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1. 发明授权

US08296941B2 Conformal shielding employing segment buildup 有权
标题翻译：使用段积累的保形屏蔽
公开(公告)号：US08296941B2
公开(公告)日：2012-10-30
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, Jr. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H01L24/97 , H01L23/552 , H05K3/30
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

2. 发明授权

US08409658B2 Conformal shielding process using flush structures 有权
标题翻译：使用齐平结构的保形屏蔽工艺
公开(公告)号：US08409658B2
公开(公告)日：2013-04-02
申请号：US11952592
申请日：2007-12-07
申请人： David J. Hiner , Waite R. Warren, Jr. , David Jandzinski
发明人： David J. Hiner , Waite R. Warren, Jr. , David Jandzinski
IPC分类号： B05D5/12
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

3. 发明申请

US20090000816A1 CONFORMAL SHIELDING PROCESS USING FLUSH STRUCTURES 有权
标题翻译：使用FLUSH结构的合格屏蔽工艺
公开(公告)号：US20090000816A1
公开(公告)日：2009-01-01
申请号：US11952592
申请日：2007-12-07
申请人： David J. Hiner , Waite R. Warren, Jr. , David Jandzinski
发明人： David J. Hiner , Waite R. Warren, Jr. , David Jandzinski
IPC分类号： H05K9/00 , H05K3/10
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

4. 发明授权

US08720051B2 Conformal shielding process using process gases 有权
标题翻译：使用工艺气体的保形过程
公开(公告)号：US08720051B2
公开(公告)日：2014-05-13
申请号：US13151499
申请日：2011-06-02
申请人： Donald Joseph Leahy , Waite R. Warren, Jr. , Stephen Parker
发明人： Donald Joseph Leahy , Waite R. Warren, Jr. , Stephen Parker
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

5. 发明授权

US08186048B2 Conformal shielding process using process gases 有权
标题翻译：使用工艺气体的保形过程
公开(公告)号：US08186048B2
公开(公告)日：2012-05-29
申请号：US11952634
申请日：2007-12-07
申请人： Donald Joseph Leahy , Waite R. Warren, Jr. , Stephen Parker
发明人： Donald Joseph Leahy , Waite R. Warren, Jr. , Stephen Parker
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

6. 发明授权

US08220145B2 Isolated conformal shielding 有权
标题翻译：隔离保形屏蔽
公开(公告)号：US08220145B2
公开(公告)日：2012-07-17
申请号：US11952513
申请日：2007-12-07
申请人： David J. Hiner , Waite R. Warren, Jr.
发明人： David J. Hiner , Waite R. Warren, Jr.
IPC分类号： H01L24/97 , H01L23/552 , H05K3/30
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

7. 发明授权

US08053872B1 Integrated shield for a no-lead semiconductor device package 有权
标题翻译：用于无铅半导体器件封装的集成屏蔽
公开(公告)号：US08053872B1
公开(公告)日：2011-11-08
申请号：US11768014
申请日：2007-06-25
申请人： Geoff Swan , Waite R. Warren, Jr.
发明人： Geoff Swan , Waite R. Warren, Jr.
IPC分类号： H01L23/28 , H01L23/552 , H05K9/00 , C23C18/16 , C23C18/32
CPC分类号： H01L23/552 , C25D5/12 , C25D7/123 , H01L21/561 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/49431 , H01L2224/49433 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H05K9/0024 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor package. A die is mounted on the die attach pad and connected by wirebonds to certain contact pads of the inner rows of contact pads. An overmold body is formed over the die, die attach pad, wirebonds, and inner row of contact pads, and substantially encompasses each contact pad of the outer row of contact pads. A conformal coating is applied over the overmold body, including the exposed surfaces of the contact pads of the outer row of contact pads, providing a shield.
摘要翻译：本发明将平板无铅（FN）半导体封装的屏蔽集成在一起，其具有沿着任何一侧的多排接触焊盘。 FN半导体封装将在至少一侧具有至少一个内排和一排外接触片。接触垫的内外排和管芯连接垫构成了FN半导体封装的基础。模具安装在管芯附着垫上，并通过引线连接到内排接触焊盘的某些接触焊盘。在模具，管芯附接垫，引线键和内排接触焊盘之上形成包覆模制体，并且基本上包围外排接触焊盘的每个接触焊盘。在包覆成型体上施加保形涂层，包括外排接触垫的接触垫的暴露表面，提供屏蔽。

