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1. 发明授权

US08051554B2 IC socket with attached electronic component 有权
标题翻译： IC插座带有电子元件
公开(公告)号：US08051554B2
公开(公告)日：2011-11-08
申请号：US12104038
申请日：2008-04-16
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00 , H01L21/44
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.
摘要翻译：一种IC插座，其中电子部件附接到IC插座的预定位置，IC插座包括固定部分，该固定部分包括接触销，当电子部件的位置与电子部件的位置对准时，该接触销连接到电子部件的端子所述IC插座的预定位置使用电子部件安装工具，所述接触销包括在所述固定部的上表面上的一对端部; 可移动部分，当可移动部分被向下推动时，可移动到固定部分，以向固定部分的接触销施加力，以将接触销的一对端部彼此分离; 以及形成在可动部上并与电子部件安装工具接合的标准部分，当电子部件的位置与IC插座的预定位置对准时，将电子部件安装工具的位置对准标准部件使用电子连接工具，标准部件具有基本上不依赖于电子部件的外部形状的形状。

2. 发明授权

US06927343B2 Contactor for testing miniaturized devices and components 有权
标题翻译：用于测试小型化设备和部件的接触器
公开(公告)号：US06927343B2
公开(公告)日：2005-08-09
申请号：US10266866
申请日：2002-10-09
申请人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
发明人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
IPC分类号： G01R1/06 , G01R1/073 , H01L21/66 , H01R13/24 , H05K1/00
CPC分类号： G01R1/07314 , G01R1/06716 , H01R12/52 , H01R12/714 , H01R13/24
摘要： A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.
摘要翻译：接触器具有绝缘材料的薄膜基板和基板上的多个布线图案。每个布线图案的第一端作为第一接触端子从基板的第一边缘延伸出来，并且每个布线图案的第二端作为第二接触端子从基板的第二边缘延伸出来，并且接触器的一部分位于第一端部和第二端部之间的弹性体可以弹性变形。

3. 发明授权

US08671557B2 Tray in combination with electronic component attaching tool attached to the tray 失效
标题翻译：托盘与附在托盘上的电子元件连接工具组合
公开(公告)号：US08671557B2
公开(公告)日：2014-03-18
申请号：US13242647
申请日：2011-09-23
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
摘要翻译：托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。

4. 发明授权

US07430798B2 Electronic component attaching tool 有权
标题翻译：电子元件连接工具
公开(公告)号：US07430798B2
公开(公告)日：2008-10-07
申请号：US11126246
申请日：2005-05-11
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00 , H01L21/44
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译：准备适用于半导体器件外形的电子部件安装工具。电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

5. 发明授权

US07403024B2 Contactor having contact electrodes of metal springs embedded in a plate-like structure 失效
标题翻译：具有镶嵌在板状结构中的金属弹簧的接触电极的接触器
公开(公告)号：US07403024B2
公开(公告)日：2008-07-22
申请号：US10900362
申请日：2004-07-28
申请人： Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe , Daisuke Koizumi , Takafumi Hashitani , Ei Yano
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe , Daisuke Koizumi , Takafumi Hashitani , Ei Yano
IPC分类号： G01R31/26
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , G01R3/00
摘要： A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.
摘要翻译：接触器具有可在接触器的厚度方向上弹性变形的接触电极，使得接触器能够以适当的接触压力与半导体器件接触。接触器位于半导体器件和测试板之间，以将半导体器件电连接到测试板。多个接触电极中的每一个具有第一接触电极部分，第二接触电极部分和将第一接触电极部分电连接到第二接触电极部分的连接部分。第一接触电极部分接触半导体器件的电极。第二接触电极部分接触测试板的端子。组合构件具有绝缘特性，并且以预定的布置保持每个接触电极的连接部分。

6. 发明申请

US20050204551A1 Method of attaching electronic component and electronic component attaching tool 有权
标题翻译：安装电子元件和电子元件安装工具的方法
公开(公告)号：US20050204551A1
公开(公告)日：2005-09-22
申请号：US11126246
申请日：2005-05-11
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： H01R33/76 , B25B27/14 , H01R43/00 , H05K7/10 , H05K13/04 , B23K31/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译：准备适用于半导体器件外形的电子部件安装工具。电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

7. 发明授权

US06791345B2 Contactor for testing semiconductor device and manufacturing method thereof 失效
标题翻译：半导体器件测试用接触器及其制造方法
公开(公告)号：US06791345B2
公开(公告)日：2004-09-14
申请号：US10059114
申请日：2002-01-31
申请人： Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe , Daisuke Koizumi , Takafumi Hashitani , Ei Yano
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe , Daisuke Koizumi , Takafumi Hashitani , Ei Yano
IPC分类号： G01R3102
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , G01R3/00
摘要： A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.
摘要翻译：接触器具有可在接触器的厚度方向上弹性变形的接触电极，使得接触器能够以适当的接触压力与半导体器件接触。接触器位于半导体器件和测试板之间，以将半导体器件电连接到测试板。多个接触电极中的每一个具有第一接触电极部分，第二接触电极部分和将第一接触电极部分电连接到第二接触电极部分的连接部分。第一接触电极部分接触半导体器件的电极。第二接触电极部分接触测试板的端子。组合构件具有绝缘特性，并且以预定的布置保持每个接触电极的连接部分。

8. 发明申请

US20120005883A1 METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL 失效
标题翻译：连接电子元件和电子元器件连接工具的方法
公开(公告)号：US20120005883A1
公开(公告)日：2012-01-12
申请号：US13242647
申请日：2011-09-23
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译：准备适用于半导体器件外形的电子部件安装工具。电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。

9. 发明授权

US06924174B2 Method of attaching electronic component and electronic component attaching tool 失效
公开(公告)号：US06924174B2
公开(公告)日：2005-08-02
申请号：US10655030
申请日：2003-09-05
申请人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
发明人： Daisuke Koizumi , Shigeyuki Maruyama , Kazuhiro Tashiro , Naoyuki Watanabe
IPC分类号： H01R33/76 , B25B27/14 , H01R43/00 , H05K7/10 , H05K13/04 , H01L21/44
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

10. 发明授权

US07518388B2 Contactor for electronic components and test method using the same 有权
标题翻译：电子元件接触器和使用相同的测试方法
公开(公告)号：US07518388B2
公开(公告)日：2009-04-14
申请号：US11979305
申请日：2007-11-01
申请人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
发明人： Kazuhiro Tashiro , Shigeyuki Maruyama , Daisuke Koizumi , Takumi Kumatabara , Keisuke Fukuda
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R1/0483 , G01R1/0441
摘要： A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.
摘要翻译：公开了一种被配置为电连接到电子部件的端子的接触器。连接器包括与电子部件的端子接触的多个接触电极和各自由导电性弹性体构成的多个弹性电极。弹性电极产生用于将接触电极压靠在电子部件的端子上的按压力。接触电极可与弹性电极分离。

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