Method for depositing conductive metal traces on diamond 失效
标题翻译：在金刚石上沉积导电金属痕迹的方法
公开(公告)号：US5336368A
公开(公告)日：1994-08-09
申请号：US87300
申请日：1993-07-08
申请人： Charles D. Iacovangelo , Elihu C. Jerabek , Bradley E. Williams
发明人： Charles D. Iacovangelo , Elihu C. Jerabek , Bradley E. Williams
IPC分类号： C23C14/14 , C23C14/02 , C23C14/04 , C23C14/18 , C23C16/26 , C23C16/27 , H05K1/03 , H05K3/14 , H05K3/38 , B44C1/22 , C23F1/00
CPC分类号： C23C14/025 , C23C14/04 , C23C14/185 , H05K1/0306 , H05K3/143 , H05K3/38
摘要： Adherent traces of a carbide-forming conductive metal are produced on a diamond surface, without deposition of carbide in areas to be non-conductive, by depositing an undercoat layer of a non-carbide-forming metal such as palladium, patterning said undercoat layer and then depositing a bond layer of the carbide-forming metal. The undercoat layer and the portion of the bond layer deposited thereon are then removed, typically by etching.
摘要翻译：通过沉积非碳化物形成金属如钯的底涂层，图案化所述底涂层和图形化所述底涂层，在金刚石表面上产生碳化物形成导电金属的粘附迹线，而不会在不导电的区域中沉积碳化物然后沉积碳化物形成金属的接合层。通常通过蚀刻去除底涂层和沉积在其上的结合层的部分。

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