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1. 发明专利

JP2015025198A 無電解めっき用触媒、これを用いた金属皮膜及びその製造方法有权
标题翻译：电解镀层催化剂，使用其的金属膜和制造金属膜的方法
公开(公告)号：JP2015025198A
公开(公告)日：2015-02-05
申请号：JP2014115146
申请日：2014-06-03
申请人： Dic株式会社 , Dic Corp , Dic株式会社 , 奥野製薬工業株式会社 , Okuno Chem Ind Co Ltd
发明人： FUKAZAWA NORIMASA , SHINBAYASHI AKITA , SEKINE NOBUHIRO , SANO YOSHIYUKI , MORIWAKI MASAYUKI , KAWAMURA KAORI , OTSUKA KUNIAKI , KYO TOSHIYUKI , MORIGUCHI TOMO
IPC分类号： C23C18/30 , B01J31/06 , B01J37/02
CPC分类号： C23C18/31 , B01J31/06 , B01J31/26 , B01J31/28 , C23C18/1633 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/38 , H05K3/181
摘要：【課題】少ない工程数で、有用な被めっき物に対して、一般的なカチオン化表面処理を施した後、単純な浸漬操作のみで充分な吸着量を示し、かつ触媒活性を発現する、安定性に優れた無電解めっき用触媒、及び、当該無電解めっき用触媒を用いた金属皮膜の製造方法を提供すること。【解決手段】カルボキシ基、リン酸基、亜リン酸基、スルホン酸基、スルフィン酸基及びスルフェン酸基からなる群から選ばれる1種以上のアニオン性官能基を有する(メタ)アクリル酸系単量体を含有する単量体混合物を重合してなる化合物と、金属ナノ粒子との複合体である無電解めっき用触媒、ならびに、前記無電解めっき用触媒を用いて得られる金属皮膜。【選択図】図1
摘要翻译：要解决的问题：提供一种稳定性优异的化学镀催化剂，其能够仅通过简单的浸渍操作显示出足够的吸附量，并且在通过阳离子化表面处理进行通常的阳离子化表面处理后，以少量的步骤以及使用该化学镀催化剂制造金属膜的方法。溶液：化学镀催化剂是通过使包含具有一种或多种阴离子官能团的（甲基）丙烯酸系单体的单体混合物聚合而得到的化合物的复合体与选自羧基，磷酸基，亚磷酸基，磺酸基，亚磺酸基和亚磺酸基的基团的基团与金属纳米粒子。使用化学镀催化剂获得金属膜。

2. 发明专利

JP2007126745A Posttreatment agent for etching treatment with chromic acid-sulfuric acid mixed liquid 有权
标题翻译：用色氨酸 - 硫酸混合液进行蚀刻处理的处理剂
公开(公告)号：JP2007126745A
公开(公告)日：2007-05-24
申请号：JP2006247671
申请日：2006-09-13
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： SATO KAZUYA , IMAMURA MAKOTO , OTSUKA KUNIAKI , KITA KOJI
IPC分类号： C23C18/24 , C23C18/40
摘要： PROBLEM TO BE SOLVED: To provide a new treatment agent, in a plating treatment method including an etching stage with a chromic acid-sulfuric acid mixed liquid, which has a stable neutralization action to the chromic acid comprised in the etching treatment liquid, and also can exhibit excellent catalyst sticking capacity to various resin moldings.
SOLUTION: The posttreatment agent for etching treatment with a chromium acid-sulfuric acid mixed liquid is composed of an aqueous solution comprising an amine compound. In the plating method to a resin molding, a resin molding is subjected to etching treatment using a chromic acid-sulfuric acid mixed liquid, thereafter, the resin molding is brought into contact with the above posttreatment agent, subsequently, catalyst application and electroless plating are performed, and further, electroplating is performed as necessary.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供新的处理剂，在包括对铬酸 - 硫酸混合液的蚀刻阶段的电镀处理方法中，其对腐蚀处理液中包含的铬酸具有稳定的中和作用，并且还可以对各种树脂模制品显示出优异的催化剂粘附能力。解决方案：用铬酸 - 硫酸混合液进行蚀刻处理的后处理剂由含有胺化合物的水溶液构成。在树脂成形体的电镀法中，使用铬酸 - 硫酸混合液对树脂成型体进行蚀刻处理，然后使树脂成型体与上述后处理剂接触，接着，催化剂涂布和无电镀并进一步根据需要进行电镀。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006161109A Electroless cobalt plating solution and electroless cobalt plating method 审中-公开
标题翻译：电镀钴镀层溶液和电镀钴镀层法
公开(公告)号：JP2006161109A
公开(公告)日：2006-06-22
申请号：JP2004355266
申请日：2004-12-08
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： IRIE AYUMI , NAITO KAZUHISA , OTSUKA KUNIAKI
IPC分类号： C23C18/36
摘要： PROBLEM TO BE SOLVED: To provide a new electroless cobalt plating solution which has excellent stability and can form a uniform electroless cobalt plating film.
