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1. 发明专利

JP2007021690A Composite machining device and machining method using the device 有权
标题翻译：复合加工装置和使用该装置的加工方法
公开(公告)号：JP2007021690A
公开(公告)日：2007-02-01
申请号：JP2005210149
申请日：2005-07-20
申请人： Denso Corp , 株式会社デンソー
发明人： INOMATA SUMITOMO , KAMEYAMA MICHIO , FUKAYA TERUKAZU , KUMAGAI EIJI
IPC分类号： B23H5/00 , B23H9/14 , B23K26/00 , B23K26/38 , B23K26/42
摘要： PROBLEM TO BE SOLVED: To improve machining accuracy of electric discharge machining, even if an electrode for electric discharge machining is not aligned to a prepared hole provided in a workpiece by laser machining. SOLUTION: Laser beam irradiated from a laser oscillator 26 is made incident from one end side of the electrode 13, passes a hollow part, is injected from the other end side of the electrode 13 and is projected on the workpiece 1, and thereby the workpiece 1 is laser-machined and the prepared hole is formed. An optical axis of the laser beam made incident to the hollow part of the electrode 13 and a major axis of the electrode 13 are arranged on the same axis. As a result, electric discharge machining is performed without moving the place of the workpiece 1 after performing the laser machining, and the alignment of the electrode 13 to the prepared hole formed by the laser machining is dispensed with. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提高放电加工的加工精度，即使放电加工用电极与通过激光加工设置在工件中的预定孔不一致。解决方案：从激光振荡器26照射的激光束从电极13的一端侧入射，通过中空部，从电极13的另一端侧注入并投射到工件1上，从而对工件1进行激光加工，形成预制孔。入射到电极13的中空部分的激光束的光轴和电极13的长轴布置在同一轴线上。结果，在进行激光加工之后，不进行工件1的放置而进行放电加工，并且省去电极13与通过激光加工形成的预制孔的对准。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2012101233A Deburring method using high density energy beam, method for producing perforated member, and deburring device 有权
标题翻译：使用高密度能量束的去除方法，生产执行成员的方法和去除装置
公开(公告)号：JP2012101233A
公开(公告)日：2012-05-31
申请号：JP2010249888
申请日：2010-11-08
申请人： Denso Corp , 株式会社デンソー
发明人： INOMATA SUMITOMO , KUMAGAI EIJI , INOBE KYOJI
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/08
摘要： PROBLEM TO BE SOLVED: To adjust a laser beam to a position of a burr without the necessity of considering the interference between a mirror holding tool and a first hole in a technology for inserting a mirror held by the mirror holding tool into the first hole and reflecting the laser beam by the mirror and emitting the laser beam to the burr in the boundary between the first hole and a second hole so as to remove the burr.SOLUTION: The mirror 12 is inserted into the inside of a workpiece 30 from the hole 31, and the mirror 12 is arranged in the hole 31, and the mirror 12 is positioned in the vicinity of the hole 32 during arrangement, and thereby, when light is incident on the mirror 12 from the outside of the workpiece 30 through the second hole 32, the light is reflected by the mirror 12 and is shed to the boundary 34 between the two holes 31 and 32. By adjusting the position and the direction of a laser irradiation member 17, the laser beam 20 from the laser irradiation member 17 is incident on the mirror 12 through the second hole 32; and the laser beam 20 is reflected by the mirror 12 and is shed to the burrs 33a and 33e in the boundary.
