专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2015062108A1 MULTILAYER DOWN-CONVERTING ENCAPSULANT FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME 审中-公开
标题翻译：多层下转换封装膜和包括其的电子器件
公开(公告)号：WO2015062108A1
公开(公告)日：2015-05-07
申请号：PCT/CN2013/086510
申请日：2013-11-04
申请人： DOW GLOBAL TECHNOLOGIES LLC , ROHM AND HAAS COMPANY , NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
发明人： NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
IPC分类号： H01L31/048 , B32B27/08 , C09K11/06
CPC分类号： H01L31/055 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/306 , B32B27/308 , B32B27/32 , B32B2264/00 , B32B2307/206 , B32B2307/422 , B32B2307/72 , B32B2307/7246 , B32B2457/00 , B32B2457/12 , C09K11/02 , C09K11/06 , C09K2211/1007 , C09K2211/1092 , C09K2211/182 , H01L31/0296 , H01L31/0322 , H01L31/048 , H01L31/0481 , Y02E10/52
摘要： A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt% based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
摘要翻译：具有至少两层的多层包封膜包括包含密封剂树脂的第一层和包含密封剂树脂和至少一种下转换器如稀土有机金属络合物的第二层。下转换器可以以基于密封剂膜的总重量的至少0.0001重量％的量存在。多层密封剂膜的其它层可以包括或可以不包括下变频器。优选地，多层密封剂膜包含至少一个具有至少一个下变换器的层和至少一个没有下变频器的层。这种多层下转换膜可以用于诸如PV模块的电子设备中。

2. 发明公开

EP3066695A1 MULTILAYER DOWN-CONVERTING ENCAPSULANT FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME 审中-公开
标题翻译： MEHRSCHICHTIGEABWÄRTSUMWANDELNDEVERKAPSELUNGSFOLIEN UND ELEKTRONISCHE VORRICHTUNGEN DAMIT
公开(公告)号：EP3066695A1
公开(公告)日：2016-09-14
申请号：EP13896824.3
申请日：2013-11-04
申请人： Dow Global Technologies LLC , Rohm and Haas Company
发明人： NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
IPC分类号： H01L31/048 , B32B27/08 , C09K11/06
CPC分类号： H01L31/055 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/306 , B32B27/308 , B32B27/32 , B32B2264/00 , B32B2307/206 , B32B2307/422 , B32B2307/72 , B32B2307/7246 , B32B2457/00 , B32B2457/12 , C09K11/02 , C09K11/06 , C09K2211/1007 , C09K2211/1092 , C09K2211/182 , H01L31/0296 , H01L31/0322 , H01L31/048 , H01L31/0481 , Y02E10/52 , Y02E10/541
摘要： A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.
摘要翻译：具有至少两层的多层包封膜包括包含密封剂树脂的第一层和包含密封剂树脂和至少一种下转换器如稀土有机金属络合物的第二层。下转换器可以以基于密封剂膜的总重量的至少0.0001重量％的量存在。多层密封膜的另外的层可以包括或可以不包括下变频器。优选地，多层封装膜包含至少一个具有至少一个下变换器的层和至少一个不具有下变频器的层。这种多层下变换膜可以用于诸如PV模块的电子设备中。

3. 发明授权

EP3066695B1 MULTILAYER DOWN-CONVERTING ENCAPSULANT FILMS AND ELECTRONIC DEVICES INCLUDING THE SAME 审中-公开
公开(公告)号：EP3066695B1
公开(公告)日：2018-12-26
申请号：EP13896824.3
申请日：2013-11-04
申请人： Dow Global Technologies LLC , Rohm and Haas Company
发明人： NAUMOVITZ, John A. , CHEN, Hongyu , HUANG, Yan , ZHANG, Ada Yu , XU, Zhi
IPC分类号： H01L31/048 , B32B27/08 , C09K11/06 , B32B27/30
CPC分类号： H01L31/055 , B32B27/08 , B32B27/18 , B32B27/20 , B32B27/306 , B32B27/308 , B32B27/32 , B32B2264/00 , B32B2307/206 , B32B2307/422 , B32B2307/72 , B32B2307/7246 , B32B2457/00 , B32B2457/12 , C09K11/02 , C09K11/06 , C09K2211/1007 , C09K2211/1092 , C09K2211/182 , H01L31/0296 , H01L31/0322 , H01L31/048 , H01L31/0481 , Y02E10/52 , Y02E10/541
摘要： A multilayer encapsulant film having at least two layers includes a first layer comprising an encapsulant resin, and a second layer comprising an encapsulant resin and at least one down-converter, such as a rare-earth organometallic complex. The down-converter may be present in an amount of at least 0.0001 wt % based on the total weight of the encapsulant film. Further layers of a multilayer encapsulant film may or may not include a down-converter. Preferably, a multilayer encapsulant film contains at least one layer with at least one down-converter and at least one layer without a down-converter. Such multilayer down-converting films may be used in an electronic device, such as a PV module.