SOLUTION: The electroless cobalt plating solution is composed of an aqueous solution containing (1) a water-soluble cobalt compound, (2) a water-soluble hypophosphorous acid compound, (3) at least one aliphatic carboxylic acid selected from the group consisting of aliphatic dicarboxylic acid, aliphatic tricarboxylic acid, aminocarboxylic acid, and their salts, and (4) at least one inorganic additive selected from the group composed of ammonium sulfate, ammonium chloride, boric acid and borax.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有优异的稳定性并且可以形成均匀的无电镀钴电镀膜的新的无电镀钴电镀溶液。解决方案：无电镀钴溶液由含有（1）水溶性钴化合物的水溶液，（2）水溶性次磷酸化合物，（3）至少一种脂肪族羧酸组成，由脂肪族二羧酸，脂肪族三羧酸，氨基羧酸及其盐组成的组，和（4）至少一种选自硫酸铵，氯化铵，硼酸和硼砂的无机添加剂。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005307227A Tin-copper alloy plating liquid 有权
标题翻译：钛铜合金液体
公开(公告)号：JP2005307227A
公开(公告)日：2005-11-04
申请号：JP2004122110
申请日：2004-04-16
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： OTSUKA KUNIAKI , SATO KAZUYA , KAJIMOTO HIROYUKI , NAGAO TOSHIMITSU
IPC分类号： C25D3/60
摘要： PROBLEM TO BE SOLVED: To provide a low cost tin-copper alloy plating liquid which can form a plating film having a satisfactory gloss, and reduces discoloration in the plating film after a reflow treatment.
SOLUTION: The tin-copper alloy plating liquid is composed of an aqueous solution comprising stannous sulfate, copper sulfate, sulfuric acid, chloride, an aromatic carbonyl compound and a surfactant as effective components.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够形成具有令人满意的光泽度的镀膜的低成本锡 - 铜合金电镀液，并且在回流处理后减少镀膜中的变色。解决方案：锡 - 铜合金电镀液由含硫酸亚锡，硫酸铜，硫酸，氯化物，芳族羰基化合物和表面活性剂作为有效成分的水溶液组成。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005298899A Pretreatment method for electroless plating on resin molded body 审中-公开
标题翻译：树脂模塑体电镀的预处理方法
公开(公告)号：JP2005298899A
公开(公告)日：2005-10-27
申请号：JP2004116892
申请日：2004-04-12
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： NAGAO TOSHIMITSU , SATO KAZUYA , OTSUKA KUNIAKI
IPC分类号： C23C18/20
摘要： PROBLEM TO BE SOLVED: To provide a method capable of depositing a plating film having high adhesiveness without performing etching with acid containing heavy metal such as chromic acid on a resin molded body having sufficient performance when used for car parts.
SOLUTION: In a pretreatment method for electroless plating on a resin molded body, the resin molded body molded of a resin element containing polyamide resin and styrenic resin is brought into contact with alkaline aqueous solution of ≥ pH 8, and further brought into contact with aqueous solution containing inorganic acid.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够在用于汽车部件的情况下，在具有足够性能的树脂成型体上进行具有高粘附性的镀膜的沉积的方法，而不进行含有重金属如酸的酸的蚀刻。解决方案：在树脂成型体上进行无电解电镀的预处理方法中，将由含有聚酰胺树脂和苯乙烯树脂的树脂成分成型的树脂成型体与≥8的碱性水溶液接触，进一步进入与含有无机酸的水溶液接触。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2003342042A Production method for glass-made optical part and optical part-mounted module using the same 审中-公开
标题翻译：用于玻璃制造的光学部件的制造方法和使用其的光学部件安装的模块
公开(公告)号：JP2003342042A
公开(公告)日：2003-12-03
申请号：JP2002150437
申请日：2002-05-24
申请人： Hitachi Maxell Ltd , Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社 , 日立マクセル株式会社
发明人： DAIMON HIDEO , SAKAMOTO AKITO , OTSUKA KUNIAKI
IPC分类号： C03C17/10 , C03C15/00 , C03C27/04 , C23C18/18 , C23C18/31 , C23C18/32 , C23C18/42
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a glass-made optical part wherein only the side surface is plated in order to strongly fixing and bonding the glass- made optical part onto a silicon optical bench without detriment to light transmittance of the optical part; and an optical part-mounted module using the same.