摘要翻译：要解决的问题：为了将由镜保持工具保持的反射镜插入到技术中，将激光束调整到毛刺位置，而不需要考虑反射镜保持工具和第一孔之间的干涉第一孔，并通过反射镜反射激光束，并将激光束发射到第一孔和第二孔之间的边界处的毛刺，以除去毛刺。解决方案：反射镜12从孔31插入到工件30的内部，反射镜12布置在孔31中，并且反射镜12在布置期间位于孔32的附近，并且因此，当光从工件30的外部通过第二孔32入射到反射镜12上时，光被反射镜12反射并且被切掉到两个孔31和32之间的边界34.通过调节位置和激光照射构件17的方向，来自激光照射构件17的激光束20通过第二孔32入射到反射镜12上; 并且激光束20被反射镜12反射，并被分离到边界中的毛刺33a和33e。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011104735A Electrical discharge machine and method of manufacturing nozzle body using the same 有权
标题翻译：电动放电机及其使用方法制造喷嘴体
公开(公告)号：JP2011104735A
公开(公告)日：2011-06-02
申请号：JP2009263745
申请日：2009-11-19
申请人： Denso Corp , 株式会社デンソー
发明人： ITO AKIRA , INOBE KYOJI , IKUTA KAZUHISA , INOMATA SUMITOMO
IPC分类号： B23H7/26
摘要： PROBLEM TO BE SOLVED: To make high-speed control of an electrode position easier than that in conventional one in electrical discharge technology for turning an electrode by means of gas power.
SOLUTION: An air charging nozzle 34 for supplying compressed air to an electrode holder 22 is provided. The electrode holder 22 includes a rotary impeller for rotating the electrode 23 by receiving the compressed air supplied from the air charging nozzle 34 to rotate and a body base for accommodating the rotary impeller inside. The body base has an intake window formed for causing the compressed air supplied from the air charging nozzle 34 to flow inside from the outside of the body base. The air charging nozzle 34 has a slit provided for discharging the compressed air. The intake window is located at a position facing the slit and apart from it. The slit is longer than the intake window in a driving direction of the electrode holder 22. When the electrode holder moves during electric discharge, the intake window moves along the slit while facing the slit.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了使电极位置的高速控制比通过气体电力转动电极的放电技术中的常规电极的高速控制更容易。解决方案：提供一种用于向电极夹持器22供给压缩空气的充气喷嘴34。电极保持器22包括旋转叶轮，用于通过接收从充气喷嘴34供应的压缩空气旋转来旋转电极23，以及用于容纳旋转叶轮的主体。主体基部具有形成为使得从充气喷嘴34供给的压缩空气从身体基部的外侧向内流动的进气窗口。充气喷嘴34具有用于排出压缩空气的狭缝。进气门位于面向狭缝并与之分开的位置。狭缝在电极保持器22的驱动方向上比进气窗长。当电极保持器在放电期间移动时，进气窗沿狭缝移动，同时面向狭缝。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011029659A Laser soldering method 有权
标题翻译：激光焊接方法
公开(公告)号：JP2011029659A
公开(公告)日：2011-02-10
申请号：JP2010222557
申请日：2010-09-30
申请人： Denso Corp , 株式会社デンソー
发明人： SUZUKI ICHIRO , SAKAMOTO ZENJI , TANAHASHI AKIRA , OSHIRO MASARU , INOMATA SUMITOMO
IPC分类号： H05K3/34 , B23K1/00 , B23K1/005 , B23K3/06 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide a laser soldering method which improves performance and reliability of soldering.
