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1. 发明申请

US20130070434A1 DYE-BASED CIRCUIT MOUNT TESTING 失效
标题翻译：基于DYE的电路安装测试
公开(公告)号：US20130070434A1
公开(公告)日：2013-03-21
申请号：US13233748
申请日：2011-09-15
申请人： Daniel J. Buschel , Wai M. Ma , Donald A. Merte
发明人： Daniel J. Buschel , Wai M. Ma , Donald A. Merte
IPC分类号： H05K5/04 , H05K3/00 , H05K5/00
CPC分类号： H05K3/00 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0271 , H05K2203/085 , H05K2203/176
摘要： An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.
摘要翻译：一种装置可以包括形成具有可位于印刷电路板（PCB）上的边缘的外壳的壳体。外壳边缘可以包括边缘部分。壳体可以被配置为将施加到壳体的力传递到安装在PCB上的表面安装部件以卸下表面安装部件。该装置可以包括由壳体形成并构造成将染料导入外壳的染料入口。另一装置可以包括安装到外壳边缘的至少一个垫片，以接触邻近表面安装部件的PCB的主表面，以与PCB形成密封。方法可以包括将表面安装部件封闭在形成在喷嘴装置中的外壳中，将染料引入外壳中，并向喷嘴装置施加力以卸下表面安装部件。

2. 发明申请

US20130337697A1 Adapter For Plated Through Hole Mounting Of Surface Mount Component 有权
标题翻译：适用于电镀通孔安装表面贴装元件
公开(公告)号：US20130337697A1
公开(公告)日：2013-12-19
申请号：US13495671
申请日：2012-06-13
申请人： Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
发明人： Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
IPC分类号： H01R24/20
CPC分类号： H01R12/58 , H01R12/718 , H05K1/141 , H05K3/325 , H05K2201/049 , H05K2201/1059 , H05K2201/10946
摘要： A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
摘要翻译：用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。表面安装部件保持器构造成接合表面安装部件的电触点。表面贴装组件将表面安装适配器与表面贴装组件相结合。在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

3. 发明授权

US08902605B2 Adapter for plated through hole mounting of surface mount component 有权
标题翻译：表面安装元件的电镀通孔安装适配器
公开(公告)号：US08902605B2
公开(公告)日：2014-12-02
申请号：US13495671
申请日：2012-06-13
申请人： Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
发明人： Daniel J. Buschel , Wai Mon Ma , James E. Tersigni , Raymond D. Birchall
IPC分类号： H01R9/00
CPC分类号： H01R12/58 , H01R12/718 , H05K1/141 , H05K3/325 , H05K2201/049 , H05K2201/1059 , H05K2201/10946
摘要： A surface mount component adapter, assembly and related method for attaching a surface mount component to a printed circuit board. The surface mount component adapter includes a substrate, a surface mount component holder on the substrate, and flexible leads each having a base end attached to the surface mount component holder and a free end configured to engage a plated through hole on a circuit board. The surface mount component holder is configured to engage electrical contacts of a surface mount component. The surface mount component assembly combines the surface mount adapter with the surface mount component. In the surface mount component method, the surface mount assembly is formed and the free ends of the flexible leads are attached to a corresponding number of the plated through holes on the circuit board.
摘要翻译：用于将表面安装部件附接到印刷电路板的表面安装部件适配器，组件和相关方法。表面安装部件适配器包括衬底，衬底上的表面安装部件保持器和柔性引线，每个柔性引线都具有附接到表面安装部件保持器的基端，以及被配置为接合电路板上的电镀通孔的自由端。表面安装部件保持器构造成接合表面安装部件的电触点。表面贴装组件将表面安装适配器与表面贴装组件相结合。在表面安装部件方法中，形成表面安装组件，并且柔性引线的自由端附接到电路板上相应数量的电镀通孔。

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