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1. 发明授权

US08329053B2 Micromachined transducers and method of fabrication 有权
标题翻译：微机械传感器和制造方法
公开(公告)号：US08329053B2
公开(公告)日：2012-12-11
申请号：US12623768
申请日：2009-11-23
申请人： David Martin , Joel Philliber
发明人： David Martin , Joel Philliber
IPC分类号： C03C15/00
CPC分类号： B81C1/00904 , B81B2201/0271 , H01L41/0805
摘要： In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
摘要翻译：根据说明性实施例，描述了一种制造换能器的方法。该方法包括在衬底的第一表面上提供换能器，其中衬底包括厚度。该方法还包括在第二表面上图案化掩模。掩模包括用于形成刻划蚀刻的开口。该方法包括通过掩模中的开口蚀刻而不是通过衬底的厚度，以提供刻划蚀刻。

2. 发明授权

US08231795B2 Micromachined horn 有权
标题翻译：微加工喇叭
公开(公告)号：US08231795B2
公开(公告)日：2012-07-31
申请号：US12434092
申请日：2009-05-01
申请人： David Martin , Joel Philliber , John Choy
发明人： David Martin , Joel Philliber , John Choy
IPC分类号： B81C1/00
CPC分类号： H04R1/30 , H01L27/20 , H04R17/005 , H04R2201/003 , Y10T29/42
摘要： An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
摘要翻译：声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

3. 发明授权

US07888844B2 Temperature control of micromachined transducers 有权
标题翻译：微加工传感器的温度控制
公开(公告)号：US07888844B2
公开(公告)日：2011-02-15
申请号：US12570298
申请日：2009-09-30
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/08
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

4. 发明授权

US08280080B2 Microcap acoustic transducer device 有权
标题翻译：微型声学传感器装置
公开(公告)号：US08280080B2
公开(公告)日：2012-10-02
申请号：US12430966
申请日：2009-04-28
申请人： Joel Philliber , John Choy , David Martin
发明人： Joel Philliber , John Choy , David Martin
IPC分类号： H04R25/00 , H04R9/08 , H04R11/04 , H04R17/02 , H04R19/04 , H04R21/02 , H04R1/02
CPC分类号： H04R31/00
摘要： A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.
摘要翻译：一种器件包括第一晶片，第二晶片，将第一晶片连接到第二晶片以在第一晶片和第二晶片之间限定空腔的垫圈，以及设置在第一晶片上并设置在第一晶片之间的空腔内的声换能器第一晶片和第二晶片。提供一个或多个孔，用于在声换能器和装置的外部之间传递声信号。可以在空腔本身中形成孔，或者可以将空腔气密地密封。孔可以完全穿过第一晶片形成，并且直接位于声换能器的至少一部分下方。

5. 发明申请

US20110120971A1 MICROMACHINED TRANSDUCERS AND METHOD OF FABRICATION 有权
标题翻译：微型传感器和制造方法
公开(公告)号：US20110120971A1
公开(公告)日：2011-05-26
申请号：US12623768
申请日：2009-11-23
申请人： David Martin , Joel Philliber
发明人： David Martin , Joel Philliber
IPC分类号： C23F1/02 , C23C14/46
CPC分类号： B81C1/00904 , B81B2201/0271 , H01L41/0805
摘要： In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.
摘要翻译：根据说明性实施例，描述了一种制造换能器的方法。该方法包括在衬底的第一表面上提供换能器，其中衬底包括厚度。该方法还包括在第二表面上图案化掩模。掩模包括用于形成刻划蚀刻的开口。该方法包括通过掩模中的开口蚀刻而不是通过衬底的厚度，以提供刻划蚀刻。

6. 发明授权

US09088850B2 Micromachined horn 有权
标题翻译：微加工喇叭
公开(公告)号：US09088850B2
公开(公告)日：2015-07-21
申请号：US13536917
申请日：2012-06-28
申请人： David Martin , Joel Philliber , John Choy
发明人： David Martin , Joel Philliber , John Choy
IPC分类号： H04R1/30 , H01L27/20 , H04R17/00
CPC分类号： H04R1/30 , H01L27/20 , H04R17/005 , H04R2201/003 , Y10T29/42
摘要： An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
摘要翻译：声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

7. 发明授权

US08981624B2 Temperature control of micromachined transducers 有权
标题翻译：微加工传感器的温度控制
公开(公告)号：US08981624B2
公开(公告)日：2015-03-17
申请号：US12978762
申请日：2010-12-27
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/09 , B81B3/00 , G10K9/125 , G10K9/18 , H04R17/02 , H04R31/00 , H01L41/31
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

8. 发明申请

US20100327702A1 TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS 有权
标题翻译：微型传感器的温度控制
公开(公告)号：US20100327702A1
公开(公告)日：2010-12-30
申请号：US12570298
申请日：2009-09-30
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/04 , H01L41/22
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

9. 发明申请

US20060170309A1 Method of determining adhesion quality and apparatus embodying the method 失效
标题翻译：确定粘附质量的方法和体现该方法的设备
公开(公告)号：US20060170309A1
公开(公告)日：2006-08-03
申请号：US11049116
申请日：2005-01-31
申请人： Joel Philliber
发明人： Joel Philliber
IPC分类号： H01L41/08
CPC分类号： H03H3/02 , H03H9/02094 , H03H9/173 , Y10T29/42
摘要： A method of determining adhesion quality and apparatus embodying the method are disclosed. The apparatus includes a substrate, a seed layer, and a resonator. The substrate defines a cavity and has a doped portion proximal to the cavity. The seed layer is disposed above the cavity. The resonator includes a bottom electrode on the seed layer, a piezoelectric portion on the bottom electrode, and a top electrode on the piezoelectric portion. To test the quality of adhesion of the seed layer to the substrate, one or more electrical property is measured between the doped portion and the bottom electrode and compared to a threshold value.
摘要翻译：公开了一种确定附着质量的方法和体现该方法的装置。该装置包括衬底，种子层和谐振器。衬底限定空腔并且具有靠近空腔的掺杂部分。种子层设置在空腔上方。谐振器包括种子层上的底部电极，底部电极上的压电部分和压电部分上的顶部电极。为了测试种子层与基底的粘附质量，在掺杂部分和底部电极之间测量一个或多个电性能，并将其与阈值进行比较。

10. 发明申请

US20100327695A1 Multi-frequency acoustic array 有权
标题翻译：多声道阵列
公开(公告)号：US20100327695A1
公开(公告)日：2010-12-30
申请号：US12494847
申请日：2009-06-30
申请人： Atul Goel , Osvaldo Buccafusca , Steven Martin , Joel Philliber
发明人： Atul Goel , Osvaldo Buccafusca , Steven Martin , Joel Philliber
IPC分类号： G10K9/125
CPC分类号： B06B1/0611 , B06B1/0622
摘要： An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.
摘要翻译：一种装置包括衬底和设置在衬底上的换能器，每个换能器包括不同的共振频率。换能器装置包括被配置为传输信号或接收信号或两者的电路。换能器装置还包括一个包括多个压电超声波换能器（PMUT）的换能器块，其中每个PMUT; 以及被配置为将信号从所述换能器块提供给所述电路并且将所述电路的信号提供给所述换能器块的互连。

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