SOLUTION: (1) When soldering by laser radiation, an insert position of a lead 12 to a through-hole 15 is detected, and a material of a solder is supplied from a direction of a long distance between the lead 12 and land 14. (2) The lead is passed through the shielding board shielding the laser light, thereafter inserted into the through-hole. (3) The soldering is performed using oval shaped laser light whose size does not expand off from an oval shaped land. (4) A projection length L of the lead from the circuit board is determined so that the reflection light reflected by the lead side face is incident on the land. (5) The wavelength of the laser light is set to a wavelength with lower absorption ratio by the circuit board. (6) A flux-containing solder including distilled and purified rosin or synthetic resin is used.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供提高焊接性能和可靠性的激光焊接方法。（1）当通过激光辐射焊接时，检测到引线12到通孔15的插入位置，并且从引线12和引线12之间的长距离的方向供给焊料的材料（2）引线穿过屏蔽板屏蔽激光，然后插入通孔。（3）使用椭圆形的激光进行焊接，其尺寸不会从椭圆形的焊盘伸出。（4）确定来自电路板的引线的突出长度L，使得由引线侧面反射的反射光入射到焊盘上。（5）通过电路板将激光的波长设定为具有较低吸收率的波长。（6）使用含有蒸馏精制松香或合成树脂的含助焊剂的焊剂。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2013169610A High hardness material working method and working device 审中-公开
标题翻译：高硬度材料工作方法和工作装置
公开(公告)号：JP2013169610A
公开(公告)日：2013-09-02
申请号：JP2012033932
申请日：2012-02-20
申请人： Denso Corp , 株式会社デンソー
发明人： TAKATAKE KYOHEI , KANO FUMIYOSHI , YAMAGUCHI TETSUJI , INOMATA SUMITOMO
IPC分类号： B24B1/00 , B24B49/14 , H01L21/304
CPC分类号： B24B7/22 , B24B7/228 , B24B49/14
摘要： PROBLEM TO BE SOLVED: To provide a high hardness material working method eliminating the problems of heat resistance and clogging of a grindstone.SOLUTION: A working method making a high hardness material touch a rotating polishing tool while rotating the high hardness material comprises the steps of: heating the high hardness material to a temperature higher than a predetermined working temperature at a position different from a machined part so as to become the working temperature at that machined part and thereby forming a softened layer with a hardness lower than a surface layer of the high hardness material; working the high hardness material by making the polishing tool rotate at a speed such that the temperature of the polishing tool which rises due to heat input from the high hardness material at machined part to the polishing tool becomes no more than a heat resistance temperature of the polishing tool while making the high hardness material touch the polishing tool; cooling the polishing tool at a position which is different from the machined part; and washing the polishing tool at a position which is different from the machined part.
摘要翻译：要解决的问题：提供一种消除磨石的耐热性和堵塞问题的高硬度材料加工方法。解决方案：使高硬度材料接触旋转研磨工具同时旋转高硬度材料的工作方法包括以下步骤：：将高硬度材料加热到与加工部分不同的位置处的高于预定工作温度的温度，以便成为加工部分的工作温度，从而形成硬度低于表面层的软化层高硬度材料; 通过使抛光工具以使得由加工部件的高硬度材料向研磨工具的热量输入而升高的研磨工具的温度升高到不超过加工部件的耐热温度的速度来进行高硬度材料的加工，同时使高硬度材料接触抛光工具; 将抛光工具冷却在与加工部分不同的位置; 并且在与加工部分不同的位置处洗涤抛光工具。

6. 发明专利

JP2007289992A Laser beam machining apparatus 有权
标题翻译：激光加工设备
公开(公告)号：JP2007289992A
公开(公告)日：2007-11-08
申请号：JP2006119714
申请日：2006-04-24
申请人： Denso Corp , 株式会社デンソー
发明人： ISHIHARA AKIHIRO , KAMEYAMA MICHIO , INOMATA SUMITOMO , KUMAGAI EIJI
IPC分类号： B23K26/06 , B23K26/04
