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1. 发明专利

JP2009026790A Wire bonding method 审中-公开
标题翻译：线接法
公开(公告)号：JP2009026790A
公开(公告)日：2009-02-05
申请号：JP2007185391
申请日：2007-07-17
申请人： Denso Corp , 株式会社デンソー
发明人： MAEDA YUKIHIRO , IMADA SHINJI , KASUGAI HIROSHI , KOBAYASHI WATARU
IPC分类号： H01L21/60
CPC分类号： H01L2224/32245 , H01L2224/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/4848 , H01L2224/48599 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/8501 , H01L2224/85012 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding method by which the clean surface of a member to be bonded is exposed just before wire bonding without plasma cleaning nor washing using a solvent.
SOLUTION: The surface of the member 42 to be bonded is rubbed with a dummy tool 200 just before a bonding wire 50 is bonded to the member 42. As the dummy tool 200, use is a tool made of a material of ceramic, resin, metal, etc., such that dirt sticking on the surface of the member 42 is rubbed off with the dummy tool 200.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种引线接合方法，通过该引线接合方法，即使在不进行等离子体清洗也不使用溶剂洗涤的引线接合之前，待结合部件的清洁表面露出。解决方案：刚好在接合线50接合到构件42之前，将待接合的构件42的表面用虚拟工具200摩擦。作为虚拟工具200，使用由陶瓷材料制成的工具，树脂，金属等，使得粘附在构件42的表面上的污垢用虚拟工具200擦去。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2014187137A Method for producing electronic device 有权
标题翻译：生产电子设备的方法
公开(公告)号：JP2014187137A
公开(公告)日：2014-10-02
申请号：JP2013060324
申请日：2013-03-22
申请人： Denso Corp , 株式会社デンソー
发明人： KASUGAI HIROSHI , YAMAMOTO YASUO
IPC分类号： H01L21/60
CPC分类号： H01L2224/36 , H01L2224/40 , H01L2224/40095 , H01L2224/40225 , H01L2224/41 , H01L2224/4103 , H01L2224/48137 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2924/00014 , H01L2924/01322 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2224/37099 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To prevent the separation of wire due to heating after wire bonding as much as possible in a method for producing an electronic device which is formed by wire-bonding and soldering to a power chip provided with a wire pad composed of an Au-plated layer on an undercoat whose surface is a Ni-plated layer and a solder land for soldering.SOLUTION: The method for producing an electronic device comprises a soldering step of soldering a terminal 50, a wire-bonding step of joining a wire 40 to a wire pad 21 thereafter, a heating step of heating a power chip 20 thereafter. Then, a Ni diffusion step in which Ni is diffused from a Ni-plated layer 211 to the surface of an Au-plated layer 212 in the wire pad 21 is carried out by heating the prepared power chip 20 before the soldering step.
摘要翻译：要解决的问题：为了防止在通过引线键合和焊接形成的电子器件的制造方法中尽可能多地在引线接合之后由于加热引起的线分离，该电子器件由具有由其表面为Ni镀层的底涂层上的镀金层和用于焊接的焊接区。解决方案：电子器件的制造方法包括焊接端子50的焊接工序，将导线 40之后的线焊盘21，此后加热功率芯片20的加热步骤。然后，通过在焊接步骤之前加热所制备的功率芯片20，进行Ni从Ni镀层211扩散到线焊盘21中的Au镀层212的表面的Ni扩散步骤。

3. 发明专利

JP2010182779A Wire bonding method 有权
标题翻译：线接法
公开(公告)号：JP2010182779A
公开(公告)日：2010-08-19
申请号：JP2009023535
申请日：2009-02-04
申请人： Denso Corp , 株式会社デンソー
发明人： KASUGAI HIROSHI , IMADA SHINJI , NAKAMURA TOSHIHIRO , SAGAWA HARUHIDE , TERUI KENICHIRO
IPC分类号： H01L21/60
CPC分类号： H01L24/28 , H01L24/29 , H01L24/73 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/45 , H01L2224/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/49175 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85009 , H01L2224/85051 , H01L2224/85148 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/8548 , H01L2224/85484 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/10162 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To improve bonding property without using a special material as a bonding land material and while preventing separation between a substrate and a land, in a wire bonding method for connecting a wire by wedge bonding when a bonding land on a substrate is used for secondary bonding side.
