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    • 10. 发明申请
    • LOW STRESS PACKAGING DESIGN TO MINIMIZE PELLET BLOCKING
    • 低应力包装设计,最大限度地减少颗粒堵塞
    • WO2018034887A1
    • 2018-02-22
    • PCT/US2017/045902
    • 2017-08-08
    • DOW GLOBAL TECHNOLOGIES LLC
    • DHODAPKAR, ShrikantGRAVOUILLA, Rocklyn, P.BELLEFONTAINE, William, B.BUENO, Fernanda, Bortolane
    • B65D71/06B65D19/06
    • Packaging configuration comprising: a pallet comprising a top surface, a bottom surface and a height HP; a first stack of bagged goods having a total height HL1, stacked on the pallet and comprising at least two layers; and a support structure comprising at least four walls situated over the first stack of bagged goods, one of the walls being a top wall and at least three of the walls being sidewalls. The support structure has a height HC that meets one of the following equations: HC > HL1, when the bottom end of at least one sidewall of the support structure is positioned on the top surface of the at least one pallet; or HC > HP + HL1, when the bottom end of at least one sidewall of the support structure and the bottom surface of the pallet are both positioned on the same surface. An air gap having a height HAG is situated between a top layer of the first stack of bagged goods and the top wall of the support structure.
    • 包装配置,包括:托盘,其包括顶面,底面和高度HP; 堆叠在货盘上并具有至少两层的具有总高度HL1的第一批袋装货物; 以及支撑结构,其包括位于袋装物品的第一叠层上方的至少四个壁,其中一个壁是顶壁并且至少三个壁是侧壁。 支撑结构具有满足以下等式之一的高度HC:HC> HL1,当所述支撑结构的至少一个侧壁的底端位于所述至少一个托盘的顶表面上时; 或HC> 当支撑结构的至少一个侧壁的底端和托盘的底面都位于同一表面上时,HP + HL1。 具有高度HAG的气隙位于袋装物品的第一叠层的顶层和支撑结构的顶壁之间。