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1. 发明申请

US20050142495A1 Methods of controlling multilayer foil ignition 审中-公开
标题翻译：控制多层箔点火的方法
公开(公告)号：US20050142495A1
公开(公告)日：2005-06-30
申请号：US10959502
申请日：2004-10-07
申请人： David Peter Van Heerden , Etienne Besnoin , Stephen Spey , Timothy Rude , Michael Brown , Dale Deger , Ellen Heian , Somasundaram Valliappan , Omar Knio , Timothy Weihs
发明人： David Peter Van Heerden , Etienne Besnoin , Stephen Spey , Timothy Rude , Michael Brown , Dale Deger , Ellen Heian , Somasundaram Valliappan , Omar Knio , Timothy Weihs
IPC分类号： B01J19/00 , B01J19/08 , B01J19/10 , B01J19/12 , G03C3/00 , G06F19/00
CPC分类号： B23K35/0233 , B32B15/01 , F24V30/00 , G16C20/10
摘要： Embodiments of the invention include a method of simulating an ignition of a reactive multilayer foil. Other embodiments include various methods of igniting a reactive multilayer foil by transferring energy from an energy source to a reactive multilayer foil.
摘要翻译：本发明的实施例包括模拟反应性多层箔的点燃的方法。其他实施方案包括通过将能量从能量源转移到反应性多层箔来点燃反应性多层箔的各种方法。

2. 发明申请

US20060068179A1 Fuse applications of reactive composite structures 审中-公开
标题翻译：保险丝应用的反应性复合结构
公开(公告)号：US20060068179A1
公开(公告)日：2006-03-30
申请号：US11228085
申请日：2005-09-16
申请人： Timothy Weihs , Ellen Heian , Ramzi Vincent , Somasundaram Valliappan , Etienne Besnoin
发明人： Timothy Weihs , Ellen Heian , Ramzi Vincent , Somasundaram Valliappan , Etienne Besnoin
IPC分类号： B32B3/00
CPC分类号： H01H85/06 , Y10T428/24917
摘要： In accordance with the invention, a fuse comprises a reactive composite structure to interrupt the flow of current in a circuit. The term fuse, as used herein, is intended to cover current interrupters generically and thus encompasses fuses, circuit breakers and other devices for interrupting the flow of current through a conductor. Reactive composite structures comprise two or more phases of materials spaced in a controlled fashion throughout a composite in uniform layers, local layers, islands, or particles. Upon appropriate excitation, the materials undergo an exothermic chemical reaction that spreads rapidly through the composite structure generating heat and light. Moreover a reactive composite structure can break apart upon reaction. This breakage can rapidly interrupt the flow of current through the reactive composite structure. Such structures can provide high-speed current interruption. In addition, reactive composite structures can have abrupt reaction initiation thresholds such that a pulse of energy of a certain magnitude may initiate a clearing reaction but a slightly smaller pulse of energy may not. Such a reactive composite structure can thus provide a high speed, highly sensitive current interrupter.
摘要翻译：根据本发明，保险丝包括用于中断电路中的电流的电抗复合结构。本文所用的术语“熔断器”旨在一般地覆盖电流断流器，因此包括熔断器，断路器和用于中断通过导体的电流流动的其它装置。反应性复合结构包括以均匀层，局部层，岛或颗粒在整个复合材料中以受控的方式间隔的两种或多种材料相。在适当的激发下，材料经受放热的化学反应，其迅速扩散通过产生热和光的复合结构。此外，反应性复合结构可以在反应时分裂。这种断裂可以快速地中断通过反应性复合结构的电流的流动。这种结构可以提供高速电流中断。此外，反应性复合结构可以具有突然的反应起始阈值，使得一定量级的能量脉冲可能引发清除反应，但是稍微较小的能量脉冲可能不起作用。因此，这种反应性复合结构可以提供高速，高灵敏度的电流中断器。

