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1. 发明授权

US07770454B2 Laser system and method for non-destructive bond detection and evaluation 有权
标题翻译：用于无损检测和评估的激光系统和方法
公开(公告)号：US07770454B2
公开(公告)日：2010-08-10
申请号：US10950865
申请日：2004-09-27
申请人： David W. Sokol , Craig T. Walters , Jeff L. Dulaney , Steven M. Toller
发明人： David W. Sokol , Craig T. Walters , Jeff L. Dulaney , Steven M. Toller
IPC分类号： G01N29/04
CPC分类号： G01N29/2418 , G01N29/2412 , G01N2291/015 , G01N2291/0231 , G01N2291/0421 , G01N2291/2672
摘要： A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
摘要翻译：用于评估制品中的接合接头的完整性的系统包括：激光配置在激光冲击处理装置中以对物品执行激光冲击处理处理的激光器。梁输送系统采用铰接臂组件将激光发射的辐射能量传递到靠近物品的过程头部。激光冲击加工处理导致形成通过制品传播的冲击波，引起与接合接头特征相互作用的内部应力波活动。传感器检测从物品发出的应力波特征，这表明粘结的完整性。诸如非接触电磁声换能器的检测器以表面运动测量的形式提供应力波特征的测量。

2. 发明授权

US06407375B1 Device monitor for multiple optical signals 失效
标题翻译：多个光信号的设备监控
公开(公告)号：US06407375B1
公开(公告)日：2002-06-18
申请号：US09353674
申请日：1999-07-15
申请人： Mark E. O Loughlin , Craig T. Walters , Patrick M. Kenney , Steven M. Toller , Jeff L. Dulaney
发明人： Mark E. O Loughlin , Craig T. Walters , Patrick M. Kenney , Steven M. Toller , Jeff L. Dulaney
IPC分类号： G01J104
CPC分类号： G01J1/4228 , G01J1/04 , G01J1/0425
摘要： A monitor of a plurality of optical signals utilizing fiber optics which form an array. An image of the array is captured and the captured image is processed for detecting a quality of an optical signal such as the presence, absence, intensity, wavelength, or other quality of the optical signal. A method of monitoring a plurality of optical signals by capturing a plurality of optical signals from an array of signals and detecting a quality of at least one optical signal is also disclosed.
摘要翻译：利用形成阵列的光纤的多个光信号的监视器。捕获阵列的图像，并且处理捕获的图像以检测诸如光信号的存在，不存在，强度，波长或其他质量的光信号的质量。还公开了一种通过从信号阵列捕获多个光信号并检测至少一个光信号的质量来监测多个光信号的方法。

3. 发明授权

US6002102A Hidden surface laser shock processing 失效
标题翻译：隐藏式表面激光冲击加工
公开(公告)号：US6002102A
公开(公告)日：1999-12-14
申请号：US806094
申请日：1997-02-25
申请人： Jeff L. Dulaney , Allan H. Clauer , Steven M. Toller , Craig T. Walters
发明人： Jeff L. Dulaney , Allan H. Clauer , Steven M. Toller , Craig T. Walters
IPC分类号： B23K26/06 , B23K26/00
CPC分类号： B23K26/0069 , B23K26/06 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665
摘要： The invention includes a laser processing method for processing a hidden surface of a workpiece, the hidden surface disposed within a recess having an opening. The method comprises inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface.
摘要翻译：本发明包括用于处理工件的隐藏表面的激光加工方法，所述隐藏表面设置在具有开口的凹部内。该方法包括将反射构件插入到凹部中并且引导相干能量的脉冲以反射离开所述反射构件并撞击工件的隐藏表面以产生冲击波。改变凹坑的表面可以被修改为激光冲击处理隐藏的表面。

