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    • 8. 发明授权
    • Lowpass filter formed in multi-layer ceramic
    • 低通滤波器形成于多层陶瓷中
    • US06903628B2
    • 2005-06-07
    • US10604408
    • 2003-07-18
    • Chien-Chang Liu
    • Chien-Chang Liu
    • H03H7/01H03H7/00
    • H03H7/1758H03H7/0115H03H2001/0085
    • A laminated lowpass filter includes nine dielectric substrates arranged in a stack. The outer surfaces of the stack are ground planes. From top to bottom, top four layers forms a first MIM capacitor, a spiral four-port “mutually coupled coils” (MCCs) structure is placed in the middle, and then the second MIM capacitor is formed on bottom four layers. The first port (P1″) of the MCCs is connected to the first MIM capacitor. The fourth port (P4″) of the MCCs is connected to the second MIM capacitor. The second and third ports (P2″, P3″) constitute input and output of the laminated lowpass filter on the sides of the stack.
    • 叠层低通滤波器包括布置在堆叠中的9个电介质基片。 堆叠的外表面是接地平面。 从顶部到底部,顶部四层形成第一MIM电容器,在中间放置螺旋四端口“相互耦合的线圈”(MCC)结构,然后在第四层上形成第二MIM电容器。 MCC的第一端口(P 1“)连接到第一MIM电容器。 MCC的第四端口(P 4“)连接到第二MIM电容器。 第二和第三端口(P 2“,P 3”)构成层叠的低通滤波器在堆叠的侧面上的输入和输出。
    • 9. 发明申请
    • RF TRANSCEIVER MODULE FORMED IN MULTI-LAYERED CERAMIC
    • 在多层陶瓷中形成的RF收发器模块
    • US20050026647A1
    • 2005-02-03
    • US10604568
    • 2003-07-30
    • Ko-Mai LiYo-Shen LinChien-Chang Liu
    • Ko-Mai LiYo-Shen LinChien-Chang Liu
    • H04B1/38H04B1/44H04B1/06H04B1/18
    • H04B1/38
    • An RF transceiver module for wireless communication devices includes a multi-layered substrate, an RF transceiver IC mounted on the multi-layered substrate for receiving and transmitting voice or data signals, at least one band selection filter mounted on the multi-layered substrate for filtering received RF signals, an antenna switch integrated in the multi-layered substrate which can be switched to transmit RF signals generated by the power amplifiers to the external antenna or to receive RF signals from an external antenna to the RF transceiver IC through the band selection filter, a plurality of passive devices embedded in the multi-layered substrate, and wiring embedded in the multi-layered substrate for electrically connecting the passive devices, the RF transceiver IC, and the band selection filter.
    • 用于无线通信设备的RF收发器模块包括多层基板,安装在多层基板上的用于接收和发送语音或数据信号的RF收发器IC,安装在多层基板上的至少一个带选择滤波器,用于滤波 接收的RF信号,集成在多层基板中的天线开关,其可以被切换以将由功率放大器产生的RF信号发送到外部天线,或者通过频带选择滤波器从外部天线接收RF信号到RF收发器IC 嵌入在多层基板中的多个无源器件,以及嵌入在多层基板中的用于电连接无源器件,RF收发器IC和频带选择滤波器的布线。
    • 10. 发明授权
    • Antenna apparatus integrating metal shell
    • 集成金属外壳的天线设备
    • US08890754B2
    • 2014-11-18
    • US13689784
    • 2012-11-30
    • Yen-Hui LinChien-Chang Liu
    • Yen-Hui LinChien-Chang Liu
    • H01Q1/24
    • H01Q1/24H01Q1/243H01Q5/335H01Q7/00H01Q9/42
    • An antenna apparatus includes a metal shell, a circuit board parallel to the metal shell which forms a space between the circuit board and the shell, a tunable matching circuit mounted in the space with an terminal electrically connected to the shell, and an capacitive feed coupling antenna mounted on the circuit board. The capacitive feed coupling antenna includes a coupling ground strip mounted on the circuit board and a feed strip. The feed strip includes a first portion and a second portion mounted on the circuit board with a portion extending along an edge of the circuit board. The first portion is electrically interconnected between the other terminal of the tunable matching circuit and the second portion.
    • 天线装置包括金属外壳,平行于金属外壳的电路板,其在电路板和外壳之间形成空间;可调谐匹配电路,安装在具有电连接到外壳的端子的空间中,以及电容馈电耦合 天线安装在电路板上。 电容馈电耦合天线包括安装在电路板上的耦合接地条和馈电条。 所述进给条包括安装在所述电路板上的第一部分和第二部分,所述第一部分和所述第二部分具有沿所述电路板的边缘延伸的部分。 第一部分电连接在可调谐匹配电路的另一个端子和第二部分之间。