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    • 2. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US5764673A
    • 1998-06-09
    • US937152
    • 1997-09-25
    • Zempei KawazuNorio HayafujiDiethard Marx
    • Zempei KawazuNorio HayafujiDiethard Marx
    • H01L33/00H01L33/12H01L33/14H01L33/32H01L33/34H01S5/00H01S5/02H01S5/042H01S5/323H01S3/19H01L31/0256
    • H01S5/32341H01L33/007H01S2301/173H01S2304/04H01S5/0202H01S5/021H01S5/2231
    • A semiconductor light emitting device includes an Si substrate having opposed front and rear surfaces; an amorphous or polycrystalline first buffer layer disposed on the front surface of the Si substrate; and GaN series compound semiconductor layers successively disposed on the first buffer layer and including a light emitting region where light is produced by recombination of electrons and holes. In this light emitting device, since the Si substrate is cleavable, it is possible to produce resonator facets by cleaving. In addition, since the Si substrate is electrically conductive, a structure in which a pair of electrodes are respectively located on opposed upper and lower surfaces of the light emitting device is realized. Further, since the Si substrate is inexpensive, the light emitting device is obtained at low cost. Furthermore, since the amorphous or polycrystalline first buffer layer is disposed on the Si substrate, in the initial state of the growth of the GaN series compound semiconductor layers, plenty of growth nuclei are created, and the growth nuclei promote two-dimensional growth. As a result, high-quality GaN series compound semiconductor layers are obtained.
    • 半导体发光器件包括具有相对的前表面和后表面的Si衬底; 设置在Si衬底的前表面上的非晶或多晶第一缓冲层; 以及连续配置在第一缓冲层上的GaN系化合物半导体层,具有通过电子和空穴的复合产生光的发光区域。 在该发光器件中,由于Si衬底是可切割的,所以可以通过切割产生谐振器面。 此外,由于Si衬底是导电的,所以实现了一对电极分别位于发光器件的相对的上表面和下表面上的结构。 此外,由于Si基板便宜,所以以低成本获得发光器件。 此外,由于非晶或多晶第一缓冲层设置在Si衬底上,在GaN系化合物半导体层的生长的初始状态下,产生大量的生长核,并且生长核促进二维生长。 结果,获得了高质量的GaN系化合物半导体层。
    • 3. 发明授权
    • Heteroepitaxial semiconductor device including silicon substrate, GaAs
layer and GaN layer #13
    • 包括硅衬底,GaAs层和GaN层的异质外延半导体器件
    • US5760426A
    • 1998-06-02
    • US680850
    • 1996-07-16
    • Diethard MarxZempei KawazuNorio Hayafuji
    • Diethard MarxZempei KawazuNorio Hayafuji
    • H01L21/203H01L21/205H01L29/201H01L29/267H01L33/12H01L33/16H01L33/32H01L33/34H01S5/00H01S5/323H01L29/26
    • H01L29/267H01L29/201H01L33/007
    • A semiconductor device includes an Si substrate, a stress absorbing layer of GaAs and disposed on the Si substrate, a buffer layer having a composition of Al.sub.x Ga.sub.1-x-y In.sub.y N (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) and disposed on the stress absorbing layer, and a compound semiconductor layer having a composition of Al.sub.x Ga.sub.1-x-y In.sub.y N (0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1) and disposed on the buffer layer. Therefore, the buffer layer protects the GaAs stress absorbing layer from high temperatures during the formation of the compound semiconductor layer, whereby the stress absorbing layer is prevented from decomposition. As a result, a stress due to lattice mismatch or thermal stress between the Si substrate and the compound semiconductor layer is absorbed in the GaAs stress absorbing layer having a lowest bulk modulus, whereby a compound semiconductor layer with reduced dislocations may be grown on the buffer layer and bending of the Si substrate prevented.
    • 半导体器件包括Si衬底,GaAs的应力吸收层,并且设置在Si衬底上,具有Al x Ga 1-x-y In y N(0≤x≤1,0< / = 1)并且设置在应力吸收层上,以及具有Al x Ga 1-x-y In y N(0≤x≤1,0≤y≤1)组成的化合物半导体层并且被置于 缓冲层。 因此,缓冲层在形成化合物半导体层期间保护GaAs应力吸收层免受高温的影响,防止应力吸收层分解。 结果,在Si衬底和化合物半导体层之间由于晶格失配或热应力引起的应力被吸收在具有最低体积弹性模量的GaAs应力吸收层中,从而可以在缓冲区上生长具有减少的位错的化合物半导体层 防止了Si衬底的层和弯曲。