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus having superior laser beam machining accuracy by suppressing change in a focal distance caused by thermal expansion. SOLUTION: The laser beam machining apparatus is equipped with: a laser output part; an optical member; a variable-focus lens device 50 comprising a lens part 60 structured with a focal distance made variable and an actuator 70 provided with a pressure pipe 71 for pressurizing the lens part 60; and a light shielding plate 80 which, covering the upper face of the variable-focus lens device 50, is provided with a body 81 having a through hole for a laser beam to pass through and with a cylindrical part 82 covering the inner circumferential wall of the pressure pipe 71. The laser beam 100, emitted from the laser output part and changed to have a desired laser diameter by passing through the optical member, goes through the through hole of the light shielding plate 80 and the cylindrical part 82 arranged inside the pressure pipe 71 to arrive at the lens part 60 adjusted for a desired focal distance. As a result, the laser beam that passed through the lens part 60 is emitted to a workpiece, so that laser beam machining is performed on the workpiece. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：通过抑制由热膨胀引起的焦距的变化，提供具有优异的激光加工精度的激光束加工装置。
解决方案：激光束加工装置配备有：激光输出部; 光学构件; 可变焦距透镜装置50，包括由焦距变化构成的透镜部分60;以及致动器70，其具有用于对透镜部60加压的压力管71; 以及覆盖可变焦透镜装置50的上表面的遮光板80设置有主体81，主体81具有用于激光束通过的通孔，并且具有覆盖内圆周壁的圆筒部82 从激光输出部发射并通过光学部件变更为具有期望的激光直径的激光束100穿过遮光板80的通孔和布置在其内的圆筒部82 压力管71到达被调整为所需焦距的透镜部分60。结果，穿过透镜部分60的激光束被发射到工件，使得对工件进行激光束加工。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2005177786A Processing method and apparatus by high density energy beam and manufacturing method and apparatus for tube with hole 审中-公开
标题翻译：高密度能量束的加工方法和装置及其制造方法和装置
公开(公告)号：JP2005177786A
公开(公告)日：2005-07-07
申请号：JP2003419503
申请日：2003-12-17
申请人： Denso Corp , 株式会社デンソー
发明人： MATSUZAKA NOBORU , INOMATA SUMITOMO , KUMAGAI EIJI , FUKAYA TERUKAZU , IWASAKI YOSHITO
IPC分类号： B23K26/00 , B23K26/14 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a cutting method and apparatus by a high density energy beam, a method and apparatus preventing sticking, near a cutting part, of fused deposits which are hard to be removed by a simple removing means because of a relation between the flowing direction of assist gas and the cutting/advancing direction of the high density energy beam, in an apparatus designed to blow off dross and spatters from a cutting section by forming a flow of assist gas crossing a beam irradiation part. SOLUTION: The locus of the beam irradiation part in forming a slot is designed to successively go through a-b-c-d-e-a with a as the starting point. As a result, the assist gas J2 crossing the beam irradiation part no longer flows from the front obliquely with respect to the cutting/advancing direction of the high density energy beam, thereby effectively preventing sticking of the fused deposits which are far from simple removal. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：为了通过高密度能量束提供切割方法和装置，可以防止在切割部分附近粘附沉积物的方法和装置，这些沉积物难以通过简单的去除手段去除，因为在设计成通过形成与射束照射部分交叉的辅助气体流从切割部分吹出浮渣和飞溅物的设备中，辅助气体的流动方向与高密度能量束的切割/前进方向之间的关系。解决方案：形成槽中的光束照射部分的轨迹被设计为以a作为起点连续地通过a-b-c-d-e-a。结果，与射束照射部交叉的辅助气体J2不再相对于高密度能量束的切断方向从倾斜方向流出，从而有效地防止了熔融沉积物的粘附，这些不易于简单的除去。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2012121087A Wire electric discharge machine, and method for manufacturing article by cutting workpiece 审中-公开
标题翻译：电线放电机及切割工件制造方法
公开(公告)号：JP2012121087A
公开(公告)日：2012-06-28
申请号：JP2010272557
申请日：2010-12-07
申请人： Denso Corp , 株式会社デンソー
发明人： IKUTA KAZUHISA , ITO AKIRA , INOMATA SUMITOMO , INOBE KYOJI
IPC分类号： B23H7/10
摘要： PROBLEM TO BE SOLVED: To provide a technique for making wire rotate by a wire electric discharge machine, capable of rotating the wire on a setup scale smaller than a conventional one.SOLUTION: When a wire 30 is fed to machine a workpiece and pressed against an outer peripheral surface 26b of a wire rotating roller 26, the wire 30 is energized by the outer peripheral surface 26b in a direction orthogonal to a feeding direction of the wire 30 by the rotation of the wire rotating roller 26, thereby to make the wire 30 rotate around its feeding direction as an axis of rotation.
