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1. 发明授权

US07751186B2 Chassis having a bypass channel for air flow 有权
标题翻译：底盘具有用于气流的旁路通道
公开(公告)号：US07751186B2
公开(公告)日：2010-07-06
申请号：US11926890
申请日：2007-10-29
申请人： David L. Moss , Paul T. Artman , William Coxe , Shawn P. Hoss
发明人： David L. Moss , Paul T. Artman , William Coxe , Shawn P. Hoss
IPC分类号： H05K7/20 , H05K5/00 , G06F1/20
CPC分类号： G06F1/20
摘要： A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.
摘要翻译：公开了一种具有用于空气流动的旁路通道的底架。底盘包括靠近机箱一侧的旁路通道。旁路通道可以由机箱的侧面和计算系统的模块（诸如计算系统的处理器模块）形成。第二个模块位于机箱的后部。可以使用物理障碍物将空气从旁路通道引导到第二模块，其可以是I / O模块。在空气流动的I / O模块的相对侧放置一个增压室。增压室的存在在第二模块的相对侧产生负压，导致空气穿过第二模块进入增压室。机箱后部的风扇使空气离开集气室并离开机箱。

2. 发明申请

US20090109612A1 Chassis Having a Bypass Channel for Air Flow 有权
标题翻译：具有旁路通道用于气流的底盘
公开(公告)号：US20090109612A1
公开(公告)日：2009-04-30
申请号：US11926890
申请日：2007-10-29
申请人： David L. Moss , Paul T. Artman , William Coxe, III , Shawn P. Hoss
发明人： David L. Moss , Paul T. Artman , William Coxe, III , Shawn P. Hoss
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： G06F1/20
摘要： A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.
摘要翻译：公开了一种具有用于空气流动的旁路通道的底架。底盘包括靠近机箱一侧的旁路通道。旁路通道可以由机箱的侧面和计算系统的模块（诸如计算系统的处理器模块）形成。第二个模块位于机箱的后部。可以使用物理障碍物将空气从旁路通道引导到第二模块，其可以是I / O模块。在空气流动的I / O模块的相对侧放置一个增压室。增压室的存在在第二模块的相对侧产生负压，导致空气穿过第二模块进入增压室。机箱后部的风扇使空气离开集气室并离开机箱。

3. 发明申请

US20080013282A1 Method and apparatus for cooling a memory device 有权
公开(公告)号：US20080013282A1
公开(公告)日：2008-01-17
申请号：US11484458
申请日：2006-07-11
申请人： Shawn P. Hoss , Paul T. Artman
发明人： Shawn P. Hoss , Paul T. Artman
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L25/0655 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.

4. 发明申请

US20080106868A1 THERMAL INTERFACE MATERIAL VOLUME BETWEEN THERMAL CONDUCTING MEMBERS 审中-公开
标题翻译：热导热元件之间的热界面材料体积
公开(公告)号：US20080106868A1
公开(公告)日：2008-05-08
申请号：US11556272
申请日：2006-11-03
申请人： Shawn P. Hoss , Paul T. Artman
发明人： Shawn P. Hoss , Paul T. Artman
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a first thermal conducting member including a first thermal transfer surface. A second thermal conducting member including a second thermal transfer surface that is located adjacent the first thermal transfer surface. A thermal interface material engages the first thermal transfer surface and the second thermal transfer surface. A channel is defined adjacent the first thermal transfer surface and the second thermal transfer surface, whereby an excess of the thermal interface material is located in the channel. The first thermal conducting member may be thermally coupled to an information handling system processor and the channel may prevent the thermal interface material from engaging sensitive surfaces adjacent the processor.
摘要翻译：散热装置包括第一导热构件，其包括第一热转印表面。第二导热构件，其包括位于第一热转印表面附近的第二热转印表面。热界面材料接合第一热转印表面和第二热转印表面。通道限定在第一热转印表面和第二热转印表面附近，由此多余的热界面材料位于通道中。第一导热构件可以热耦合到信息处理系统处理器，并且通道可以防止热界面材料接合与处理器相邻的敏感表面。

