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    • 3. 发明授权
    • Methods for manufacturing a microstructured sensor
    • 微结构传感器的制造方法
    • US06787047B1
    • 2004-09-07
    • US09707332
    • 2000-11-07
    • Dietmar HahnGottfried FlikAlexandra Jauernig
    • Dietmar HahnGottfried FlikAlexandra Jauernig
    • G01N2700
    • G01N27/07G01K7/186G01N27/226
    • A method for manufacturing a sensor, the sensor including a three-dimensional interdigital electrode arrangement positioned on a substrate, comprising applying a temperature sensing resistor onto the substrate by sputtering a first adhesion layer and a first metallic layer onto the substrate, applying a first resist layer to the first metallic layer, applying and structuring a first resist material on the first metallic layer, and after structuring, etching the first metallic layer in resist free areas; and applying a three-dimensional interdigital electrode arrangement onto the substrate by sputtering a second adhesion layer and a second metallic layer onto the substrate, applying and structuring a second resist material only to second metal layer, after the structuring, etching the second metallic layer in resist free areas to form valleys, and after etching the second metallic layer, applying an electroplating layer.
    • 一种用于制造传感器的方法,所述传感器包括位于基板上的三维交指电极装置,包括通过将第一粘合层和第一金属层溅射到所述基板上而将温度感测电阻施加到所述基板上,施加第一抗蚀剂 层到第一金属层,在第一金属层上施加和构造第一抗蚀剂材料,并且在构造之后,在无抗蚀剂区域中蚀刻第一金属层; 以及通过将第二粘合层和第二金属层溅射到所述基板上将三维交指电极布置施加到所述基板上,在所述结构化之后,将所述第二金属层施加并构造为仅在第二金属层上, 抵抗自由区以形成谷,并且在蚀刻第二金属层之后,施加电镀层。