8. 发明授权

US5864776A Apparatus and method for detecting an error in the placement of a lead frame on a surface of a die mold 失效
标题翻译：用于检测引线框架在模具模具表面上的放置误差的装置和方法
公开(公告)号：US5864776A
公开(公告)日：1999-01-26
申请号：US917917
申请日：1997-08-27
申请人： Waite R. Warren, Jr. , John T. Cox , Louis W. Nicholls
发明人： Waite R. Warren, Jr. , John T. Cox , Louis W. Nicholls
IPC分类号： G01B11/00 , H01L21/00 , H01L21/50 , H01L21/66 , H01L23/50 , G01J5/00
CPC分类号： H01L21/67259 , H01L22/12 , H01L2924/0002
摘要： A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing process. This takes place prior to injection of an initially molten material that solidifies and encapsulates the small objects upon curing and cooling.
摘要翻译：提供了一种位置检测系统，其通过使用检测到的红外能量发射而无需物理接触，确定在两部分模具的下半部分上是否存在一个或多个小物体（例如引线框架）的正确放置半导体元件制造工艺。这在注入初始熔融的材料之前发生，固化和冷却时固化和封装小物体。

9. 发明授权

US5737846A Lead frame dryer 失效
标题翻译：引线框架烘干机
公开(公告)号：US5737846A
公开(公告)日：1998-04-14
申请号：US755049
申请日：1996-11-22
申请人： Waite R. Warren, Jr. , Lou W. Nicholls
发明人： Waite R. Warren, Jr. , Lou W. Nicholls
IPC分类号： F26B5/16 , H01L21/00 , F26B19/00
CPC分类号： H01L21/67034 , F26B5/16
摘要： A lead frame dryer comprises a pair of water absorbing rollers positioned downstream of a lead frame water jet deflasher. The water absorbing rollers remove water from surfaces of the lead frame. A solid roller is positioned adjacent each of the water absorbing rolls to squeegee to compress the water absorbing roller and remove water stored in the water absorbing rollers for collection. A venturi device is provided which creates a vacuum for absorbing water removed from the water absorbing rolls. The collected water can be recycled back to the water jet deflasher.
摘要翻译：引线框架干燥器包括位于引线框架水射流消除器下游的一对吸水辊。吸水辊从引线框架的表面去除水分。固定辊位于每个吸水辊附近以进行刮板以压缩吸水辊并除去储存在吸水辊中的水以便收集。提供文丘里装置，其产生用于吸收从吸水辊移除的水的真空。收集的水可以回收到喷水灭火器。

10. 发明授权

US5777873A Automated test fixture control system 失效
标题翻译：自动化测试夹具控制系统
公开(公告)号：US5777873A
公开(公告)日：1998-07-07
申请号：US639817
申请日：1996-04-29
申请人： John Cox , Waite R. Warren, Jr.
发明人： John Cox , Waite R. Warren, Jr.
IPC分类号： G01R31/28 , G01R31/00
CPC分类号： G01R31/2834 , G01R31/2806 , G01R31/2887
摘要： In a test system, test fixtures that hold modules are controlled to enable an operator to separate modules that pass a test from modules that fail. When a module under test is properly loaded in a test fixture, a test fixture controller instructs a tester to start a test procedure. For a semiautomatic test fixture, a test start command is automatically supplied to the tester when the test fixture is closed around the module under test. The test fixture controller automatically interprets the test results provided by the tester. The module that passes the test is automatically released from the test fixture. If the module fails, the test fixture controller keeps it locked in the test fixture. The module is released only when an operator presses a failure acknowledgement button on a control box.
摘要翻译：在测试系统中，控制保持模块的测试夹具被控制，以使操作员能够将通过测试的模块与失败的模块分开。当测试中的模块被正确地加载到测试夹具中时，测试夹具控制器指示测试者启动测试程序。对于半自动测试夹具，当测试夹具围绕被测模块关闭时，测试启动命令将自动提供给测试仪。测试夹具控制器自动解释测试仪提供的测试结果。通过测试的模块将自动从测试夹具中释放出来。如果模块出现故障，测试夹具控制器将其锁定在测试夹具中。只有当操作员按下控制箱上的故障确认按钮时，才会释放模块。

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