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    • 1. 发明申请
    • DUAL CURE COMPOSITION
    • 双重固化组合物
    • US20090069459A1
    • 2009-03-12
    • US12090824
    • 2006-10-02
    • David JamesKent SorensenHenrik Bernquist
    • David JamesKent SorensenHenrik Bernquist
    • C08L67/00C08L67/02C08L79/00
    • C09D175/16C08G18/68C08J3/243C08L2312/06
    • A liquid radiation and thermally curing composition characterized in, that said composition comprises at least one ester between at least one tri or polyalcohol and acrylic and/or methacrylic acid, which ester has at least two hydroxyl groups, at least one acrylic or methacrylic double bond, a hydroxyl value of 50-500 mg KOH/g and a double bond concentration of 1-10 mmoles/g, at least one crosslinking agent for hydroxyl functional compounds, which crosslinking agent optionally has at least one olefinic double bond, and an additive package comprising at least one photoinitiator, radical scavenger, light stabilizer, wetting agent and/or leveling agent, and optionally at least one monomeric or oligomeric reactive diluent.
    • 一种液体辐射和热固化组合物,其特征在于,所述组合物包含至少一种三醇或多元醇与丙烯酸和/或甲基丙烯酸之间的酯,该酯具有至少两个羟基,至少一个丙烯酸或甲基丙烯酸双键 ,羟基值为50-500mg KOH / g,双键浓度为1-10mmoles / g,至少一种用于羟基官能化合物的交联剂,该交联剂任选具有至少一个烯属双键,以及添加剂 包含至少一种光引发剂,自由基清除剂,光稳定剂,润湿剂和/或流平剂,以及任选的至少一种单体或低聚反应性稀释剂。
    • 5. 发明授权
    • Thermoplastic compound
    • 热塑性化合物
    • US06225404B1
    • 2001-05-01
    • US09194515
    • 1999-03-04
    • Kent SorensenBo PetterssonLouis BooghJan-Anders Edvin Mansson
    • Kent SorensenBo PetterssonLouis BooghJan-Anders Edvin Mansson
    • C08G6320
    • C08G83/003C08G81/00C08G81/024
    • A thermoplastic compound comprising at least one linear or branched thermoplastic polymer or copolymer, having at least one reactive or graftable site (F1), which polymer is compounded with at least one hyperbranched dendritic polyester macromolecule being composed of a monomeric or polymeric nucleus and one or more monomeric or polymeric branching or spacing chain extenders. The macromolecule is optionally chain terminated and/or functionalized, whereby terminal chain extender functions, chain termination and/or functionalization provides the macromolecule with at least one reactive or graftable site (F2) being reactive to or graftable onto said reactive or graftable site (F1). In a further aspect, the invention relates to a thermoplastic composition comprising two or more components, whereby at least one is said thermoplastic compound. In yet a further aspect, the invention relates to a thermoplastic article made of one or more thermoplastic compounds, whereby at least one is said thermoplastic compound.
    • 一种包含至少一种具有至少一个反应性或可接枝位点(F1)的直链或支链热塑性聚合物或共聚物的热塑性化合物,该聚合物与至少一种超支化树枝状聚酯大分子复合,所述超支化树枝状聚酯高分子由单体或聚合物核构成, 更多的单体或聚合物支链或间隔链增长剂。 大分子任选被链终止和/或官能化,由此末端扩链剂功能,链终止和/或官能化为大分子提供至少一个反应性或可接枝位点(F2),其可反应或接枝到所述反应性或可接枝位点(F1 )。 在另一方面,本发明涉及包含两种或多种组分的热塑性组合物,其中至少一种是所述热塑性化合物。 在另一方面,本发明涉及由一种或多种热塑性化合物制成的热塑性制品,其中至少一种是所述热塑性化合物。
    • 6. 发明申请
    • Radiation curable hot melt composition and a process for the application thereof
    • 可辐射固化热熔组合物及其应用方法
    • US20060083864A1
    • 2006-04-20
    • US11296146
    • 2005-12-07
    • Ann LindellKlaas KruithofKent Sorensen
    • Ann LindellKlaas KruithofKent Sorensen
    • C08J3/28C08F2/48
    • C08F290/046H05K3/287
    • The invention relates to a radiation curable hot melt composition comprising: a) 20 to 100 wt. % of a radiation curable resin or a mixture of radiation curable resins having a viscosity in the range from 15 to 10,000 mPas in the temperature range from 40 to 150° C., b) 0 to 50 wt. % of a hydroxyfunctional resin or oligomer or a mixture of hydroxyfunctional resins or oligomers, c) 0 to 10 wt. % of a photoinitiator, d) 0 to 50 wt. % of fillers and/or additives, and e) 0 to 40 wt. % of pigment, wherein the total amount of components a) to e) adds up to 100 wt. %. The invention further relates to a process for the coating of a substrate with such radiation curable hot melt composition. In this process the composition is heated to a temperature in the range from 40 to 150° C., is applied to the substrate, and then the coated substrate is exposed to electromagnetic radiation having a wavelength λ≦500 nm.
    • 本发明涉及一种可辐射固化的热熔组合物,其包含:a)20至100wt。 %的可辐射固化树脂或可辐射固化树脂的混合物,在40至150℃的温度范围内具有15至10,000mPas的粘度,b)0至50wt。 %的羟基官能树脂或低聚物或羟基官能树脂或低聚物的混合物,c)0至10wt。 %的光引发剂,d)0至50wt。 %的填料和/或添加剂,和e)0-40wt。 %的颜料,其中组分a)至e)的总量加到100wt。 %。 本发明还涉及用这种可辐射固化的热熔组合物涂覆基材的方法。 在该方法中,将组合物加热至40至150℃的温度,施加到基底上,然后将涂覆的基底暴露于波长λ<= 500nm的电磁辐射。