4. 发明申请

WO2017087776A1 POLYMER BLENDS FOR USE IN MULTILAYER STRUCTURE AND MULTILAYER STRUCTURES COMPRISING THE SAME 审中-公开
标题翻译：用于多层结构的聚合物混合物和包含相同结构的多层结构
公开(公告)号：WO2017087776A1
公开(公告)日：2017-05-26
申请号：PCT/US2016/062729
申请日：2016-11-18
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： PEREZ, Carmelo Declet , WALTHER, Brian W. , COOPER, James L. , BISCOGLIO, Michael B. , NAUMOVITZ, John A.
IPC分类号： C08L23/08
CPC分类号： C08L23/0815 , C08L2203/16 , C08L33/08 , C08L33/10 , C08L67/00
摘要： The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having an acid content greater than 4 and up to 25 weight percent based on the weight of the copolymer and having a melt index (I 2 ) of 1 to 60 g/10 minutes, wherein the total amount of ethylene acrylic acid copolymer and ethylene methacrylic acid copolymer comprises 45 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm 3 or more and having a melt index (I 2 ) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 55 weight percent of the blend based on the total weight of the blend.
摘要翻译：本发明提供了可用于多层结构的聚合物共混物和包含由这种共混物形成的一个或多个层的多层结构。在一个方面，聚合物共混物包含共聚物，该共聚物包含乙烯和丙烯酸和甲基丙烯酸中的至少一种，其酸含量大于4且至多25重量％，基于共聚物的重量并具有熔体指数（I < 其中乙烯丙烯酸共聚物和乙烯甲基丙烯酸共聚物的总量占共混物的45-99重量％，基于共混物的总重量计，和密度为0.870克/厘米3或更高并且熔体指数（I 2）为20克/ 10分钟或更低的聚烯烃，其中聚烯烃包含1 至55％（重量）的混合物，基于混合物的总重量。

5. 发明申请

WO2013116649A1 SILANE-CONTAINING ETHYLENE INTERPOLYMER FORMULATION INCLUDING FILMS AND ELECTRONIC DEVICE MODULE COMPRISING SAME 审中-公开
标题翻译：含有乙烯的乙烯嵌段共聚物配方包括膜和包含其的电子器件模块
公开(公告)号：WO2013116649A1
公开(公告)日：2013-08-08
申请号：PCT/US2013/024344
申请日：2013-02-01
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： NANJUNDIAH, Kumar , NAUMOVITZ, John A. , PATEL, Rajen M. , HUGHES, Morgan M. , CERK, Frank J.
IPC分类号： C08F255/02 , H01L31/048 , C08F210/16 , B32B17/10 , C08F230/08
CPC分类号： H01L31/0481 , B32B17/10018 , B32B17/1055 , B32B17/10697 , C08F4/65908 , C08F4/65912 , C08F255/02 , C08J5/18 , C08J2351/06 , H01L31/048 , H02S40/34 , Y02E10/50 , C08F230/08 , C08F2500/08 , C08F2500/26 , C08F210/16 , C08F210/14 , C08F4/64093 , C08F4/6592
摘要： Disclosed in more detail in this application are ethylene interpolymer films having one or more layers, comprising surface layer comprising: (A) a silane-containing ethylene interpolymer comprising (1) an ethylene interpolymer having a density of less than 0.905 g/cm3, and (2) at least 0.1 percent by weight alkoxysilane; characterized by: (3) having a volume resistivity of greater than 5 x 1015 ohm-cm as measured at 60C. In one embodiment, such ethylene interpolymer has a residual boron content of less than 10 ppm and residual aluminum content of less than 100 ppm. Also disclosed are laminated electronic device modules comprising: A. at least one electronic device, and B. one of the ethylene interpolymer films as described above in intimate contact with at least one surface of the electronic device. Such laminated electronic device modules according to the invention have been shown to suffer reduced potential induced degradation ("PID").
摘要翻译：在本申请中更详细地公开的是具有一层或多层的乙烯互聚物膜，其包含表面层，其包含：（A）含硅烷的乙烯互聚物，其包含（1）密度小于0.905g / cm 3的乙烯互聚物，以及（2）至少0.1重量％的烷氧基硅烷; 其特征在于：（3）在60℃下测得体积电阻率大于5×1015欧姆 - 厘米。在一个实施方案中，这种乙烯互聚物具有小于10ppm的残余硼含量和小于100ppm的残余铝含量。还公开了层压电子器件模块，其包括：A.至少一个电子器件，和B.如上所述的乙烯互聚物膜之一，与电子器件的至少一个表面紧密接触。已经示出了根据本发明的这种层压电子设备模块遭受减少的电位诱导退化（“PID”）。