4. 发明授权

US07752953B2 Method and system for neutralization of buried mines 失效
标题翻译：埋地雷达中和方法与系统
公开(公告)号：US07752953B2
公开(公告)日：2010-07-13
申请号：US10386644
申请日：2003-03-12
申请人： David W. Sokol , Jeff L. Dulaney , Craig T. Walters
发明人： David W. Sokol , Jeff L. Dulaney , Craig T. Walters
IPC分类号： B64D1/04 , F41F5/00
CPC分类号： F41H11/12 , F41H11/32 , F41H13/0062
摘要： A system for neutralizing a buried mine includes a laser that is configured to generate laser energy that communicates through the covering ground material and accesses the mine in a manner sufficient to neutralize the mine. Neutralization can occur by deflagration or detonation. The laser includes a solid-state lasing medium that is run substantially uncooled during the lasing run. Namely, the lasing medium is operated without cooling until the lasing medium reaches a temperature where thermal population in a lower laser level begins to significantly lower inversion density. Following completion of the lasing run, the lasing medium is cooled at a rate limited only by a thermal stress fracture level of the lasing medium. Operation of the laser in this manner permits the laser to deliver high-irradiance, high-repetition rate pulses according to a burst mode operation that successfully accomplishes neutralization in a desired time period. The burst mode also facilitates preferential selection of the mechanism of laser energy-material interaction to promote rapid penetration rates.
摘要翻译：用于中和埋地矿的系统包括激光器，其被配置为产生激光能量，所述激光能量通过覆盖的地面材料进行通信并以足以中和矿井的方式进入矿井。中和可以通过爆燃或爆炸发生。激光器包括在激光运行期间基本上未冷却的固态激光介质。即，激光介质在没有冷却的情况下运行，直到激光介质达到较低激光水平的热量开始显着降低反转密度的温度。在激光运行完成之后，激光介质以仅由激光介质的热应力断裂水平限制的速率冷却。以这种方式操作激光器允许激光器根据在期望的时间段内成功实现中和的突发模式操作传送高辐照，高重复率脉冲。突发模式还有助于优先选择激光能量 - 材料相互作用的机制，以促进快速渗透速率。

5. 发明授权

US07776165B1 Method of modifying a workpiece following laser shock processing 有权
标题翻译：激光冲击加工后修改工件的方法
公开(公告)号：US07776165B1
公开(公告)日：2010-08-17
申请号：US12201519
申请日：2008-08-29
申请人： Jeff L. Dulaney , Steven M. Toller , Allan H. Clauer
发明人： Jeff L. Dulaney , Steven M. Toller , Allan H. Clauer
IPC分类号： C21D1/09
CPC分类号： C22F3/00 , C21D10/005 , C21D2261/00 , Y10T428/12493
摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
摘要翻译：制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。在一个步骤中，材料从加工的工件的压缩残余应力区域移除。替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。材料也可以沉积到激光冲击处理的表面上。

6. 发明授权

US06852179B1 Method of modifying a workpiece following laser shock processing 失效
标题翻译：激光冲击加工后修改工件的方法
公开(公告)号：US06852179B1
公开(公告)日：2005-02-08
申请号：US09590866
申请日：2000-06-09
申请人： Steven M. Toller , Allan H. Clauer , Jeff L. Dulaney
发明人： Steven M. Toller , Allan H. Clauer , Jeff L. Dulaney
IPC分类号： C21D10/00 , C22F3/00
CPC分类号： C22F3/00 , C21D10/005 , C21D2261/00 , Y10T428/12493
摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
摘要翻译：制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。在一个步骤中，材料从加工的工件的压缩残余应力区域移除。替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。材料也可以沉积到激光冲击处理的表面上。

7. 发明授权

US10048494B2 Protection of laser bond inspection optical components 有权
公开(公告)号：US10048494B2
公开(公告)日：2018-08-14
申请号：US14554011
申请日：2014-11-25
申请人： Steven M. Toller , David Sokol , Mark E. O'Loughlin , Jeff L. Dulaney
发明人： Steven M. Toller , David Sokol , Mark E. O'Loughlin , Jeff L. Dulaney
IPC分类号： G01N29/04 , G02B27/00 , G02B1/11 , G01N19/04 , B23K26/142 , G01N29/24 , B23K26/16 , G02B1/18 , B23K26/146 , G01N21/84
摘要： Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