3. 发明申请

US20050136270A1 Method of controlling thermal waves in reactive multilayer joining and resulting product 审中-公开
标题翻译：控制反应性多层接合热产生的方法
公开(公告)号：US20050136270A1
公开(公告)日：2005-06-23
申请号：US10843352
申请日：2004-05-12
申请人： Etienne Besnoin , Jiaping Wang , Alan Duckham , Stephen Spey , David Heerden , Timothy Weihs , Omar Knio
发明人： Etienne Besnoin , Jiaping Wang , Alan Duckham , Stephen Spey , David Heerden , Timothy Weihs , Omar Knio
IPC分类号： B23K1/00 , B23K1/19 , B23K31/02 , B23K31/12 , B23K35/00 , B23K35/02 , B23K35/34 , C06B45/14 , G05B17/02 , B32B15/04 , B32B9/00
CPC分类号： B23K1/0016 , B23K31/02 , B23K31/12 , B23K35/001 , B23K35/0238 , B23K35/34 , B23K2101/40 , B23K2103/05 , B23K2103/10 , C06B45/14 , G05B17/02 , Y10T428/12493 , Y10T428/12535
摘要： An embodiment of the invention includes a method of simulating a behavior of an energy distribution within a soldered or brazed assembly to predict various physical parameters of the assembly. The assembly typically includes a reactive multilayer material. The method comprises the steps of providing an energy evolution equation having an energy source term associated with a self-propagating reaction that originates within the reactive multilayer material. The method also includes the steps of discretizing the energy evolution equation, and determining the behavior of the energy distribution in the assembly by integrating the discretized energy evolution equation using other parameters associated with the assembly.
摘要翻译：本发明的实施例包括模拟焊接或钎焊组件内的能量分布的行为以预测组件的各种物理参数的方法。组件通常包括反应性多层材料。该方法包括以下步骤：提供能量演化方程，其具有与源自反应性多层材料的自蔓延反应相关联的能量源项。该方法还包括离散化能量演化方程的步骤，以及通过使用与组件相关联的其它参数来整合离散化能量演化方程来确定组件中能量分布的行为。

4. 发明申请

US20050051607A1 Nanostructured soldered or brazed joints made with reactive multilayer foils 有权
标题翻译：用反应性多层箔制成的纳米结构焊接或钎焊接头
公开(公告)号：US20050051607A1
公开(公告)日：2005-03-10
申请号：US10844816
申请日：2004-05-13
申请人： Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy Weihs
发明人： Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy Weihs
IPC分类号： B23K1/00 , B23K20/00 , B23K20/06 , B23K20/08 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/02 , B23K35/34 , B32B15/01 , C06B21/00 , C06B45/14 , C23C14/14 , F24V30/00 , G05B17/02 , H05K3/34
CPC分类号： B23K1/0006 , B23K1/0016 , B23K20/00 , B23K20/06 , B23K20/08 , B23K20/165 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/0233 , B23K35/0238 , B23K35/34 , B23K2101/40 , B23K2103/05 , B23K2103/10 , B32B15/01 , B32B15/017 , C06B21/0083 , C06B45/14 , C23C14/14 , F24V30/00 , G05B17/02 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12493 , Y10T428/12986
摘要： Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
摘要翻译：纳米结构多层箔片中的自蔓延形成反应在室温下提供快速的热量爆发，因此可作为局部热源熔化焊料或钎焊层并连接材料。该反应性接合方法为组件提供非常局部的加热并且跨接头快速冷却。快速冷却导致焊料或钎焊材料的非常精细的微结构。焊料或钎焊材料的细微微结构的尺度取决于随着箔和组件的几何形状和性质而变化的反应性接头的冷却速率。由于缓慢的冷却速率，熔化焊料在熔炉中形成的接头的焊料或钎焊层的微观结构更加粗糙。与具有更粗糙的焊料或钎焊微观结构的常规炉连接制成的反应性接头，具有更好的焊料或钎焊微观结构显示出更高的剪切强度。预期与传统的炉接头相比，反应接头也可具有更好的疲劳特性。

