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1. 发明授权

US4699696A Zinc-nickel alloy electrolyte and process 失效
标题翻译：锌镍合金电解液及工艺
公开(公告)号：US4699696A
公开(公告)日：1987-10-13
申请号：US850465
申请日：1986-04-15
申请人： Daniel J. Combs , Sylvia Martin , Robert A. Tremmel , Kenneth D. Snell , Masaaki Kamitani , Ryoichi Kimizuka , Takaaki Koga
发明人： Daniel J. Combs , Sylvia Martin , Robert A. Tremmel , Kenneth D. Snell , Masaaki Kamitani , Ryoichi Kimizuka , Takaaki Koga
IPC分类号： C25D3/02 , C25D3/56 , C25D3/22
CPC分类号： C25D3/565
摘要： An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.
摘要翻译：适用于在包含锌离子和镍离子的水溶液的导电基材上电沉积锌 - 镍合金的氯化物，硫酸盐和混合氯化硫酸盐类型的酸性电解质的酸性电解质，以及选自以下的添加剂：（a）芳族磺酸，（b）芳族磺酰胺，磺酰亚胺和混合的羧酰胺/磺酰胺，（c）乙炔醇以及浴溶性和相容的盐及其混合物。本发明还包括使用上述电解质电沉积锌 - 镍合金的方法。

2. 发明授权

US4272335A Composition and method for electrodeposition of copper 失效
标题翻译：电沉积铜的组成和方法
公开(公告)号：US4272335A
公开(公告)日：1981-06-09
申请号：US122204
申请日：1980-02-19
申请人： Daniel J. Combs
发明人： Daniel J. Combs
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic polysulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths.
摘要翻译：从其中溶解有增亮量的包含取代的酞菁基团的化合物的水性酸性镀铜浴电沉积韧性，明亮的水平铜沉积物的组合物和方法。根据优选实施方案，组合物和方法还包括在铜电镀浴中的二次增白剂，包括脂族多硫化物和/或有机硫化物和/或聚醚，以及用于酸性电镀浴的其它已知的添加剂。

3. 发明授权

US4374709A Process for plating polymeric substrates 失效
标题翻译：电镀聚合物基材的工艺
公开(公告)号：US4374709A
公开(公告)日：1983-02-22
申请号：US145534
申请日：1980-05-01
申请人： Daniel J. Combs
发明人： Daniel J. Combs
IPC分类号： C25D3/38 , C25D5/56
CPC分类号： C25D5/56 , C25D3/38
摘要： A process for pretreating a substantially non-conductive substrate such as a plateable plastic or plastic article having an electroless metal deposit on the surface thereof which comprises the steps of conditioning the surface of the substrate to effect an increase in the conductivity thereof with a dilute aqueous acidic solution containing controlled effective amounts of copper, acid and a polyether compound followed by an electrolytic acid copper strike employing a more concentrated aqueous electrolyte containing copper, acid and a polyether compound. The conditioning and electrolytic copper strike steps can be performed without necessitating any intervening rinse steps to provide a conductive basis for subsequently depositing adherent and uniform electroplates such as decorative acid copper or the like.
摘要翻译：一种用于对其表面上具有无电金属沉积物的可镀塑料或塑料制品的基本不导电的基材进行预处理的方法，该方法包括以下步骤：调节基材的表面以增加其导电性，含有受控有效量的铜，酸和聚醚化合物的酸性溶液，接着是使用含有铜，酸和聚醚化合物的更浓缩的含水电解质的电解酸性铜离子。可以进行调节和电解铜冲击步骤，而不需要任何中间冲洗步骤，以便为随后沉积粘附和均匀电镀如装饰酸性铜等提供导电基础。

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