8. 发明授权

US06236016B1 Oblique angle laser shock processing 有权
标题翻译：斜角激光冲击加工
公开(公告)号：US06236016B1
公开(公告)日：2001-05-22
申请号：US09234381
申请日：1999-01-20
申请人： Jeff L. Dulaney , Allan H. Clauer , Steven M. Toller
发明人： Jeff L. Dulaney , Allan H. Clauer , Steven M. Toller
IPC分类号： B23K2600
CPC分类号： C22F3/00 , B23K26/06 , B23K26/064 , B23K26/0648 , B23K26/073 , C21D10/005
摘要： The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves therethrough. The method includes controlling the incident angle &THgr; of the laser beam applied to the workpiece so that the required residual stresses are created in the workpiece. Particular methods of control such as lenses, polarizers, and particular transparent overlay geometries are shown. The apparatus includes structure for controlling the position and incident angle of the laser beam then controlling the polarization and/or the shape of the incident impact area, based on such incident angle &THgr; or thickness of the workpiece.
摘要翻译：本发明涉及通过提供冲击波来改善固体材料性能的方法和装置。该方法包括控制入射角＆THgr; 的激光束施加到工件上，使得在工件中产生所需的残余应力。示出了诸如透镜，偏振器和特定的透明覆盖几何形状的特定的控制方法。该装置包括用于基于这样的入射角度控制激光束的位置和入射角然后控制入射冲击区域的偏振和/或形状的结构。或工件的厚度。

9. 发明授权

US08132460B1 Laser induced bond delamination 有权
标题翻译：激光诱导键分层
公开(公告)号：US08132460B1
公开(公告)日：2012-03-13
申请号：US12435448
申请日：2009-05-05
申请人： Steven M. Toller , Jeff L. Dulaney
发明人： Steven M. Toller , Jeff L. Dulaney
IPC分类号： G01N29/04
CPC分类号： G01N29/2412 , G01N29/2418 , G01N2291/015 , G01N2291/0231 , G01N2291/0258 , G01N2291/02854 , G01N2291/0421 , G01N2291/2672 , G01N2291/2694
摘要： Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
摘要翻译：提供了方法，系统和装置，用于在粘合结合物内以受控的方式产生粘结分层。在一个实施例中，用于引起粘合制品的粘合中的缺陷的系统包括激光和激光处理器头。激光处理器头包括壳体，设置在壳体内的透镜，设置在壳体内的至少一个磁体和设置在壳体内的至少一个传感器。该系统能够应用足够的能量注量的激光脉冲来引起键的局部弱点。

10. 发明授权

US07470335B2 Method of modifying a workpiece following laser shock processing 有权
标题翻译：激光冲击加工后修改工件的方法
公开(公告)号：US07470335B2
公开(公告)日：2008-12-30
申请号：US11023228
申请日：2004-12-27
申请人： Steven M. Toller , Allan H. Clauer , Jeff L. Dulaney
发明人： Steven M. Toller , Allan H. Clauer , Jeff L. Dulaney
IPC分类号： C21D1/09
CPC分类号： C22F3/00 , C21D10/005 , C21D2261/00 , Y10T428/12493
摘要： A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece. Material may be removed from the compressive residual stress region through a workpiece surface different from the laser shock processed surface. Material may also be deposited onto the laser shock processed surface.
摘要翻译：制造工件的方法涉及对先前已进行了激光冲击加工的工件进行各种后处理零件修改工序中的任一种。在一个步骤中，材料从加工的工件的压缩残余应力区域移除。替代地，工件可以设置有尺寸过大的尺寸，使得去除工艺去除足以产生具有基本上符合设计规格的尺寸的加工工件的材料量。替代地，材料去除过程适于建立与工件表现出最大压缩残余应力的深度一致的材料去除的穿透深度。或者，对工件进行第一次高强度激光冲击加工处理，然后从压缩残余应力区域去除材料，然后对工件进行第二次低强度激光冲击加工处理。材料可以通过不同于激光冲击处理表面的工件表面从压缩残余应力区域移除。材料也可以沉积到激光冲击处理的表面上。

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