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    • 1. 发明申请
    • SUBLIMATION INKS FOR THERMAL INKJET PRINTERS USING THERMALLY STABLE DYE PARTICLES
    • 使用热稳定的染料颗粒进行热喷墨打印机的底漆
    • US20120162332A1
    • 2012-06-28
    • US12975397
    • 2010-12-22
    • Dennis McKeanFrancis Chee-Shuen LEE
    • Dennis McKeanFrancis Chee-Shuen LEE
    • B41J2/01C09D11/02
    • C09D11/32C09D11/40
    • Thermal inkjet printer sublimation inks are provided having high melting point suspended particles such that the ink does not clog thermal ink jet print heads. Low-cost thermal ink jet printers are used to create thermal transfer images from the inks which are used in conventional thermal transfer processes. An ink set having at least three ink colors includes an aqueous medium of 30-95 weight percent having particles of 50 nm to 1000 nm suspended therein in an amount of 1-10 weight percent. The suspended particles include a sublimation dye and have a melting point of at least a surface of the particle greater than or equal to 200° C. The particles may have a core-shell structure with a sublimation dye core. The ink includes one or more cosolvents from 4-40 weight percent, a surfactant of 0.01 to 5 weight percent, and a biocide of 0.01-5 weight percent.
    • 提供具有高熔点悬浮颗粒的热喷墨打印机升华油墨,使得油墨不会堵塞热喷墨打印头。 低成本的热喷墨打印机用于从常规热转印工艺中使用的油墨产生热转印图像。 具有至少三种油墨颜色的油墨组包括以1-10重量%的量悬浮在其中的具有50nm至1000nm的颗粒的30-95重量%的水性介质。 悬浮颗粒包括升华染料,并且至少具有大于或等于200℃的颗粒的表面的熔点。颗粒可以具有带升华染料芯的核 - 壳结构。 油墨包含一种或多种4-40重量%的共溶剂,0.01至5重量%的表面活性剂和0.01-5重量%的杀生物剂。
    • 3. 发明申请
    • Thermal Inkjet Printhead Chip Structure and Manufacturing Method for the same
    • 热喷墨打印头芯片结构及其制造方法
    • US20090141087A1
    • 2009-06-04
    • US12249120
    • 2008-10-10
    • Francis Chee-Shuen LEEWei-Fu LaiMing-Ling Lee
    • Francis Chee-Shuen LEEWei-Fu LaiMing-Ling Lee
    • B41J2/05H01L21/00
    • B41J2/1601B41J2/14072B41J2/14129B41J2/1626B41J2/1631B41J2/1642
    • A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.
    • 热喷墨打印头芯片结构包括基板,形成在基板上的氧化物层,至少一个驱动电路,每个驱动电路包括源极,漏极和栅极,并形成在基板上并进一步被氧化物层包围,介电层, 缓冲层,电阻层和导电层。 电介质层形成在驱动器电路上,并且具有穿过其形成的开口以暴露源极和漏极。 缓冲层形成在电介质层上,覆盖源极和漏极,并连接到源极和漏极。 电阻层形成在缓冲层上并具有至少一个加热区域。 电阻层在源极和漏极上方延伸,并连接到源极和漏极。 导电层形成在电阻层上并暴露加热区域。 还提供了一种制造方法。