5. 发明授权

US08160754B2 Synthetic air jet cooling system 有权
标题翻译：合成空气喷射冷却系统
公开(公告)号：US08160754B2
公开(公告)日：2012-04-17
申请号：US12624002
申请日：2009-11-23
申请人： Paul T. Artman , Dominick Lovicott , Shawn P. Hoss , William K. Coxe, III
发明人： Paul T. Artman , Dominick Lovicott , Shawn P. Hoss , William K. Coxe, III
IPC分类号： G05D23/00
CPC分类号： G06F1/206 , Y02D10/16
摘要： A synthetic air jet cooling system includes a first component. A fan is in fluid communication with the first component. A synthetic air jet is located adjacent the first component. A thermal management engine is coupled to the first component, the fan, and the synthetic air jet. The thermal management engine is operable to receive a first component operating condition, compare the first component operating condition to a target operating condition, and increase a fan fluid flow rate from the fan and a synthetic air jet fluid flow rate from the synthetic air jet in order to reduce the difference between the first component operating condition the target operating condition. The thermal management engine increases the synthetic air jet fluid flow rate from the synthetic air jet to a predetermined synthetic air jet fluid flow rate prior to increasing the fan fluid flow rate from the fan in order to provide improvements in power consumption, airflow, and acoustics.
摘要翻译：合成空气喷射冷却系统包括第一部件。风扇与第一部件流体连通。合成空气射流位于第一组件附近。热管理引擎联接到第一部件，风扇和合成空气喷嘴。热管理引擎可操作以接收第一部件操作条件，将第一部件操作条件与目标操作条件进行比较，并且增加来自风扇的风扇流体流速和来自合成空气射流的合成空气喷射流体流速以减少第一部件运行状态与目标运行状态的差异。在增加来自风扇的风扇流体流速之前，热管理引擎将合成空气射流流体从合成空气射流增加到预定的合成空气喷射流体流速，以提供功率消耗，气流和声学方面的改进。

6. 发明申请

US20100002376A1 Planer Board with Integrated Cold Plate 有权
标题翻译：具有集成冷板的刨床
公开(公告)号：US20100002376A1
公开(公告)日：2010-01-07
申请号：US12166016
申请日：2008-07-01
申请人： Paul T. Artman , Shawn P. Hoss
发明人： Paul T. Artman , Shawn P. Hoss
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： AA cooling system for an information handling system is provided in which a cold plate is coupled to the motherboard of the computer system. The cold plate includes a number of cold pads that are located on the pan to correspond to the location of heat-emitting components on the motherboard. Chilled water is circulated through the cold pads to remove heat from the vicinity of the heat-emitting components. A heat exchanger may be coupled to the cold plate.
摘要翻译：提供了一种用于信息处理系统的AA冷却系统，其中冷板耦合到计算机系统的主板。冷板包括位于锅上的多个冷垫，以对应于母板上的发热部件的位置。冷却水通过冷垫循环，以从发热部件附近去除热量。热交换器可以联接到冷板。

7. 发明授权

US07400506B2 Method and apparatus for cooling a memory device 有权
标题翻译：用于冷却存储器件的方法和装置
公开(公告)号：US07400506B2
公开(公告)日：2008-07-15
申请号：US11484458
申请日：2006-07-11
申请人： Shawn P. Hoss , Paul T. Artman
发明人： Shawn P. Hoss , Paul T. Artman
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/4093 , H01L25/0655 , H01L25/18 , H01L2924/0002 , H01L2924/00
摘要： A memory device cooling apparatus includes a first heat sink operable to engage a first chip that is located on a memory device and that is operable to operate at a first temperature. A second heat sink is included that is separate from the first heat sink and is operable to engage a second chip that is located on a memory device and that is operable to operate at a second temperature, wherein the second temperature is different from the first temperature. A retaining feature is operable to couple the first heat sink and the second heat sink to a memory device. The memory device cooling apparatus may be coupled to a memory device having at least two different chips that operate at different temperatures to efficiently dissipate heat from the chips in order to cool the memory device.
摘要翻译：存储装置冷却装置包括第一散热器，其可操作以接合位于存储装置上的第一芯片，并可操作以在第一温度下操作。包括与第一散热器分离的第二散热器，并且可操作以接合位于存储器设备上并可操作以在第二温度下操作的第二芯片，其中第二温度不同于第一温度。保持特征可操作以将第一散热器和第二散热器耦合到存储器件。存储器件冷却装置可以耦合到具有至少两个不同芯片的存储器件，所述芯片在不同的温度下操作以有效地从芯片散热以便冷却存储器件。

