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    • 7. 发明申请
    • Thermodynamic cycle apparatus and method
    • 热循环装置及方法
    • US20070017247A1
    • 2007-01-25
    • US11221209
    • 2005-09-07
    • John Pendray
    • John Pendray
    • F25B1/00F04F11/00
    • F25B9/00
    • A compressor and heat pump combination has an active chamber and a passive chamber, each with its own hot plate and cold plate. The two chambers are joined along an edge by a membrane that largely transmits pressure, largely insulates against temperature transfer, and prevents passage of gases from one chamber to the other. The gas in the active chamber is alternately cooled and heated by exposure to the active cold and active hot plates, causing pressure changes in the active chamber that are transmitted to the passive chamber by the membrane. The pressure changes alternately cool the gas in the passive chamber below the temperature of the passive cold plate, and heat the gas in the passive chamber above the temperature of the passive hot plate. In alternately exposing the cooled gas in the passive chamber to the passive cold plate, and the heated gas in the passive chamber to the passive hot plate, heat is forced to flow from the passive cold plate to the passive hot plate. Other thermodynamic apparatus including stand alone compressors and heat pumps are described.
    • 压缩机和热泵组合具有活动室和被动室,每个室具有自己的热板和冷板。 两个腔室沿着边缘连接,其膜大大地传递压力,绝大部分绝热而不能传递温度,并且防止气体从一个腔室通到另一个腔室。 主动室中的气体交替地被冷却并通过暴露于活性冷和活性热板进行加热,从而导致活性室中的压力变化,其通过膜传递至被动室。 压力变化交替地将被动室中的气体冷却到被动冷板的温度以下,并将被动室中的气体加热到被动热板的温度以上。 在将被动室中的冷却气体交替地暴露于被动冷板,将被动室中的被加热气体暴露于被动热板时,迫使热量从被动冷板流向被动热板。 描述了包括独立压缩机和热泵的其它热力学设备。
    • 8. 发明申请
    • Composite head-electrical conditioner assembly
    • 复合头电器组装
    • US20060203387A1
    • 2006-09-14
    • US11079052
    • 2005-03-14
    • Andrew WhiteRoger HipwellJohn PendrayBradley VerMeer
    • Andrew WhiteRoger HipwellJohn PendrayBradley VerMeer
    • G11B5/60
    • G11B5/4853G11B5/484
    • A composite head-electrical conditioner assembly that includes a slider with a transducer head and transducer bond pads. The transducer bond pads communicate a transducer level electrical signal with the transducer head. An integrated circuit substrate has a conditioning circuit and first substrate bond pads electrically connected to the transducer bond pads. The integrated circuit substrate has second substrate bond pads with a conditioned electrical signal that is transmittable over a circuit. The slider is rigidly mounted to the integrated circuit substrate to form an assembly that is flexibly mountable. A thermal isolation space is provided between the transducer and the conditioning circuit. The integrated circuit can be in the form of a cap that provides windage reduction.
    • 一种复合头 - 电调节器组件,其包括具有换能器头和换能器接合垫的滑块。 传感器接合焊盘将传感器电平信号与换能器头通信。 集成电路基板具有调节电路和电连接到换能器接合焊盘的第一基板接合焊盘。 集成电路衬底具有第二衬底接合焊盘,其具有可通过电路传输的经调节的电信号。 滑块刚性地安装到集成电路基板上以形成可灵活安装的组件。 在换能器和调节电路之间设有隔热空间。 集成电路可以是提供减少风量的帽子的形式。