SOLUTION: After cut at a high temperature, rod-like glass which is pretreated with a cationic surfactant solution and carries a Pd catalyst added thereto is treated with an aqueous solution of hydrochloric acid followed by the treatment with an aqueous solution of caustic soda to reactivate the Pd catalyst; then, only the side surface through which light does not pass is electroplated.
COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了提供一种玻璃制成的光学部件的制造方法，其中只有侧面被镀覆以便将玻璃制成的光学部件牢固地固定和粘合到硅光学工作台上而不损害透光率的光学部件; 以及使用其的光学部件安装模块。解决方案：高温切割后，用盐酸水溶液处理用阳离子表面活性剂溶液预处理并载有Pd催化剂的棒状玻璃，然后用苛性碱水溶液处理苏打水重新活化Pd催化剂; 那么只有光通过的侧表面是电镀的。版权所有（C）2004，JPO

7. 发明专利

JP2011233496A Conductive paste and conductive pattern 有权
标题翻译：导电胶和导电图案
公开(公告)号：JP2011233496A
公开(公告)日：2011-11-17
申请号：JP2010229969
申请日：2010-10-12
申请人： Okuno Chem Ind Co Ltd , Taiyo Holdings Co Ltd , 太陽ホールディングス株式会社 , 奥野製薬工業株式会社
发明人： SUZUKI NOBUYUKI , ITO HIDEYUKI , TAKAGI KOICHI , OKITSU SATOSHI , TOKAI HIROYUKI , MURATA MICHIKO , TAKANO KOJI , MURAHASHI KOICHIRO , OTSUKA KUNIAKI
IPC分类号： H01B1/22 , H01B5/14 , H01J9/02 , H01J11/02 , H01J11/22 , H01J11/34
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste enabling formation of an address electrode superior in acid resistance and a conductive pattern superior in acid resistance.SOLUTION: The conductive paste contains organic binder and inorganic component having conductive powder and glass frit including at least any of bismuth oxide, silica, boron oxide, zirconia, and titania, RO (RO is at least one kind selected from BeO, MgO, CaO, BaO, and SrO, and RO (RO is at least one kind selected from LiO, NaO, KO, RbO, and CsO).
摘要翻译：要解决的问题：提供能够形成耐酸性优异的地址电极和耐酸性优异的导电图案的导电糊。导电糊包含有机粘合剂和具有导电粉末和玻璃料的无机组分，其包括氧化铋，二氧化硅，氧化硼，氧化锆和二氧化钛中的至少一种，RO（RO是至少一种选自BeO， MgO，CaO，BaO和SrO，并且R 0是选自Li x的至少一种， SB POS =“POST”> 2 O，Na 2 O，K 2 O，Rb 2 O，Cs 2 O）。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2010057429A Method for sterilizing food 审中-公开
标题翻译：消毒食品的方法
公开(公告)号：JP2010057429A
公开(公告)日：2010-03-18
申请号：JP2008226998
申请日：2008-09-04
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： IMAMURA TETSUYA , OTSUKA KUNIAKI , FUJIKAMI ASAO
IPC分类号： A23L3/3481 , A23L3/3508 , A23L3/358
CPC分类号： Y02A40/943
摘要： PROBLEM TO BE SOLVED: To provide a method for sterilizing food, excellent in safety, workability and sterilization effect.
