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    • 1. 发明授权
    • End-point detection
    • 终点检测
    • US5288367A
    • 1994-02-22
    • US11630
    • 1993-02-01
    • David AngellCarl J. Radens
    • David AngellCarl J. Radens
    • G01N21/67H01J37/32G01N21/00
    • H01J37/32935G01N21/67H01J37/32972
    • A wavelength of light is monitored for end-point detection during etching. Spectral data is collected during etching which characterizes variation of light emitted by discharge produced during etching. At least one principal component of the data is calculated. Each principal component has variables, each variable has a weight, and each variable corresponds to a wavelength of the light emitted by the discharge. By examining or analyzing the weights, it is then determined which variable of the principal component varies during etching such that end-point of the etch can be detected by monitoring the wavelength corresponding to the variable.
    • 在蚀刻期间监视光的波长以进行端点检测。 在蚀刻期间收集光谱数据,其表征在蚀刻期间产生的放电发射的光的变化。 计算数据的至少一个主成分。 每个主成分都有变量,每个变量都有一个权重,每个变量对应于放电发出的光的波长。 通过检查或分析权重,然后确定主要成分的哪个变量在蚀刻期间变化,使得可以通过监测对应于变量的波长来检测蚀刻的终点。