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    • 5. 发明授权
    • Quartz-based MEMS resonators and methods of fabricating same
    • 基于石英的MEMS谐振器及其制造方法
    • US08765615B1
    • 2014-07-01
    • US12816292
    • 2010-06-15
    • David T. ChangFrederic P. StrattonHung NguyenRandall L. Kubena
    • David T. ChangFrederic P. StrattonHung NguyenRandall L. Kubena
    • H01L21/302H01L21/311H01L21/3105
    • H01L21/31111B81B2201/0271B81C1/00238B81C2201/0194B81C2203/036B81C2203/038H01L21/31056H03H3/0072H03H2009/02291
    • A quart resonator for use in lower frequency applications (typically lower than the higher end of the UHF spectrum) where relatively thick quartz members, having a thickness greater than ten microns, are called for. A method for fabricating same resonator includes providing a first quart substrate; thinning the first quartz substrate to a desired thickness; forming a metallic etch stop on a portion of a first major surface of the first quartz substrate; adhesively attaching the first major surface of the first quartz substrate with the metallic etch stop formed thereon to a second quartz substrate using a temporary adhesive; etching a via though the first quartz substrate to the etch stop; forming a metal electrode on a second major surface of the first quartz substrate, the metal electrode penetrating the via in the first quartz substrate to make ohmic contact with the metallic etch stop; bonding the metal electrode formed on the second major surface of the first quartz substrate to a pad formed on a substrate bearing oscillator drive circuitry to form a bond there between; and dissolving the temporary adhesive to thereby release the second quartz substrate from the substrate bearing oscillator drive circuitry and a portion of the first quartz substrate bonded thereto via the bond formed between the metal electrode formed on the second major surface of the first quartz substrate to and the pad formed on the substrate bearing oscillator drive circuitry.
    • 用于低频应用(通常低于UHF频谱的较高端)的夸特谐振器,其中厚度大于10微米的相对较厚的石英构件被要求。 一种制造相同谐振器的方法包括提供第一夸脱基片; 将第一石英基板变薄至所需厚度; 在所述第一石英衬底的第一主表面的一部分上形成金属蚀刻停止件; 使用临时粘合剂将第一石英基板的第一主表面与其上形成的金属蚀刻停止粘合到第二石英基板上; 将通过第一石英衬底的通孔蚀刻到蚀刻停止部; 在所述第一石英衬底的第二主表面上形成金属电极,所述金属电极穿过所述第一石英衬底中的通孔以与所述金属蚀刻停止件欧姆接触; 将形成在第一石英衬底的第二主表面上的金属电极接合到形成在承载振荡器驱动电路的衬底上的焊盘,以在其之间形成结合; 并且将临时粘合剂溶解,从而从基板轴承振荡器驱动电路和第一石英基板的一部分经由形成在第一石英基板的第二主表面上的金属电极之间的键与第一石英基板接合的部分而释放第二石英基板 衬垫形成在承载振荡器驱动电路的衬底上。
    • 10. 发明授权
    • Method of fabricating a low frequency quartz resonator
    • 制造低频石英谐振器的方法
    • US07647688B1
    • 2010-01-19
    • US12189617
    • 2008-08-11
    • David T. ChangRandall L. KubenaFrederic P. StrattonPamela R. Patterson
    • David T. ChangRandall L. KubenaFrederic P. StrattonPamela R. Patterson
    • H04R31/00
    • H04R31/00H04R19/005Y10T29/42Y10T29/49005Y10T29/4908
    • A method for fabricating a low frequency quartz resonator includes metalizing a top-side of a quartz wafer with a metal etch stop, depositing a first metal layer over the metal etch stop, patterning the first metal layer to form a top electrode, bonding the quartz wafer to a silicon handle, thinning the quartz wafer to a desired thickness, depositing on a bottom-side of the quartz wafer a hard etch mask, etching the quartz wafer to form a quartz area for the resonator and to form a via through the quartz wafer, removing the hard etch mask without removing the metal etch stop, forming on the bottom side of the quartz wafer a bottom electrode for the low frequency quartz resonator, depositing metal for a substrate bond pad onto a host substrate wafer, bonding the quartz resonator to the substrate bond pad, and removing the silicon handle.
    • 一种用于制造低频石英谐振器的方法包括用金属蚀刻停止器将石英晶片的顶侧金属化,在金属蚀刻停止器上沉积第一金属层,图案化第一金属层以形成顶部电极,将石英 将晶片细化到硅手柄,将石英晶片细化到所需厚度,在石英晶片的底侧上沉积硬蚀刻掩模,蚀刻石英晶片以形成用于谐振器的石英区域,并通过石英形成通孔 晶片,去除硬蚀刻掩模而不去除金属蚀刻停止,在石英晶片的底侧上形成用于低频石英谐振器的底部电极,将用于衬底接合焊盘的金属沉积到主衬底晶片上,将石英谐振器 到基板接合焊盘,并且移除硅手柄。