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1. 发明授权

US07920986B2 Surface shape metric and method to quantify the surface shape of electronic packages 有权
标题翻译：表面形状度量和量化电子封装表面形状的方法
公开(公告)号：US07920986B2
公开(公告)日：2011-04-05
申请号：US12045418
申请日：2008-03-10
申请人： Dan Vacar , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
发明人： Dan Vacar , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
IPC分类号： G01B5/18 , G01N21/86
CPC分类号： G01B21/30
摘要： A method of quantifying a shape of a surface includes measuring an elevation (z) of the surface at a plurality of locations in an x-y plane of the surface. The measurement data is fit to a series expansion in terms of one or more base functions that include a series expansion fit. A vector of shape coefficients are calculated from the series expansion fit. A vector of shape coefficients are output.
摘要翻译：量化表面形状的方法包括测量表面的x-y平面中的多个位置处的表面的高度（z）。测量数据适合于包括串联扩展拟合的一个或多个基本功能的串联扩展。形状系数的向量从串联扩展拟合计算。输出形状系数向量。

2. 发明申请

US20090228237A1 SURFACE SHAPE METRIC AND METHOD TO QUANTIFY THE SURFACE SHAPE OF ELECTRONIC PACKAGES 有权
标题翻译：表面形状公制和电子包装表面形状定量方法
公开(公告)号：US20090228237A1
公开(公告)日：2009-09-10
申请号：US12045418
申请日：2008-03-10
申请人： Dan VACAR , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
发明人： Dan VACAR , David K. McElfresh , Anton Bougaev , Donald A. Kearns , Charles E. Kinney
IPC分类号： G01B5/06
CPC分类号： G01B21/30
摘要： A method for quantifying a shape of a surface comprising: measuring an elevation (z) of the surface at a plurality of locations in an x-y plane of the surface comprising measurement data; performing a fit of the measurement data to a series expansion in terms of one or more base functions comprising a series expansion fit; calculating a vector of shape coefficients from the series expansion fit; and outputting the vector of shape coefficients.
摘要翻译：一种用于量化表面形状的方法，包括：测量包括测量数据的表面的x-y平面中的多个位置处的表面的高度（z）; 根据包括串联扩展配合的一个或多个基本功能，对测量数据进行串联扩展的拟合; 从系列扩展拟合计算形状系数的向量; 并输出形状系数的矢量。

3. 发明授权

US07323363B1 Contact load profile modification for a compression socketed CPU 有权
标题翻译：联系压缩插座CPU的负载配置文件修改
公开(公告)号：US07323363B1
公开(公告)日：2008-01-29
申请号：US10770192
申请日：2004-02-02
申请人： Donald A. Kearns , George C. Zacharisen , David K. McElfresh
发明人： Donald A. Kearns , George C. Zacharisen , David K. McElfresh
IPC分类号： H01L21/00
CPC分类号： G01B21/20 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A integrated circuit housing includes a first clamping hardware, a second clamping hardware operatively connected to the first clamping hardware, and an integrated circuit stack comprising a top portion and a bottom portion, wherein the first clamping hardware contacts the top portion and the second clamping hardware contacts the bottom portion, and wherein a first shim is interposed between the bottom portion and the second clamping hardware.
摘要翻译：集成电路壳体包括第一夹紧硬件，可操作地连接到第一夹持硬件的第二夹持硬件以及包括顶部和底部的集成电路堆叠，其中第一夹紧硬件接触顶部部分和第二夹紧硬件接触底部，并且其中第一垫片插入在底部部分和第二夹紧硬件之间。

