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    • 1. 发明授权
    • Electrode with increased stability and method of manufacturing the same
    • 增加稳定性的电极及其制造方法
    • US07937153B2
    • 2011-05-03
    • US11820744
    • 2007-06-19
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • A61N1/00
    • A61N1/0543A61N1/36046
    • An implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts. An implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer. A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
    • 具有增加的稳定性的可植入电极具有聚集结构,其中电极的表面被包括充满棒或柱的开口的材料覆盖。 具有增加的稳定性的可植入电极,其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 一种制造具有增加的稳定性的电极的方法,包括:在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 一种制造具有增加的稳定性的电极的方法,包括:在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。
    • 3. 发明申请
    • ELECTRODE WITH INCREASED STABILITY AND METHOD OF MANUFACTURING THE SAME
    • 具有增加的稳定性的电极及其制造方法
    • US20080268134A1
    • 2008-10-30
    • US11924763
    • 2007-10-26
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouJerry OkNeil Hamilton TalbotBrian V. MechJames Singleton LittleRobert J. Greenberg
    • H01M4/04
    • A61N1/0543A61N1/36046
    • The present invention provides an implantable electrode with increased stability having a clustered structure wherein the surface of the electrode is covered with a material comprising openings which are filled with sticks or posts.The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material.The present invention provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.The present invention provides A method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying a polymer layer on the metal layer; applying photoresist layer on the polymer layer; patterning the photoresist layer providing openings; electroplating the openings with metal; and removing the photoresist layer.
    • 本发明提供具有增加的稳定性的可植入电极,其具有聚集结构,其中电极的表面被包括填充有棒或柱的开口的材料覆盖。 本发明提供了具有增加的稳定性的可植入电极,其中电极的表面包括填充有用导电或绝缘材料填充的棒的网状网格。 本发明提供一种具有增加的稳定性的电极的制造方法,包括:在基底层上沉积金属层; 在金属层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 去除留下空间的光致抗蚀剂层; 并用聚合物填充空间。 本发明提供了一种制造具有增加的稳定性的电极的方法,包括:在基底层上沉积金属层; 在金属层上施加聚合物层; 在聚合物层上施加光致抗蚀剂层; 图案化提供开口的光致抗蚀剂层; 用金属电镀开口; 并除去光致抗蚀剂层。
    • 10. 发明申请
    • Process for Cathodic Protection of Electrode Material
    • 电极材料阴极保护工艺
    • US20100147702A1
    • 2010-06-17
    • US12708358
    • 2010-02-18
    • Dao Min ZhouAmy HinesJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouAmy HinesJames Singleton LittleRobert J. Greenberg
    • C23F13/00
    • C23F13/00A61N1/05A61N1/08C23F13/02
    • The present invention relates to a process for cathodic protection of electrode or electrode materials wherein negative bias is applied on the electrode. The negative bias is obtained by asymmetric current pulse. The asymmetric current pulse is obtained by performing negative phase with higher amplitude. The asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The asymmetric current pulse is obtained by performing negative phase with higher amplitude and with wider pulse width than that of the anodic phase. The present invention further relates to a process for cathodic protection of electrode or electrode materials, wherein negative bias is applied on the electrode, wherein the negative bias is obtained by asymmetric current pulse, wherein the asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains.
    • 本发明涉及对电极或电极材料进行阴极保护的方法,其中负电极施加在电极上。 负偏压通过不对称电流脉冲获得。 通过执行具有较高振幅的负相来获得非对称电流脉冲。 通过执行具有比阳极相宽的脉冲宽度的负相来获得非对称电流脉冲。 通过执行具有更高幅度和宽于脉冲宽度的阳极相的负相位获得非对称电流脉冲。 本发明还涉及一种用于对电极或电极材料进行阴极保护的方法,其中在电极上施加负偏压,其中通过不对称电流脉冲获得负偏压,其中非对称电流脉冲通过执行具有更宽的负相 脉冲宽度大于阳极相。 通过脉冲串获得更宽的脉冲宽度。