8. 发明申请

US20080089034A1 Heat dissipation apparatus utilizing empty component slot 有权
标题翻译：利用空组件槽的散热装置
公开(公告)号：US20080089034A1
公开(公告)日：2008-04-17
申请号：US11549453
申请日：2006-10-13
申请人： Shawn P. Hoss , Paul T. Artman
发明人： Shawn P. Hoss , Paul T. Artman
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a heat transfer base that is operable to couple to a heat producing component that is operable to couple to a first component connector and be located in a first component slot defined by the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member extends from the heat transfer base such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.
摘要翻译：散热装置包括传热基座，其可操作以耦合到可发热部件，所述发热部件可操作以联接到第一部件连接器并且位于由所述第一部件连接器限定的第一部件槽中，其中所述第一部件连接器位于与限定第二部件槽的第二部件连接器相邻并间隔开的位置。散热构件从传热基座延伸，使得当发热部件联接到第一部件连接器并且位于第一部件槽中时，散热部件位于由第二部件连接器限定的第二部件槽中。散热装置可以耦合到发热部件，并且当存在位于发热部件耦合到的部件连接器附近的空的部件连接器插槽时，用于散发来自发热部件的热量。

9. 发明申请

US20110032672A1 Memory Heat Sink System 审中-公开
标题翻译：内存散热系统
公开(公告)号：US20110032672A1
公开(公告)日：2011-02-10
申请号：US12538332
申请日：2009-08-10
申请人： Paul T. Artman , Shawn P. Hoss , William K. Coxe, III
发明人： Paul T. Artman , Shawn P. Hoss , William K. Coxe, III
IPC分类号： G06F1/20 , B23P11/00
CPC分类号： G06F1/20 , H01L23/4093 , H01L23/473 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A memory heat sink system includes a base comprising a first side and a second side, wherein the first side is oriented substantially perpendicularly to the second side. A plurality of convective heat transfer members extend from the first side. At least one conductive liquid cooling coupling surface located on the second side.
摘要翻译：存储器散热器系统包括：基座，包括第一侧和第二侧，其中第一侧基本垂直于第二侧定向。多个对流传热构件从第一侧延伸。位于第二侧的至少一个导电液体冷却联接表面。

10. 发明授权

US07480147B2 Heat dissipation apparatus utilizing empty component slot 有权
标题翻译：利用空组件槽的散热装置
公开(公告)号：US07480147B2
公开(公告)日：2009-01-20
申请号：US11549453
申请日：2006-10-13
申请人： Shawn P. Hoss , Paul T. Artman
发明人： Shawn P. Hoss , Paul T. Artman
IPC分类号： H05K7/20 , H01R13/00
CPC分类号： G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.
摘要翻译：散热装置包括限定紧邻第一部件连接器的第一部件槽的第一部件连接器，其中第一部件连接器位于与限定第二部件槽的第二部件连接器相邻并间隔开的位置。散热构件热耦合到发热部件，使得当发热部件联接到第一部件连接器并位于第一部件连接器中时，散热部件位于由第二部件连接器限定的第二部件槽中组件插槽散热装置可以耦合到发热部件，并且当存在位于发热部件耦合到的部件连接器附近的空的部件连接器插槽时，用于散发来自发热部件的热量。

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