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    • 10. 发明授权
    • Array operation using a schottky diode as a non-ohmic isolation device
    • 使用肖特基二极管作为非欧姆隔离器件的阵列操作
    • US08027215B2
    • 2011-09-27
    • US12584262
    • 2009-09-02
    • Roy LambertsonLawrence Schloss
    • Roy LambertsonLawrence Schloss
    • G11C7/00
    • H01L45/146G11C11/36G11C13/003G11C29/006G11C2213/71G11C2213/76H01L27/101H01L27/1021
    • A two-terminal memory cell including a Schottky metal-semiconductor contact as a non-ohmic device (NOD) allows selection of two-terminal cross-point memory array operating voltages that eliminate “half-select leakage current” problems present when other types of non-ohmic devices are used. The NOD structure can comprise a “metal/oxide semiconductor/metal” or a “metal/lightly-doped single layer polycrystalline silicon.” The memory cell can include a two-terminal memory element including at least one conductive oxide layer (e.g., a conductive metal oxide—CMO, such as a perovskite or a conductive binary oxide) and an electronically insulating layer (e.g., yttria-stabilized zirconia—YSZ) in contact with the CMO. The NOD can be included in the memory cell and configured electrically in series with the memory element. The memory cell can be positioned in a two-terminal cross-point array between a pair of conductive array lines (e.g., a bit line and a word line) across which voltages for data operations are applied.
    • 包括肖特基金属 - 半导体接触作为非欧姆器件(NOD)的两端存储单元允许选择两端交叉点存储器阵列工作电压,以消除当其它类型的 使用非欧姆器件。 NOD结构可以包括“金属/氧化物半导体/金属”或“金属/轻掺杂的单层多晶硅”。存储单元可以包括两端存储元件,其包括至少一个导电氧化物层(例如, 导电金属氧化物-CMO,例如钙钛矿或导电二元氧化物)和与CMO接触的电子绝缘层(例如,氧化钇稳定的氧化锆-YSZ)。 NOD可以被包括在存储器单元中并与存储元件串联构成。 存储器单元可以位于一对导电阵列线(例如,位线和字线)之间的两端交叉点阵列中,用于数据操作的电压被施加在该两端交叉点阵列上。