5. 发明申请

US20080272181A1 METHOD FOR MAKING NANOSTRUCTURED SOLDERED OR BRAZED JOINTS WITH REACTIVE MULTILAYER FOILS 审中-公开
标题翻译：制造具有反应性多层膜的纳米结构的或焊接接头的方法
公开(公告)号：US20080272181A1
公开(公告)日：2008-11-06
申请号：US12041857
申请日：2008-03-04
申请人： Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy Weihs
发明人： Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy Weihs
IPC分类号： B23K1/00
CPC分类号： B23K1/0006 , B23K1/0016 , B23K20/00 , B23K20/06 , B23K20/08 , B23K20/165 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/0233 , B23K35/0238 , B23K35/34 , B23K2101/40 , B23K2103/05 , B23K2103/10 , B32B15/01 , B32B15/017 , C06B21/0083 , C06B45/14 , C23C14/14 , F24V30/00 , G05B17/02 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12493 , Y10T428/12986
摘要： Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
摘要翻译：纳米结构多层箔片中的自蔓延形成反应在室温下提供快速的热量爆发，因此可作为局部热源熔化焊料或钎焊层并连接材料。该反应性接合方法为组件提供非常局部的加热并且跨接头快速冷却。快速冷却导致焊料或钎焊材料的非常精细的微结构。焊料或钎焊材料的细微微结构的尺度取决于随着箔和组件的几何形状和性质而变化的反应性接头的冷却速率。由于缓慢的冷却速率，熔化焊料在熔炉中形成的接头的焊料或钎焊层的微观结构更加粗糙。与具有更粗糙的焊料或钎焊微观结构的常规炉连接制成的反应性接头，具有更好的焊料或钎焊微观结构显示出更高的剪切强度。预期与传统的炉接头相比，反应接头也可具有更好的疲劳特性。

6. 发明申请

US20080000949A1 Method of Joining Using Reactive Multilayer Foils With Enhanced Control of Molten Joining Materials 审中-公开
标题翻译：使用增强控制熔融接合材料的反应多层箔连接方法
公开(公告)号：US20080000949A1
公开(公告)日：2008-01-03
申请号：US11835818
申请日：2007-08-08
申请人： Jiaping Wang , Omar Knio , Timothy Weihs , Etienne Besnoin
发明人： Jiaping Wang , Omar Knio , Timothy Weihs , Etienne Besnoin
IPC分类号： B23K20/02 , B23K20/16
CPC分类号： G05B17/02 , B23K1/0006 , B23K1/0016 , B23K20/00 , B23K20/06 , B23K20/08 , B23K20/165 , B23K28/00 , B23K31/02 , B23K31/12 , B23K35/0233 , B23K35/0238 , B23K35/34 , B23K2101/40 , B23K2103/05 , B23K2103/10 , B32B15/01 , B32B15/017 , C06B21/0083 , C06B45/14 , C23C14/14 , F24V30/00 , H05K3/3463 , H05K3/3494 , H05K2203/0405 , H05K2203/1163 , Y10T428/12632
摘要： In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.
摘要翻译：根据本发明，通过在它们之间设置反应性多层箔和一层或多层可熔融连接材料如钎焊或焊料来连接材料体。主体被压在一起抵靠箔和接合材料，并且箔被点燃以熔化接合材料。压力接近临界压力，并且通常产生具有至少70-85％的强度的接头，该最大强度在实际最大压力下可产生。因此，例如，在约100MPa的施加压力下制造的反应形成的不锈钢焊接接头可以在约10kPa的临界施加压力下具有基本上相同的强度。该方法的优点包括最小化钎焊或焊料挤出，并减少设备和加工成本，特别是在大体积的连接中。

7. 发明申请

US20060108365A1 Hermetically sealed product and related methods of manufacture 审中-公开
标题翻译：密封产品及相关制造方法
公开(公告)号：US20060108365A1
公开(公告)日：2006-05-25
申请号：US11261579
申请日：2005-10-31
申请人： David Van Heerden , Dale Deger , Timothy Weihs , Omar Knio
发明人： David Van Heerden , Dale Deger , Timothy Weihs , Omar Knio
IPC分类号： B65D41/00 , B65B7/28 , B65D53/00
CPC分类号： B81C1/00269 , B65D77/10 , B81C2203/0109 , B81C2203/019 , B81C2203/038
摘要： Embodiments of the invention include a method for sealing a container. The method includes, providing at least two components of the container, positioning a crushable material between the at least two components, positioning a reactive multilayer material between the at least two components, deforming the crushable material so as to form a seal between the at least two components, chemically transforming the reactive multilayer material so as to join the at least two components.
摘要翻译：本发明的实施例包括用于密封容器的方法。该方法包括：提供容器的至少两个部件，将可压碎材料定位在至少两个部件之间，将反应性多层材料定位在至少两个部件之间，使可压碎材料变形，从而在至少两个部件之间形成密封两个组分，化学转化反应性多层材料以便连接至少两个组分。

8. 发明申请

US20060032193A1 Hermetically sealed product and related methods of manufacture 失效
公开(公告)号：US20060032193A1
公开(公告)日：2006-02-16
申请号：US11261543
申请日：2005-10-31
申请人： David Peter Heerden , Dale Deger , Timothy Weihs , Omar Knio
发明人： David Peter Heerden , Dale Deger , Timothy Weihs , Omar Knio
IPC分类号： B65B7/28
CPC分类号： B81C1/00269 , B65D77/10 , B81C2203/0109 , B81C2203/019 , B81C2203/038
摘要： Embodiments of the invention include a method for sealing a container. The method includes, providing at least two components of the container, positioning a crushable material between the at least two components, positioning a reactive multilayer material between the at least two components, deforming the crushable material so as to form a seal between the at least two components, chemically transforming the reactive multilayer material so as to join the at least two components.

