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    • 1. 发明申请
    • Method and apparatus for testing solderability of electrical components
    • 用于测试电气部件可焊性的方法和装置
    • US20070235504A1
    • 2007-10-11
    • US11400233
    • 2006-04-10
    • Denis LahaieBeverley Christian
    • Denis LahaieBeverley Christian
    • B23K31/12B23K20/00B23K13/08
    • B23K31/12B23K2101/40G01N13/02H05K3/34H05K2203/162
    • The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the plafform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.
    • 所描述的实施例一般涉及用于确定电气部件的可焊性的方法和装置。 一个具体方面涉及包括真空室,负载传感器,平台和控制模块的设备。 负载传感器具有设置在真空室内的接触部分,并且平台相对于接触部分设置,并且具有部件安装表面和用于将电气部件安装到部件安装表面的安装部件。 控制模块导致平板纸和负载传感器之间的相对移动,使得电气部件的接触表面与接触部分紧密接近。 当接触部分在其上具有焊料并且焊料与接触表面接触时,负载传感器测量由焊料湿润到接触表面的力。 接触时产生的力随时间而变化,这取决于电气部件的可焊性程度。 因此,随着时间的推移,润湿力的测量提供了电气部件的可焊性的指示。