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    • 1. 发明授权
    • Method for operating an MRAM semiconductor memory configuration
    • 用于操作MRAM半导体存储器配置的方法
    • US06807089B2
    • 2004-10-19
    • US10685082
    • 2003-10-14
    • Dietmar GoglTill Schloesser
    • Dietmar GoglTill Schloesser
    • G11C1100
    • G11C11/15
    • In a method for operating an MRAM semiconductor memory configuration, for the purpose of reading an item of stored information, reversible magnetic changes are made to the TMR cell and a current that is momentarily altered as a result is compared with the original read signal. As a result, the TMR memory cell itself can serve as a reference, even though the information in the TMR memory cell is not destroyed, i.e. writing-back does not have to be effected. The method can preferably be applied to an MRAM memory configuration in which a plurality of TMR cells are connected, in parallel, to a selection transistor and in which there is a write line which is not electrically connected to the memory cell.
    • 在用于操作MRAM半导体存储器配置的方法中,为了读取存储的信息的项目,对TMR单元进行可逆的磁性改变,并且将与暂时改变的电流作为结果与原始读取信号进行比较。 结果,TMR存储单元本身可以用作参考,即使TMR存储单元中的信息不被破坏,即不需要进行回写。 该方法可以优选地应用于其中多个TMR单元并联连接到选择晶体管并且其中存在没有电连接到存储器单元的写入线的MRAM存储器配置。
    • 3. 发明授权
    • Method of forming conductive contacts on a semiconductor device with embedded memory and the resulting device
    • 在具有嵌入式存储器的半导体器件上形成导电触点的方法以及所得到的器件
    • US09034753B2
    • 2015-05-19
    • US13164272
    • 2011-06-20
    • Till SchloesserPeter Baars
    • Till SchloesserPeter Baars
    • H01L21/4763H01L27/108H01L21/768
    • H01L27/10894H01L21/76816H01L21/76895H01L27/10814H01L27/10855H01L27/10888
    • A method is disclosed that includes forming a conductive logic contact in a logic area of a semiconductor device, forming a bit line contact and a capacitor contact in a memory array of the semiconductor device, and performing at least one first common process to form a first metallization layer comprising a first conductive line in the logic area that is conductively coupled to the conductive logic contact and a bit line in the memory array that is conductively coupled to the bit line contact. The method further includes performing at least one second common process to form a second metallization layer comprising a first conductive structure conductively coupled to the first conductive line in the logic area and a second conductive structure in the memory array that that is conductively coupled to the capacitor contact.
    • 公开了一种方法,其包括在半导体器件的逻辑区域中形成导电逻辑触点,在半导体器件的存储器阵列中形成位线接触和电容器触点,以及执行至少一个第一公共工艺以形成第一 金属化层包括在逻辑区域中的导电耦合到导电逻辑触点的第一导线和存储器阵列中与导线耦合到位线触点的位线。 所述方法还包括执行至少一个第二公共处理以形成第二金属化层,所述第二金属化层包括导电耦合到所述逻辑区域中的所述第一导电线的第一导电结构和所述存储器阵列中的导电耦合到所述电容器的第二导电结构 联系。
    • 8. 发明授权
    • Transistor and memory cell array
    • 晶体管和存储单元阵列
    • US07956387B2
    • 2011-06-07
    • US11517558
    • 2006-09-08
    • Till Schloesser
    • Till Schloesser
    • H01L26/66H01L21/02
    • H01L27/10891H01L27/10823H01L27/10876H01L27/11507
    • A transistor, which is formed in a semiconductor substrate having a top surface, includes first and second source/drain regions, a channel connecting the first and second source/drain regions, and a gate electrode for controlling an electrical current flowing in the channel. The gate electrode is disposed in a lower portion of a gate groove defined in the top surface of the semiconductor substrate. The upper portion of the groove is filled with an insulating material. The channel includes a fin-like portion in the shape of a ridge having a top side and two lateral sides in a cross-section perpendicular to a direction defined by a line connecting the first and second source/drain regions. The gate electrode encloses the channel at the top side and the two lateral sides thereof.
    • 形成在具有顶表面的半导体衬底中的晶体管包括第一和第二源极/漏极区域,连接第一和第二源极/漏极区域的沟道以及用于控制在沟道中流动的电流的栅电极。 栅电极设置在限定在半导体衬底的顶表面中的栅极沟槽的下部。 槽的上部填充有绝缘材料。 通道包括脊形状的翅片状部分,其具有垂直于由连接第一和第二源极/漏极区域的线限定的方向的横截面中的顶侧和两个侧面。 栅电极在其顶侧和其两个侧面包围通道。
    • 10. 发明授权
    • Method for fabricating a memory cell arrangement with a folded bit line arrangement and corresponding memory cell arrangement with a folded bit line arrangement
    • 用于制造具有折叠位线布置的存储单元布置和具有折叠位线布置的相应存储单元布置的方法
    • US07772631B2
    • 2010-08-10
    • US11493082
    • 2006-07-26
    • Till Schloesser
    • Till Schloesser
    • H01L27/108
    • H01L27/10891H01L27/10852H01L27/10897
    • An integrated circuit includes a memory cell arrangement with a plurality of active regions along a first direction, a plurality of parallel buried word lines (BWL) along a second direction, a plurality of parallel bitlines along a third direction, and a plurality of storage capacitors. The BWLs run through the active regions. Two of the BWLs are spaced apart from one another and from isolation trenches running through a respective active region, the BWLs being insulated from a channel region by a gate dielectric. The bit lines run perpendicular to the second direction, wherein each bit line makes contact with the relevant source region of the associated active region. The first direction lies between the second and third directions. Storage capacitors are connected to associated drain regions in a respective active region.
    • 集成电路包括具有沿着第一方向的多个有源区的存储单元布置,沿着第二方向的多个并行掩埋字线(BWL),沿着第三方向的多个平行位线,以及多个存储电容器 。 BWL运行在活动区域​​。 BWL中的两个彼此间隔开,并且从穿过相应的有源区域的隔离沟槽间隔开,BWL通过栅极电介质与沟道区域绝缘。 位线垂直于第二方向延伸,其中每个位线与相关联的有源区域的相关源极区域接触。 第一个方向在第二和第三个方向之间。 存储电容器连接到相应的有源区域中的相关联的漏极区域。