SOLUTION: In the wire bonding method, after primary bonding for an IC chip 20 provided to one surface of a substrate 10 by using a capillary 100, a wire 40 is subject to secondary bonding to a bonding land 30 that is projected over to one surface of the substrate 10. Before the secondary bonding step, the periphery of an inner hole 101 at the tip 102 of the capillary 100 is pressed down to the bonding land 30 to flatten the bonding land 30, and the wire 40 is bonded to the flattened portion 31 of the bonding land 30 in the secondary bonding step.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了在不使用特殊材料作为接合焊盘材料的同时提高接合性能并且同时防止基板和焊盘之间的分离，在用于通过楔形接合连接焊丝的引线接合方法中，将基板用于二次接合侧。解决方案：在引线接合方法中，在通过使用毛细管100设置在基板10的一个表面上的IC芯片20的初次接合之后，将导线40二次接合到突出的接合台面30 在二次接合步骤之前，将毛细管100的尖端102处的内孔101的周边压到接合台30，使接合台30平坦化，并且将导线40接合到二次接合工序中的接合台30的扁平部31。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009226420A Laser welding method 有权
标题翻译：激光焊接方法
公开(公告)号：JP2009226420A
公开(公告)日：2009-10-08
申请号：JP2008072630
申请日：2008-03-20
申请人： Denso Corp , 株式会社デンソー
发明人： TAKENAKA MASAYUKI , IMADA SHINJI , KASUGAI HIROSHI
IPC分类号： B23K26/20 , B23K26/32 , B23K103/12 , B23K103/16 , B23K103/18
摘要： PROBLEM TO BE SOLVED: To provide a laser welding method for joining first and second metal members by superposing the first metal member on the second metal member and irradiating laser beam to the surface side of the first member, enabling welding with low laser energy, and being suitable for suppressing explosion or sputtering of a planting layer formed on the first member by the heat of the laser beam. SOLUTION: The laser welding method joins both members 11, 12 by superposing the first metal member 11 on the second metal member 12 and irradiating the laser beam L to the surface side of the first member 11. A first planting layer 21 and a second planting layer 22 are formed on the first member 11 and the second member 12, respectively before overlapping of both members 11, 12. The first planting layer 21 has a laser beam absorption ratio higher than that of the second planting layer 22 and a melting point equal to or higher than that of the second planting layer 22. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种通过将第一金属构件叠置在第二金属构件上并将激光束照射到第一构件的表面侧来接合第一和第二金属构件的激光焊接方法，使得能够用低激光能量，并且适合于通过激光束的热来抑制形成在第一构件上的种植层的爆炸或溅射。解决方案：激光焊接方法通过将第一金属构件11叠置在第二金属构件12上并将激光束L照射到第一构件11的表面侧来连接两个构件11,12。第一种植层21和分别在两个部件11,12重叠之前的第一部件11和第二部件12上形成第二种植层22.第一种植层21的激光束吸收比高于第二种植层22的激光吸收比，熔点等于或高于第二种植层22的熔点。（C）2010，JPO＆INPIT

5. 发明专利

JP2009049309A Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2009049309A
公开(公告)日：2009-03-05
申请号：JP2007216148
申请日：2007-08-22
申请人： Denso Corp , 株式会社デンソー
发明人： IMADA SHINJI , MAEDA YUKIHIRO , KASUGAI HIROSHI , KOBAYASHI WATARU
IPC分类号： H01L21/60 , H01L25/04 , H01L25/18
CPC分类号： H01L24/73 , H01L2224/32225 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48463 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/85009 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a structure of an electronic device having lands with gold-plated surfaces to which an aluminum wire and a gold wire are connected, in which the structure is adapted to thicken the thickness of the gold plate of the land for a gold wire without changing the thickness of the gold plate of the land for an aluminum wire. SOLUTION: One land for a gold wire 12 forms an assembly of divisions 12a which are set up by dividing the land into a plurality of regions and to which a single gold wire 32 is connected straddling over the plurality of divisions 12a. The areas of individual divisions 12a are sized smaller than the area of a single land for an aluminum wire 11. The gold plates 10c in the individual divisions 12a are set thicker than the gold plate 10c in the land for an aluminum wire 11. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子设备的结构，该电子设备具有连接有铝线和金线的镀金表面的平台，其中该结构适于增加金板的厚度用于金线的土地，而不改变铝线的土地的金板的厚度。解决方案：用于金线12的一个焊盘形成通过将焊盘划分为多个区域而设置的部分组合12a，并且单个金线32跨过多个部分12a跨接在该组合上。单个部分12a的面积的尺寸小于铝线11的单个区域的面积。各个部分12a中的金板10c被设定为比铝线11的焊盘中的金板10c厚。
版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2004343056A Thick-film circuit board and its manufacturing method, and integrated circuit device 有权
标题翻译：厚膜电路板及其制造方法和集成电路设备
公开(公告)号：JP2004343056A
公开(公告)日：2004-12-02
申请号：JP2004057401
申请日：2004-03-02
申请人： Denso Corp , 株式会社デンソー
发明人： SHIMOIDE SACHIHIRO , KASUGAI HIROSHI , NOMURA TORU , KAMIMURA RIKIYA , SHIRAISHI YOSHIHIKO
IPC分类号： H05K1/09 , H01L23/12 , H01L23/13 , H05K1/11 , H05K1/16 , H05K3/12 , H05K3/24 , H05K3/40
CPC分类号： H05K3/4061 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H05K1/092 , H05K3/248 , H05K2201/035 , H05K2201/09981 , H05K2203/1572 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thin-film circuit board which can be manufactured at a low cost and its manufacturing method, and an integrated circuit device.
