会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • Method of grinding wafer
    • 研磨方法
    • JP2009094326A
    • 2009-04-30
    • JP2007264172
    • 2007-10-10
    • Disco Abrasive Syst Ltd株式会社ディスコ
    • KAJIYAMA KEIICHIMASUDA TAKATOSHIWATANABE SHINYAAOKI SHIGEHIKOHOSHIKAWA HIROTOSHIKOBAYASHI YOSHIKAZUHARADA SEISHIYAMAMOTO SETSUO
    • H01L21/304B24B7/22
    • B24D7/18B24B1/00B24B7/228
    • PROBLEM TO BE SOLVED: To produce the gettering effect without reducing the bending strength of devices even if the backside of a wafer is ground.
      SOLUTION: In a method of grinding a wafer where the backside of a wafer having a plurality of devices formed on the front surface thereof is ground and free movement of heavy metal is suppressed and the bending strength of the devices is maintained at ≥1,000 MPa by the gettering effect, a grinding wheel to be used in the method has such a configuration that a grinding stone is firmly fixed to the free end of a base, the grinding stone being such that diamond abrasive grains having a grain diameter of ≤1 μm are fastened together using vitrified bond. A protection member is pasted to the front surface of the wafer, and the protection member is held on a chuck table. The grinding wheel is turned by turning the chuck table to grind the backside of the wafer by the grinding stone until an average value of the surface roughness of the backside of the wafer becomes ≤0.003 μm and a distortion layer remaining on the backside of the wafer has a thickness of 0.05 μm.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:即使晶片的背面被研磨,也可以在不降低器件的弯曲强度的情况下产生吸气效果。 解决方案:在研磨晶片的方法中,其中具有形成在其前表面上的多个器件的晶片的背面被研磨并且重金属的自由移动被抑制,并且器件的弯曲强度保持在≥ 通过吸气效果为1000MPa,在该方法中使用的砂轮具有如下结构:磨石牢固地固定在基座的自由端,研磨石使得具有晶粒直径≤ 1微米用玻璃化粘结固定在一起。 保护构件被粘贴到晶片的前表面,并且保护构件保持在卡盘台上。 通过转动卡盘台来研磨砂轮,通过研磨石研磨晶片的背面直到晶片背面的表面粗糙度的平均值变为≤0.003μm,并且残留在晶片背面的失真层 厚度为0.05μm。 版权所有(C)2009,JPO&INPIT
    • 3. 发明专利
    • Grinder
    • 磨床
    • JP2010149222A
    • 2010-07-08
    • JP2008329739
    • 2008-12-25
    • Disco Abrasive Syst Ltd株式会社ディスコ
    • KAKEFUDA MASAKIAOKI SHIGEHIKO
    • B24B53/007B24B7/00B24B41/047H01L21/304
    • PROBLEM TO BE SOLVED: To provide a grinder reducing frequency of dressing of a grinding wheel, causing no scratch on a wafer.
      SOLUTION: The grinder includes a chuck table retaining a workpiece and a grinding means rotatably supporting the grinding wheel that grinds the workpiece retained at the chuck table. The grinding wheel comprises an annular base having a mount attachment part attached to a wheel mount jointed to a tip end of a main spindle, and a plurality of the grinding wheel circularly disposed at a free end part of the annular base. A cleaning means cleaning an outer periphery side face and an inner periphery side face reaching from the mount attachment part to the free end part of the annular base is disposed in the grinder.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了提供减少研磨轮修整频率的研磨机,在晶片上不造成划痕。 解决方案:研磨机包括保持工件的卡盘台和可旋转地支撑研磨保持在卡盘台上的工件的砂轮的研磨装置。 砂轮包括环形基座,其具有连接到连接到主轴的末端的车轮安装件的安装附接部分和环形地设置在环形基座的自由端部处的多个砂轮。 在研磨机中设置有清洁装置,其将从安装附件部分到达环形基座的自由端部的外周侧面和内周侧面清理。 版权所有(C)2010,JPO&INPIT