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1. 发明授权

US07843702B2 Printed circuit board having embedded RF module power stage circuit 失效
标题翻译：具有嵌入式RF模块功率级电路的印刷电路板
公开(公告)号：US07843702B2
公开(公告)日：2010-11-30
申请号：US12437042
申请日：2009-05-07
申请人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号： H05K1/18
CPC分类号： H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要： Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
摘要翻译：这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘，将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接垂直于电源平面，从而减小RF模块的尺寸并提高其性能。

2. 发明申请

US20090268419A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT 失效
公开(公告)号：US20090268419A1
公开(公告)日：2009-10-29
申请号：US12436996
申请日：2009-05-07
申请人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号： H05K7/12
CPC分类号： H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要： Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

3. 发明申请

US20090268418A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT 失效
标题翻译：具有嵌入式RF模块电源电路的印刷电路板
公开(公告)号：US20090268418A1
公开(公告)日：2009-10-29
申请号：US12437042
申请日：2009-05-07
申请人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号： H05K1/18
CPC分类号： H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要： Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
摘要翻译：这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘，将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接垂直于电源平面，从而减小RF模块的尺寸并提高其性能。

4. 发明授权

US07663892B2 Printed circuit board having embedded RF module power stage circuit 失效
公开(公告)号：US07663892B2
公开(公告)日：2010-02-16
申请号：US11449408
申请日：2006-06-07
申请人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号： H05K1/18
CPC分类号： H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要： Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

5. 发明授权

US08068347B2 Printed circuit board having embedded RF module power stage circuit 失效
标题翻译：具有嵌入式RF模块功率级电路的印刷电路板
公开(公告)号：US08068347B2
公开(公告)日：2011-11-29
申请号：US12436996
申请日：2009-05-07
申请人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
发明人： Don Chul Choi , Jae Cheol Ju , Dong Hwan Lee , Sang Soo Park , Hee Soo Yoon
IPC分类号： H05K1/16
CPC分类号： H05K1/023 , H01L24/24 , H01L24/82 , H01L2224/24226 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0233 , H05K1/112 , H05K1/16 , H05K1/162 , H05K3/4611 , H05K2201/09309 , H05K2201/09454 , H05K2201/09718 , H05K2201/10022 , H05K2201/1003 , H01L2924/00
摘要： Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
摘要翻译：这里公开了具有嵌入其中的RF模块功率级电路的印刷电路板。具体地说，本发明涉及一种具有嵌入其中的RF模块功率级电路的印刷电路板，其中在多层有线电路板的电源平面上限定或形成用于电阻器，焊道或电感器的端子焊盘，将电阻器，焊道或电感器连接到电源平面，并且电阻器，焊道或电感器通过使用通孔或通过嵌入电阻器，焊道或电感器而与去耦电容器并联连接垂直于电源平面，从而减小RF模块的尺寸并提高其性能。

6. 发明申请

US20130169399A1 THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME 有权
公开(公告)号：US20130169399A1
公开(公告)日：2013-07-04
申请号：US13417832
申请日：2012-03-12
申请人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
发明人： Young Seuck YOO , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
IPC分类号： H01F27/28 , B05D5/12
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/29 , H01F41/042 , H01F2027/2809
摘要： There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.

7. 发明授权

US08351180B1 Multilayer ceramic capacitor 有权
标题翻译：多层陶瓷电容器
公开(公告)号：US08351180B1
公开(公告)日：2013-01-08
申请号：US13531237
申请日：2012-06-22
申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
发明人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
IPC分类号： H01G4/06
CPC分类号： H01G4/12 , H01G4/012 , H01G4/30
摘要： There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA1/CA1) of MA1 to CA1 is between 0.07 and 0.20, wherein CA1 represents an area of the multilayer body in a cross section of the multilayer body taken in a length and thickness direction, and MA1 represents an area of a first margin part in the cross section of the multilayer body taken in the length and thickness direction, the first margin part being a portion of the multilayer body, other than a first capacitance forming part thereof in which the first and second inner electrodes overlap in the thickness direction.
摘要翻译：提供了一种多层陶瓷电容器，包括：多层体，其中多个电介质层在厚度方向上堆叠; 以及形成在所述多层体内并且包括彼此相对设置的第一和第二内部电极的内部电极层; 其中MA1与CA1的比率（MA1 / CA1）在0.07和0.20之间，其中CA1表示在长度和厚度方向上取下的多层体的横截面中的多层体的面积，MA1表示第一边缘部分是沿着长度和厚度方向截取的第一边缘部分，第一边缘部分是多层体的一部分，除了第一电容形成部分之外，第一和第二内部电极在其中重叠厚度方向。

