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1. 发明授权

US5685477A Method for attaching and handling conductive spheres to a substrate 失效
标题翻译：用于将导电球附着和处理到基底的方法
公开(公告)号：US5685477A
公开(公告)日：1997-11-11
申请号：US495987
申请日：1995-06-28
申请人： Debendra Mallik , Joni Hansen , Ashok K. Seth , Neil R. Sugai
发明人： Debendra Mallik , Joni Hansen , Ashok K. Seth , Neil R. Sugai
IPC分类号： H01L21/48 , H01L23/498 , H05K3/34
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49816 , H01L2924/0002 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/082 , H05K3/3489
摘要： Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package. Solder balls are then placed into the fixture holes, adjacent to the surface pads of the package. The solder is then reflowed and the fixture is removed so that the package and solder balls can be subsequently soldered to a printed circuit board.
摘要翻译：将球栅阵列（BGA）集成电路封装焊接到印刷电路板的方法。一种方法包括以下步骤：将焊剂施加到印刷电路板的导电表面焊盘并且用单独的夹具捕获多个焊球。然后将夹具放置在印刷电路板上，并将焊球释放到导电表面焊盘上。去除固定装置，并将集成电路封装放置在焊球上。可以将焊剂焊接到封装的底部，以将封装粘附到球上。然后将焊球回流以将封装附接到板上。焊剂提供一种粘合剂，其在焊料被回流时保持焊球和包装的位置。另一种方法包括将夹具放置在集成电路封装附近的步骤，使得夹具中的多个开口与位于封装的底表面上的表面焊盘对齐。然后将焊球放置在与封装的表面焊盘相邻的固定孔中。然后将焊料回流并去除夹具，使得封装和焊球可以随后焊接到印刷电路板。

2. 发明授权

US5844316A Fixture for handling and attaching conductive spheres to a substrate 失效
标题翻译：用于处理和将导电球附着到基底的夹具
公开(公告)号：US5844316A
公开(公告)日：1998-12-01
申请号：US873312
申请日：1997-06-11
申请人： Debendra Mallik , Joni Hansen , Ashok K. Seth , Neil R. Sugai
发明人： Debendra Mallik , Joni Hansen , Ashok K. Seth , Neil R. Sugai
IPC分类号： H01L21/48 , H01L23/498 , H05K3/34 , H01L23/48
CPC分类号： H05K3/3478 , H01L21/4853 , H01L23/49816 , H01L2924/0002 , H05K2203/041 , H05K2203/0485 , H05K2203/0557 , H05K2203/082 , H05K3/3489
摘要： Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package. Solder balls are then placed into the fixture holes, adjacent to the surface pads of the package. The solder is then reflowed and the fixture is removed so that the package and solder balls can be subsequently soldered to a printed circuit board.
摘要翻译：将球栅阵列（BGA）集成电路封装焊接到印刷电路板的方法。一种方法包括以下步骤：将焊剂施加到印刷电路板的导电表面焊盘并且用单独的夹具捕获多个焊球。然后将夹具放置在印刷电路板上，并将焊球释放到导电表面焊盘上。去除固定装置，并将集成电路封装放置在焊球上。可以将焊剂焊接到封装的底部，以将封装粘附到球上。然后将焊球回流以将封装附接到板上。焊剂提供一种粘合剂，其在焊料被回流时保持焊球和包装的位置。另一种方法包括将夹具放置在集成电路封装附近的步骤，使得夹具中的多个开口与位于封装的底表面上的表面焊盘对齐。然后将焊球放置在与封装的表面焊盘相邻的固定孔中。然后将焊料回流并去除夹具，使得封装和焊球可以随后焊接到印刷电路板。

3. 发明申请

US20050133934A1 Thermal interface material bonding 审中-公开
标题翻译：热界面材料粘合
公开(公告)号：US20050133934A1
公开(公告)日：2005-06-23
申请号：US10744583
申请日：2003-12-23
申请人： James Mellody , Sabina Houle , Carl Deppisch , Joni Hansen , Marvin Burgess , Robert DeBlieck
发明人： James Mellody , Sabina Houle , Carl Deppisch , Joni Hansen , Marvin Burgess , Robert DeBlieck
IPC分类号： B23K1/00 , H01L21/44 , H01L21/48 , H01L23/48
CPC分类号： H01L21/4882 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152
摘要： A system may include placement of a first surface of a solder preform on a first surface of a heat dissipator, and rolling of a roller across a second surface of the solder preform. In some embodiments, the system further includes pressing the solder preform and the heat dissipator against each other.
摘要翻译：系统可以包括将焊料预制件的第一表面放置在散热器的第一表面上，以及滚轮跨越焊料预制件的第二表面的滚动。在一些实施例中，系统还包括将焊料预成型件和散热器彼此挤压。

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