SOLUTION: A 1st thin-film circuit board is made of a copper-based conductor whose conductor layer 3 is burnt below 750°C and a conduction part 2 is made of a silver-based conductor. A 2nd thin-film circuit board has a conductor, which closes at least one opening part, in a through hole. This thin-film circuit board has the effect that the circuit board can be manufactured at low cost and the effect that a decrease in conductivity during use is suppressed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以以低成本制造的薄膜电路板及其制造方法和集成电路装置。解决方案：第一薄膜电路板由铜基导体制成，其导体层3在750℃以下燃烧，导电部分2由银基导体制成。第二薄膜电路板具有在通孔中封闭至少一个开口部的导体。该薄膜电路板具有可以以低成本制造电路板的效果，并且抑制使用期间电导率降低的效果。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2012023080A Wire bonding method 有权
标题翻译：线接法
公开(公告)号：JP2012023080A
公开(公告)日：2012-02-02
申请号：JP2010157698
申请日：2010-07-12
申请人： Denso Corp , 株式会社デンソー
发明人： IKUNO YUICHI , ASAI SHOKI , KASUGAI HIROSHI , TERUI KENICHIRO
IPC分类号： H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a wire bonding method in which ball bonding is performed as primary bonding and stitch bonding is performed as secondary bonding, for enabling the formation of an appropriate initial ball though a wire drawn in a wire drawing step after the secondary bonding bends to a level of discharge disabled.SOLUTION: The wire bonding method, when forming a initial ball 41 after a wire draw step, comprises the steps of: performing discharge on a drawn wire 40; detecting, based on the discharged state, whether the drawn wire 40 is bending with respect to a virtual line S extending along a direction in which an inner hole 101 of a capillary 100 extends; reforming the bending of the wire, if the bending state is detected, to the state where the wire 40 extends along the direction same with that of the virtual line S; and subsequently performing discharge again to form the initial ball 41.
摘要翻译：要解决的问题：提供一种引线接合方法，其中进行作为一次接合进行球接和进行二次接合的针脚接合，以便能够通过在拉丝步骤中拉丝的线形成适当的初始球次级接合后弯曲到放电水平。解决方案：引线接合方法，当在拉丝步骤之后形成初始球41时，包括以下步骤：在拉丝40上进行放电; 基于放电状态来检测拉丝40是否相对于沿着毛细管100的内孔101延伸的方向延伸的虚拟线S弯曲; 如果检测到弯曲状态，则将线的弯曲改变为线40沿着与虚拟线S相同的方向延伸的状态; 然后再次执行放电以形成初始球41.版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2010147126A Wiring substrate and manufacturing method for the same 有权
标题翻译：接线基板及其制造方法
公开(公告)号：JP2010147126A
公开(公告)日：2010-07-01
申请号：JP2008320595
申请日：2008-12-17
申请人： Denso Corp , 株式会社デンソー
发明人： NAKAMURA TOSHIHIRO , OTANI YUJI , KASUGAI HIROSHI , IMADA SHINJI , SAGAWA HARUHIDE , TERUI KENICHIRO
IPC分类号： H05K1/09 , C25D5/10 , C25D5/56 , C25D7/00 , H01L23/12 , H05K3/24
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a wiring substrate that properly prevents bulging in a conductive film and pinholes in the conductive film, without having to provide inclination or unevenness on the surface of the conductive film, in a wiring substrate having the conductive film. SOLUTION: The wiring substrate 1 has a conductive film 10, formed by successively laminating a base layer 11 made of a conductor, copper layers 12, 13 made of copper, and a gold layer 14 made of gold on its surface; the copper layers 12, 13 are formed, by successively forming a first layer 12 made of copper plating and a second layer 13 made of copper plating from the side of the base layer 11. Each gas-venting passage 15 for venting the gas generated between the base layer 11 and the first layer 12 is formed inside the first layer 12, from the face on the side of the base layer 11 to the face on the side of the second layer 13 in the first layer 12, and each gas-venting passage 15 is closed by the second layer 13 on the face on the side of the second layer 13 in the first layer 12. