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    • 4. 发明申请
    • Hot Carrier Circuit Reliability Simulation
    • 热载波电路可靠性仿真
    • US20080027699A1
    • 2008-01-31
    • US11867554
    • 2007-10-04
    • Lifeng WuZhihong LiuAlvin ChenJeong ChoiBruce McGaughy
    • Lifeng WuZhihong LiuAlvin ChenJeong ChoiBruce McGaughy
    • G06F17/50
    • G06F17/5036
    • The present invention is directed to a number of improvements in methods for reliability simulations in aged circuits whose operation has been degraded through hot-carrier or other effects. A plurality of different circuit stress times can be simulated within a single run. Different aging criteria may be used for different circuit blocks, circuit block types, devices, device models and device types. The user may specify the degradation of selected circuit blocks, circuit block types, devices, device models and device types independently of the simulation. Device degradation can be characterized in tables. Continuous degradation levels can be quantized. Techniques are also described for representing the aged device in the netlist as the fresh device augmented with a plurality of independent current sources connected between its terminals to mimic the effects of aging in the device. The use of device model cards with age parameters is also described. To further improve the circuit reliability simulation, a gradual or multi-step aging is used instead of the standard one step aging process. Many of these features can be embedded within the circuit simulator. A user data interface is also presented to implement these techniques and further allow users to enter their device models not presented in the simulator. For example, a proprietary model of, say, the substrate current in an NMOS could used be with a SPICE simulator employing a different model to simulate the aging of the circuit.
    • 本发明涉及在老化电路中的可靠性模拟方法的许多改进,其操作已经通过热载波或其它效应而降级。 可以在单次运行中模拟多个不同的电路应力时间。 不同的老化标准可用于不同的电路块,电路块类型,器件,器件型号和器件类型。 用户可以独立于模拟来指定所选择的电路块,电路块类型,设备,设备模型和设备类型的劣化。 器件劣化可以在表中进行表征。 可以量化连续降解水平。 还描述了用于在网表中表示老化设备的技术,因为新设备通过连接在其终端之间的多个独立电流源来增强,以模拟设备中的老化的影响。 还描述了使用具有年龄参数的设备型号卡。 为了进一步提高电路可靠性仿真,采用逐步或多步老化代替标准的一步老化过程。 这些功能中的许多可以嵌入在电路仿真器中。 还呈现用户数据接口以实现这些技术,并且进一步允许用户输入其未在模拟器中呈现的设备模型。 例如,一个专有的模型,例如NMOS中的衬底电流可以用SPICE仿真器使用不同的模型来模拟电路的老化。