8. 发明授权

US08315034B2 Multilayer chip capacitor with improved equivalent series resistance 有权
标题翻译：具有改善等效串联电阻的多层片式电容器
公开(公告)号：US08315034B2
公开(公告)日：2012-11-20
申请号：US12245856
申请日：2008-10-06
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/06 , H01G4/38
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR1) of the first capacitor part and the equivalent series resistance (ESR2) of the second capacitor part satisfy ERS1≧20 mΩ and 0.7(ESR1)≦ESR2≦1.3(ESR1).
摘要翻译：多层片状电容器包括电容器本体，其包括第一电容器部分和第二电容器部分，分别形成在电容器主体的第一和第二长侧面上的第一和第二外部电极，以及分别形成在第一和第二电极部分上的第三和第四外部电极电容器主体的较短侧面。第一电容器部分包括具有相反极性的第一和第二内部电极，并且第二电容器部分包括具有相反极性的第三和第四内部电极。第一至第四内部电极各有一个引线。第一至第四外部电极分别连接到第一至第四内部电极的引线。第一电容器部分的串联谐振频率与第二电容器部分的串联谐振频率不同。第一电容器部分的等效串联电阻（ESR1）和第二电容器部分的等效串联电阻（ESR2）满足ERS1≥20m＆OHgr; 和0.7（ESR1）＆nlE; ESR2＆N1; 1.3（ESR1）。

9. 发明授权

US08184425B2 Multilayer capacitor 有权
标题翻译：多层电容器
公开(公告)号：US08184425B2
公开(公告)日：2012-05-22
申请号：US12238796
申请日：2008-09-26
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/005 , H01G4/20
CPC分类号： H01G4/228
摘要： There is provided a multilayer capacitor including: a capacitor body where a plurality of dielectric layers are laminated, the capacitor body including first and second surfaces opposing each other in a laminated direction, wherein the first surface provides a mounting surface; a plurality of first and second inner electrodes; an inner connecting conductor; and a plurality of first and second outer electrodes formed on an outer surface of the body, wherein a corresponding one of the outer electrodes having identical polarity to the inner connecting conductor includes at least one outer terminal formed on the first surface of the body to connect to the inner connecting conductor, and at least one outer connecting conductor formed on the second surface of the body to connect a corresponding one of the inner electrodes of identical polarity to the inner connecting conductor.
摘要翻译：提供了一种层叠电容器，其包括：层叠多个电介质层的电容器体，所述电容器主体包括在层叠方向上彼此相对的第一和第二表面，其中所述第一表面提供安装表面; 多个第一和第二内部电极; 内连接导体; 以及形成在所述主体的外表面上的多个第一外部电极和第二外部电极，其中与所述内部连接导体具有相同极性的相应的外部电极包括形成在所述主体的所述第一表面上的至少一个外部端子，以连接内部连接导体和形成在主体的第二表面上的至少一个外部连接导体，以将相当极性的相应的一个内部电极与内部连接导体相连接。

10. 发明授权

US07817007B2 Laminated inductor 有权
标题翻译：层压电感
公开(公告)号：US07817007B2
公开(公告)日：2010-10-19
申请号：US12194935
申请日：2008-08-20
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hyeog Soo Shin , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F3/14 , H01F17/04
摘要： There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.
摘要翻译：提供一种层叠电感器，包括：层叠有多个磁性层的主体; 形成在所述磁性层上的线圈部分，所述线圈部分包括多个导体图案和多个导电通孔; 第一外部电极和第二外部电极分别形成在主体的外表面上以连接到线圈部分的两端; 以及形成在至少一个磁性层上的非磁性导体，以便缓和由直流电流流过线圈部分的磁饱和。层叠电感器在制造工艺中使用非磁性导体作为非磁性间隙进行简化，并有效地改善了DC叠加特性。

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