9. 发明申请

US20050121499A1 Methods and device for controlling pressure in reactive multilayer joining and resulting product 有权
标题翻译：用于控制反应性多层接合和结果产品中的压力的方法和装置
公开(公告)号：US20050121499A1
公开(公告)日：2005-06-09
申请号：US10976877
申请日：2004-11-01
申请人： David Heerden , Jesse Newson , Timothy Rude , Omar Knio , Timothy Weihs
发明人： David Heerden , Jesse Newson , Timothy Rude , Omar Knio , Timothy Weihs
IPC分类号： B23K1/00 , B23K1/19 , B23K3/08 , B23K35/00 , B23K35/02 , B23K35/12 , B23K35/34 , B32B15/01 , C06B45/14
CPC分类号： B23K35/007 , B23K1/0006 , B23K1/0008 , B23K1/19 , B23K3/087 , B23K35/001 , B23K35/0238 , B23K35/0272 , B23K35/34 , C06B45/14
摘要： The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pressure on the two components in contact with the reactive multilayer foil via a compliant element, and initiating a chemical transformation of the reactive multilayer foil so as to physically join the at least two components. The invention also includes two components joined using the aforementioned method.
摘要翻译：本发明包括连接两个部件的方法。该方法包括提供至少两个要连接的部件，反应性多层箔和顺应元件，将反应性多层箔放置在至少两个部件之间，通过柔性元件向与反应性多层箔接触的两个部件施加压力并且启动反应性多层箔的化学转化以物理连接至少两种组分。本发明还包括使用上述方法连接的两个部件。

10. 发明申请

US20070257364A1 METHODS OF REACTIVE COMPOSITE JOINING WITH MINIMAL ESCAPE OF JOINING MATERIAL 审中-公开
标题翻译：反应性复合材料接合与接合材料最小切割方法
公开(公告)号：US20070257364A1
公开(公告)日：2007-11-08
申请号：US11741422
申请日：2007-04-27
申请人： David Van Heerden , Timothy Rude , Jesse Newson , Zhaojuan He , Etienne Besnoin , Ramzi Vincent , Timothy Weihs
发明人： David Van Heerden , Timothy Rude , Jesse Newson , Zhaojuan He , Etienne Besnoin , Ramzi Vincent , Timothy Weihs
IPC分类号： H01L23/48
CPC分类号： H01L24/29 , B23K1/0006 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/16 , H01L2224/27013 , H01L2224/29101 , H01L2224/29111 , H01L2224/73253 , H01L2224/83051 , H01L2224/838 , H01L2924/00013 , H01L2924/01013 , H01L2924/01029 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15747 , H01L2924/1579 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
摘要： The present inventors have observed that in some applications of reactive composite joining there is escape of a portion of the molten joining material through the edges of the joining regions. Such escape is not only a waste of expensive material (e.g. gold or indium) but also a reduction from the optimal thickness of the joining regions. In some applications, such escape also presents risk of short circuits or even fire. In this invention, two approaches are taken toward preventing damage to surroundings by the escape of molten joining material. First, escape may be prevented by trapping or containing the molten material near the joint, using barriers, dams, or similar means. Second, escape may be reduced by adjusting parameters within the joint, such as solder composition, joining pressure, or RCM thickness.
摘要翻译：本发明人已经观察到，在反应性复合物接合的一些应用中，熔融接合材料的一部分通过接合区域的边缘逸出。这种逃逸不仅浪费昂贵的材料（例如金或铟），而且还减少了连接区域的最佳厚度。在某些应用中，这种逃生也存在短路或甚至火灾的风险。在本发明中，采取两种途径来防止熔融接合材料的逸出对周围环境的损害。首先，可以通过使用屏障，水坝或类似手段在接头附近捕获或容纳熔融材料来防止逃逸。其次，通过调节接头内的参数，例如焊料组成，接合压力或RCM厚度，可以减少泄漏。

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