摘要翻译：要解决的问题：提供一种通过线材放电机进行线材旋转的技术，其能够以比传统的小的方式旋转线材。
解决方案：当线30被加工以加工工件并且被压靠在线旋转辊26的外周表面26b上时，线30由外周表面26b沿垂直于馈线方向线30通过线旋转辊26的旋转，从而使线30围绕其馈送方向作为旋转轴线旋转。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2012106325A Cutting method 审中-公开
标题翻译：切割方法
公开(公告)号：JP2012106325A
公开(公告)日：2012-06-07
申请号：JP2010258975
申请日：2010-11-19
申请人： Denso Corp , 株式会社デンソー
发明人： HORI KANTARO , INOMATA SUMITOMO , OBA YASUHIRO , KAWAMOTO YASUNORI , KANO FUMIYOSHI , KOJIMA HISATOSHI
IPC分类号： B23B1/00
摘要： PROBLEM TO BE SOLVED: To provide a cutting method in which a laser beam is efficiently utilized to process a work material.SOLUTION: In the cutting method, a work 1 is processed in a predetermined shape by a cutting tool 4 which abuts on the work 1 and cuts the work 1. In a cutting process for cutting the work 1 by the cutting tool 4, the strength of the work 1 is lowered by condensing and irradiating the laser beam on a sheared surface SP of the work 1 and heating. Thereby, the laser beam is locally condensed and irradiated on the sheared surface SP of the work 1. Therefore, an increase of an energy amount required for the laser beam can be suppressed and the strength of the work 1 is lowered to reduce cutting resistance in cutting work. Accordingly, the laser beam can be utilized efficiently in the cutting work to process the work 1.
摘要翻译：要解决的问题：提供一种切割方法，其中激光束被有效地用于处理工件材料。解决方案：在切割方法中，通过与工件1邻接并切割工件1的切削工具4将工件1以预定形状加工。在通过切削工具4切割加工1的切削过程中通过将激光束聚焦并照射在工件1的剪切表面SP上并加热来降低工件1的强度。由此，激光束被局部冷凝并照射在工件1的剪切表面SP上。因此，可以抑制激光束所需的能量量的增加，并且降低作业1的强度以降低切割阻力切割工作。因此，激光束可以在切割工作中有效地利用来处理工作1.版权所有：（C）2012，JPO＆INPIT

10. 发明专利

JP2008135795A Semiconductor device, and method for producing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008135795A
公开(公告)日：2008-06-12
申请号：JP2008054386
申请日：2008-03-05
申请人： Denso Corp , 株式会社デンソー
发明人： FUJII TETSUO , FUKADA TSUYOSHI , AO KENICHI , YOSHIHARA SHINJI , INOMATA SUMITOMO , MUTO KOJI
IPC分类号： H01L21/301
CPC分类号： H01L2224/45144 , H01L2224/48465 , H01L2224/73265 , H01L2924/16235 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a semiconductor device which is capable of preventing contamination to chips because of remaining of dicing scraps of a protective sheet and release of the protective sheet, when a semiconductor wafer covered with the protective sheet is cut into the chips by dicing. SOLUTION: The method includes steps of: fixing a protective sheet 1 to a jig 4 at the surface opposite to a surface covering a semiconductor wafer 11; removing regions of the protective sheet corresponding to regions where dicing-cut is to be performed, while fixing the protective sheet 1 to the jig 4; then, bonding the protective sheet 1 and one surface of the semiconductor wafer 11 together while fixing the protective sheet 1 to the jig 4, and removing the jig 4 from the protective sheet 1; and subsequently cutting into chips the semiconductor wafer 11 to which the protective sheet 1 is bonded by dicing along the grooves 6 that are the removed regions of the protective sheet 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件的制造方法，该半导体器件能够防止由于保护片的切割屑的残留和保护片的释放而导致的芯片的污染，当用保护膜覆盖的半导体晶片片通过切割切成芯片。解决方案：该方法包括以下步骤：将保护片1固定在与覆盖半导体晶片11的表面相对的表面上的夹具4; 在将保护片1固定到夹具4的同时，去除与要进行切割的区域对应的保护片的区域; 然后，将保护片1和半导体晶片11的一个表面粘合在一起，同时将保护片1固定到夹具4上，并将夹具4从保护片1上取下; 然后沿着作为保护片1的去除区域的槽6通过切割将切割保护片1的半导体晶片11切割成芯片。版权所有（C）2008，JPO＆INPIT

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