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1. 发明专利

JP2008147356A Metal blackening treatment method, electromagnetic wave shielding filter, composite filter, and display 有权
标题翻译：金属盲板处理方法，电磁波屏蔽滤波器，复合滤波器和显示器
公开(公告)号：JP2008147356A
公开(公告)日：2008-06-26
申请号：JP2006331913
申请日：2006-12-08
申请人： Dainippon Printing Co Ltd , Ebara Udylite Kk , 大日本印刷株式会社 , 荏原ユージライト株式会社
发明人： TOMITA HIROYUKI , KYODA YUKIHIRO , KIMIZUKA RYOICHI , SATO TAKURO
IPC分类号： H05K9/00 , B32B3/24 , B32B15/04 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a metal blackening treatment method capable of easily forming a blackened layer for preventing the reflection of light emitted from the screen of a display and the incident light from the outside for improving the viewability of the display screen, and forming a thin blackened layer of superior adhesion at the base-metal layer interface. SOLUTION: This metal blackening treatment method, for forming the blackened layer of an electromagnetic wave shielding filter for the display formed by laminating at least a transparent base, a copper mesh layer, and the blackened layer, comprises a process for forming the blackened layer on the surface of the copper mesh layer by bringing the laminate, including at least the transparent base and the copper mesh layer made to contact with a metal blackening treatment solution which is hydrochloric acid solution wherein tellurium is dissolved, the concentration (oxide-converted concentration) of tellurium in the hydrochloric acid solution is 0.01-0.45 wt.%, and the concentration of hydrochloric acid is 0.05-8 wt.%. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够容易地形成黑色层的金属黑化处理方法，用于防止从显示器的屏幕发射的光的反射和来自外部的入射光，以改善显示屏的可见性并且在基底 - 金属层界面处形成具有优异粘附性的薄的黑色层。解决方案：用于形成用于通过层压至少透明基底，铜网层和黑化层形成的显示器的电磁波屏蔽过滤器的黑化层的该金属黑化处理方法包括形成通过使至少包含透明基底和铜网层的金属黑化处理溶液与作为溶解有碲的盐酸溶液的金属黑化处理溶液接触而形成的铜网层的表面的变黑层，盐酸溶液中碲的转化浓度为0.01-0.45重量％，盐酸浓度为0.05-8重量％。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008144225A Metal blackening liquid, treatment method for blackening metal with the use of the metal blackening liquid, and product blackened with the treatment method for blackening metal 有权
标题翻译：金属黑化液，使用金属黑化液浸渍金属的处理方法，以及用于刮除金属的处理方法
公开(公告)号：JP2008144225A
公开(公告)日：2008-06-26
申请号：JP2006332032
申请日：2006-12-08
申请人： Ebara Udylite Kk , 荏原ユージライト株式会社
发明人： KIMIZUKA RYOICHI , SATO TAKURO
IPC分类号： C23C22/48
摘要： PROBLEM TO BE SOLVED: To provide a metal blackening liquid which can easily form a blackened layer having antireflective properties on a metal surface in a short period of time; a treatment method for blackening a metal by using the metal blackening liquid; and a product which has been blackened by using the treatment method for blackening the metal and has the blackened layer excellent in adhesiveness formed thereon.
SOLUTION: The metal blackening liquid is a hydrochloric acid solution containing tellurium dissolved therein, and includes 0.01 to 0.45 wt.% of tellurium by concentration (in terms of oxide) and 0.05 to 8 wt.% of hydrochloric acid by concentration.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种金属黑化液体，其可以在短时间内容易地在金属表面上形成具有抗反射性能的黑化层; 通过使用金属黑化液使金属变黑的处理方法; 以及通过使用金属黑化处理方法而使黑色化的产品变黑，并且具有在其上形成的粘合性优异的黑色层。解决方案：金属黑化液是含有碲的盐酸溶液，浓度为0.01〜0.45重量％，浓度为0.05〜8重量％的浓度的碲。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2003293193A Method for forming fine circuit wiring and apparatus used for the same 审中-公开
标题翻译：用于形成精细电路布线的方法和用于其的装置
公开(公告)号：JP2003293193A
公开(公告)日：2003-10-15
申请号：JP2002099970
申请日：2002-04-02
申请人： Ebara Corp , Ebara Udylite Kk , Nec Electronics Corp , Necエレクトロニクス株式会社 , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： ITO NOBUKAZU , HONGO AKIHISA , FUKUNAGA AKIRA , NAGAI MIZUKI , KIMIZUKA RYOICHI , KOBAYASHI TAKESHI , SATO TAKURO
IPC分类号： C25D7/12 , C25D5/10 , C25D5/50 , C25D7/00 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/532 , H05K3/10 , H05K3/18 , H05K3/22 , H05K3/24 , H05K3/38 , H05K3/42
CPC分类号： H01L21/76877 , H01L21/288 , H01L23/53228 , H01L2924/0002 , H05K3/107 , H05K3/244 , H05K3/38 , H05K3/388 , H05K3/423 , H05K2201/09036 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a means for preventing migration by lowering and suppressing the movement of copper atoms themselves in a copper wiring formed by copper plating. SOLUTION: A method for forming a fine circuit wiring is characterized by forming a first plated layer by copper alloy plating and a second plating layer by acidic copper plating on a substrate for an electronic circuit, on which a fine circuit pattern has been provided and a barrier layer and a seed layer as occasion demands have been formed. A fine circuit wiring-forming apparatus has a copper alloy plating means for forming the first plating layer, an acidic copper plating means for forming the second plating layer, a washing means for washing these plating layers, and a means for carrying in and out the substrate for the electronic circuit. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过降低和抑制铜原子本身在由铜电镀形成的铜布线中的移动来提供防止迁移的手段。＆lt; P＆gt;解决方案：一种精细电路布线的形成方法的特征在于，在电子电路用基板上通过铜合金电镀形成第一镀层，通过酸性镀铜形成第二镀层，并且形成了根据需要的阻挡层和种子层。精细电路布线形成装置具有用于形成第一镀层的铜合金电镀装置，用于形成第二镀层的酸性镀铜装置，用于洗涤这些镀层的清洗装置，以及用于进出基板用于电子电路。版权所有（C）2004，JPO

4. 发明专利

JP2003328184A Method for forming fine circuit wiring and apparatus used for the same 审中-公开
标题翻译：用于形成精细电路布线的方法和用于其的装置
公开(公告)号：JP2003328184A
公开(公告)日：2003-11-19
申请号：JP2002141230
申请日：2002-05-16
申请人： Ebara Corp , Ebara Udylite Kk , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： HONGO AKIHISA , FUKUNAGA AKIRA , NAGAI MIZUKI , KIMIZUKA RYOICHI , KOBAYASHI TAKESHI , SATO TAKURO
IPC分类号： C25D7/12 , C25D5/10 , C25D7/00 , H01L21/288 , H01L21/3205 , H01L23/52 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide means for preventing migration by slowing down and suppressing the movement of the copper atoms themselves from fine copper wiring formed by copper plating.
SOLUTION: The method for forming fine circuit wiring comprises forming a first plating layer by plating including the metal diffusible into the copper (provided that alloy plating with the copper is precluded) and a second plating layer by copper plating on a substrate for electronic circuits which is provided with fine circuit patterns and is formed with a barrier layer and a seed layer at need.
COPYRIGHT: (C)2004,JPO

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