SOLUTION: The method for sterilizing food includes a process of preparing a sterilization solution by mixing chlorite, organic acid and metal catalyst in an aqueous solution, and a process of bringing the sterilization solution into contact with the food. The organic acid is preferably citric acid and/or phytic acid. The sterilization solution is easily rapidly prepared, and is useful for sterilizing the food owing to leaving no chlorine smell in the food and damaging no appearance of the food.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供食品消毒方法，安全性，可加工性和灭菌效果优异。解决方案：食品消毒方法包括通过在水溶液中混合亚氯酸盐，有机酸和金属催化剂以及使灭菌溶液与食物接触的方法来制备灭菌溶液的方法。有机酸优选为柠檬酸和/或植酸。杀菌溶液容易快速制备，并且由于在食品中不留下氯气味而对食物进行消毒是有用的，并且不会损害食物的外观。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2007100174A Pretreatment method for plating to styrene-based resin molded body 审中-公开
标题翻译：用于固化苯乙烯树脂模制体的预处理方法
公开(公告)号：JP2007100174A
公开(公告)日：2007-04-19
申请号：JP2005292368
申请日：2005-10-05
申请人： Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
发明人： OTSUKA KUNIAKI , MAEDA TAKEAKI
IPC分类号： C23C18/22 , C23C18/24 , C25D5/56
摘要： PROBLEM TO BE SOLVED: To provide a new pretreatment method for plating where a plating film having high adhesion to a resin molded body composed of a polystyrene-based resin or a polystyrene-based alloy resin can be formed, and further, a permanganate water solution used as an etching treatment solution can be continuously used stably over a long period.
SOLUTION: The pretreatment method for plating to a resin molded body composed of a polystyrene-based resin or a polystyrene-based alloy resin as a resin component comprises the following stages (1) to (3): the stage (1) where a water-dispersed solution or a water solution comprising a specified organic compound is brought into contact with the resin molded body; the stage (2) where the resin molded body treated in the stage (1) is brought into contact with a water solution comprising a permanganate; and the stage (3) where the resin molded body treated in the stage (2) is brought into contact with a water solution comprising at least one kind of component selected from the group consisting of acids, perchlorates and peroxo acid salts.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种新的电镀预处理方法，其中可以形成对由聚苯乙烯类树脂或聚苯乙烯基合金树脂构成的树脂成形体具有高粘附性的镀膜，而且，作为蚀刻处理液使用的高锰酸盐水溶液能够长时间稳定地连续使用。解决方案：将由聚苯乙烯类树脂或聚苯乙烯类合金树脂构成的树脂成型体作为树脂成分的电镀前处理方法包括以下（1）〜（3）工序：（1）其中包含特定有机化合物的水分散溶液或水溶液与树脂成型体接触; 在阶段（1）中处理的树脂成型体与包含高锰酸盐的水溶液接触的阶段（2）和在阶段（2）中处理的树脂成型体与包含选自酸，高氯酸盐和过氧酸盐中的至少一种成分的水溶液接触的阶段（3）。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006016659A Two-pack electroless silver plating solution 有权
标题翻译：双包电镀银镀层解决方案
公开(公告)号：JP2006016659A
公开(公告)日：2006-01-19
申请号：JP2004195145
申请日：2004-07-01
申请人： Okuno Chem Ind Co Ltd , Toyoda Gosei Co Ltd , 奥野製薬工業株式会社 , 豊田合成株式会社
发明人： OTSUKA KUNIAKI , MAEDA TAKEAKI , MARUOKA YOSUKE , OGISU YASUHIKO , WATARAI HIROSHI
IPC分类号： C23C18/44
摘要： PROBLEM TO BE SOLVED: To provide a two-pack electroless silver plating solution which is capable of forming a silver film excellent in gloss and free from discoloration or irregularity, and favorable for spray coating or the like.
SOLUTION: The two-pack electroless silver plating solution consists of two solution, i.e., (i) a silver-containing aqueous solution containing silver compound and ammonium and (ii) a reducing aqueous solution containing reducing agent. In addition, ethylene amines expressed by a general formula : R
1 R
2 N(CH
2 CH
2 NR
3 )
n R
4 (where, R
1 , R
2 , R
3 and R
4 are the same or different and each hydrogen atom, alkyl group, alkoxy group or epoxy group; and n denotes integer of 1 to 4) are contained in either or both of the silver-containing aqueous solution and the reducing agent containing aqueous solution.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种双组分无电镀银溶液，其能够形成光泽优异且无变色或不规则性并且有利于喷涂等的银膜。解决方案：双组分无电镀银溶液由两种溶液组成，即（i）含有银化合物和铵的含银水溶液和（ii）含还原剂的还原水溶液。另外，由以下通式表示的亚乙基胺：R SP 1，R SP 2，N，CH 2， 3 ） R 4 （其中，R 1 ，R 2 ，R R 3和R 4相同或不同，各氢原子，烷基，烷氧基或环氧基，n表示1〜4的整数）或含有银的水溶液和还原剂水溶液两者。版权所有（C）2006，JPO＆NCIPI

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