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够适当地防止导电膜中的膨胀和导电膜中的针孔的布线基板，而不必在导电膜的表面上提供倾斜或不均匀，在具有导电性的布线基板电影。布线基板1具有导电膜10，其通过在其表面上依次层叠由导体制成的基底层11，铜层12,13和由金制成的金层14而形成。通过从基底层11侧依次形成由镀铜制成的第一层12和由镀铜制成的第二层13，形成铜层12,13。每个排气通道15，用于排出在基底层11和第一层12形成在第一层12的内部，从基底层11的表面到第一层12中的第二层13的一侧的表面，并且每个气体排出通道15由第一层12中第二层13侧面上的第二层13封闭。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010103232A Method of manufacturing electronic device 有权
标题翻译：制造电子器件的方法
公开(公告)号：JP2010103232A
公开(公告)日：2010-05-06
申请号：JP2008271953
申请日：2008-10-22
申请人： Denso Corp , 株式会社デンソー
发明人： TERUI KENICHIRO , OTANI YUJI , IMADA SHINJI , SAGAWA HARUHIDE , KASUGAI HIROSHI , NAKAMURA TOSHIHIRO
IPC分类号： H01L21/60 , H01L23/12
CPC分类号： H01L24/83 , H01L24/73 , H01L2224/32225 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/838 , H01L2224/85 , H01L2224/85001 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/78
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device, in which solder is disposed on a substrate, where wire bonding is carried out, using a strip mask, wherein residues of the strip mask being suitably reduced without plating a bonding land with Pd. SOLUTION: A reduction member 110, which is easier to oxidize than base metal 12a of the bonding land 12 at curing temperature of the mask and solder reflow temperature, is added to the microstrip mask 100 used for a mask arranging step. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2009124075A Wire bonding method and wire bonding structure 有权
标题翻译：电线接合方法和电线结合结构
公开(公告)号：JP2009124075A
公开(公告)日：2009-06-04
申请号：JP2007299228
申请日：2007-11-19
申请人： Denso Corp , 株式会社デンソー
发明人： KASUGAI HIROSHI , IMADA SHINJI
IPC分类号： H01L21/60
CPC分类号： H01L24/28 , H01L24/29 , H01L2224/05624 , H01L2224/05647 , H01L2224/29339 , H01L2224/45 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48479 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/48997 , H01L2224/49 , H01L2224/49174 , H01L2224/4942 , H01L2224/49426 , H01L2224/49427 , H01L2224/49429 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85051 , H01L2224/85148 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/15787 , H01L2224/48471 , H01L2924/00 , H01L2224/48824 , H01L2224/48455 , H01L2924/00012 , H01L2224/4554
摘要： PROBLEM TO BE SOLVED: To form a proper wire shape in lamination of a plurality of wires between one set of electrodes when a plurality of wires are connected between an electrode on a semiconductor chip and an electrode on a substrate.
SOLUTION: A plurality of wires 30 are laminated and formed on both electrodes 11, 21 by carrying out wire connection process a plurality of times between the electrode 11 of a semiconductor chip 10 and the electrode 21 of a substrate 20. In connection process for forming a wire 30 positioned below a wire 30 positioned in an uppermost part among a plurality of laminated wires 30, the wire 30 after primary bonding is extracted so that a part from a root portion at a primary bonding part 30a to an intermediate part in the wire 30 extends obliquely upward from a horizontal surface H toward a land 21 at a secondary bonding side.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：当多个电线连接在半导体芯片上的电极和基板上的电极之间时，为了在一组电极之间的多个电线的层叠中形成适当的线形状。解决方案：通过在半导体芯片10的电极11和基板20的电极21之间多次进行多次电线连接处理，在两个电极11,21上层叠并形成多根电线30。用于形成定位在多个层叠线30中的最上部的线30的下方的线30的处理，一次接合后的线30被抽出，使得从主结合部30a的根部到中间部的部分在第二接合侧，导线30从水平面H向着陆部21倾斜向上延伸。版权所有（C）2009，JPO＆INPIT

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