4. 发明授权

US07835153B2 Heat sink mount for providing non-rigid support of overhanging portions of heat sink 有权
标题翻译：散热器安装座，用于提供散热器悬垂部分的非刚性支撑
公开(公告)号：US07835153B2
公开(公告)日：2010-11-16
申请号：US12345801
申请日：2008-12-30
申请人： Donald A. Kearns
发明人： Donald A. Kearns
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/467 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.
摘要翻译：适用于处理器强制空气冷却的计算机。计算机包括支撑处理器的板和安装有散热器的散热器，其底板接触处理器。主支架支撑处理器附近的散热器，并且散热器基板的一部分向外延伸距离主悬挂器至边缘的距离或悬伸长度。该装置包括支撑在处理器板上的辅助散热器安装组件，该辅助散热器安装组件包括阻尼元件，该阻尼元件具有靠近基板边缘定位的弹性体，由此在基板向板移动期间主体抵靠基板，例如，当施加动态或冲击载荷时，导致散热器基板的悬垂部分围绕主支架的支撑位置振动或振荡。

5. 发明授权

US07928996B2 Contact pressure analysis tool 有权
标题翻译：接触压力分析工具
公开(公告)号：US07928996B2
公开(公告)日：2011-04-19
申请号：US11868035
申请日：2007-10-05
申请人： Donald A. Kearns , Christopher R. Ritchie
发明人： Donald A. Kearns , Christopher R. Ritchie
IPC分类号： G09G5/00
CPC分类号： H05K7/1084 , G01L5/0057
摘要： A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.
摘要翻译：一种用于改善负载平衡的方法包括获得集成电路堆叠中的触点的负载分布的图形表示，分析负载分布的图形表示以确定接触负载，其中触点负载对应于触点，以及设计至少一个基于接触负载的集成电路堆栈的组件。

6. 发明申请

US20090091905A1 CONTACT PRESSURE ANALYSIS TOOL 有权
标题翻译：联系压力分析工具
公开(公告)号：US20090091905A1
公开(公告)日：2009-04-09
申请号：US11868035
申请日：2007-10-05
申请人： Donald A. Kearns , Christopher R. Ritchie
发明人： Donald A. Kearns , Christopher R. Ritchie
IPC分类号： H05K7/12
CPC分类号： H05K7/1084 , G01L5/0057
摘要： A method for improving load balance involves obtaining a graphical representation of a load distribution for contacts in an integrated circuit stack, analyzing the graphical representation of the load distribution to determine contact loads, where a contact load corresponds to a contact, and designing at least one component of the integrated circuit stack, based on the contact loads.
摘要翻译：一种用于改善负载平衡的方法包括获得集成电路堆叠中的触点的负载分布的图形表示，分析负载分布的图形表示以确定接触负载，其中触点负载对应于触点，以及设计至少一个基于接触负载的集成电路堆栈的组件。

7. 发明申请

US20100165578A1 Heat Sink Mount for Providing Non-Rigid Support of Overhanging Portions of Heat Sink 有权
标题翻译：散热器散热器用于提供非刚性支撑
公开(公告)号：US20100165578A1
公开(公告)日：2010-07-01
申请号：US12345801
申请日：2008-12-30
申请人： Donald A. Kearns
发明人： Donald A. Kearns
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H01L23/40 , H01L23/4006 , H01L23/467 , H01L2023/4062 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the heat sink base plate extends outward a distance or overhang length from the primary mount to an edge. The apparatus includes a secondary heat sink mounting assembly supported upon the processor board that includes a damping element with an resilient body positioned proximate to the edge of the base plate, whereby the body abuts the base plate during movement of the base plate toward the board, e.g., upon application of a dynamic or shock load that causes the overhanging portions of the base plate of the heat sink to vibrate or oscillate about the support locations of the primary mount.
摘要翻译：适用于处理器强制空气冷却的计算机。计算机包括支撑处理器的板和安装有散热器的散热器，其底板接触处理器。主支架支撑处理器附近的散热器，并且散热器基板的一部分向外延伸距离主悬挂器至边缘的距离或悬伸长度。该装置包括支撑在处理器板上的辅助散热器安装组件，该辅助散热器安装组件包括阻尼元件，该阻尼元件具有靠近基板边缘定位的弹性体，由此在基板向板移动期间主体抵靠基板，例如，当施加动态或冲击载荷时，导致散热器基板的悬垂部分围绕主支架的支撑位置振动或振荡。

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