6. 发明申请

WO2022164518A1 POLYETHYLENE COMPOSITIONS, FILMS, AND ARTICLES 审中-公开
公开(公告)号：WO2022164518A1
公开(公告)日：2022-08-04
申请号：PCT/US2021/062637
申请日：2021-12-09
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： BISWAS, Sanjib , DEGROOT, Jacquelyn A. , DEMIRORS, Mehmet , SPIEKERMANN, Erica , NAUMOVITZ, John A. , GINGER, Douglas S. , MEKAP, Dibyaranjan
IPC分类号： B32B27/32 , C08L23/08
摘要： Embodiments of a polyethylene composition are provided, which may include a first polyethylene fraction comprising at least one peak in a temperature range of from 40C to 75C in an elution profile via improved comonomer composition distribution (iCCD) analysis method, where a first polyethylene area fraction is an area in the elution profile from 40C to 75C, and where the first polyethylene fraction area comprises from 45% to 65% of the total area of the elution profile; and a second polyethylene fraction comprising at least one peak in a temperature range of from 85C to 110C in the elution profile, where a second polyethylene area fraction is an area in the elution profile from 85C to 110C, and where the second polyethylene fraction area comprises from 15% to 35% of the total area of the elution profile, wherein the polyethylene composition has a density of 0.905 g/cm3 to 0.918 g/cm3, a melt index (I2) of 0.7 g/10 minutes to 3.5 g/10 minutes, and wherein the composition has a melt index ratio ( I10/I2) that meets the following equation: I10/I2

7. 发明申请

WO2017040037A1 METHODS OF PREPARING VINYLIDENE CHLORIDE POLYMER COMPOSITIONS 审中-公开
标题翻译：制备乙烯基氯化物聚合物组合物的方法
公开(公告)号：WO2017040037A1
公开(公告)日：2017-03-09
申请号：PCT/US2016/047233
申请日：2016-08-17
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： ZHANG, Huiqing , BEYER, Douglas E. , NAUMOVITZ, John A.
IPC分类号： C08J3/00 , C08J3/16 , C08L27/08 , C08J5/18 , C08K5/11
CPC分类号： C08J3/16 , C08J3/005 , C08J5/18 , C08J2327/08 , C08J2423/06 , C08J2433/00 , C08J2433/06 , C08L27/08 , C08L2205/03 , C08L23/06 , C08L33/06
摘要： The present invention relates generally to methods of preparing vinylidene chloride polymer compositions. In one embodiment, a method of preparing a vinylidene chloride polymer composition comprises (a) adding a first dispersion comprising a wax, a polyolefin or a combination thereof to an aqueous dispersion comprising vinylidene chloride polymer particles; (b) adding an acrylic polymer latex to the aqueous dispersion; and (c) coagulating the wax, the polyolefin, or the combination of the wax and polyolefin, and the acrylic polymer on the surface of the polymer particles.
摘要翻译：本发明一般涉及制备偏二氯乙烯聚合物组合物的方法。在一个实施方案中，制备偏二氯乙烯聚合物组合物的方法包括（a）将包含蜡，聚烯烃或其组合的第一分散体加入包含偏二氯乙烯聚合物颗粒的水分散体中; （b）向所述水性分散体中加入丙烯酸聚合物胶乳; 和（c）在聚合物颗粒的表面上凝结蜡，聚烯烃或蜡和聚烯烃以及丙烯酸类聚合物的组合。

8. 发明申请

WO2021206941A1 ENHANCED MELT STRENGTH LOW-DENSITY POLYETHYLENE FOR USE IN FILMS OR BLENDS 审中-公开
公开(公告)号：WO2021206941A1
公开(公告)日：2021-10-14
申请号：PCT/US2021/024600
申请日：2021-03-29
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： KARJALA, Teresa P. , NAUMOVITZ, John A. , ZENG, Yongchao , ASKAR, Shadid , INGEHOLM, Joshua R. , MENDENHALL, Jonathan D. , ORTEGA, Jose , O'BRIEN, John P.
IPC分类号： C08F2/34 , C08F2/38 , C08F10/02
摘要： A low-density polyethylene having a melt strength measured at 190 C that is greater than or equal to 5.5 cN, a density that is greater than or equal to 0.9210 g/cm3 and less than or equal to 0.9275 g/cm3, and, and a melt index I2 measured at 190 °C that is greater than or equal to 4.5 g/10 min.

9. 发明申请

WO2018160558A1 ETHYLENE-BASED POLYMERS WITH GOOD PROCESSABILITY FOR USE IN MULTILAYER FILMS 审中-公开
公开(公告)号：WO2018160558A1
公开(公告)日：2018-09-07
申请号：PCT/US2018/019947
申请日：2018-02-27
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： KARJALA, Teresa P. , ORTEGA, Jose , KARDOS, Lori L. , GILLESPIE, David T. , NAUMOVITZ, John A. , LAI, Chuan Yar , POLK, Zachary L.
IPC分类号： B32B27/32
摘要： A composition comprising an ethylene-based polymer which comprises the following properties: a) MWD(conv) from 3.0 to 7.0; b) an ADF IR between 0.230 and 0.260 for molecular weight ≤ 15,000 g/mol c) I2 from 4.0 to 6.5 g/10 min.

10. 发明申请

WO2017040036A8 VINYLIDENE CHLORIDE POLYMER COMPOSITIONS AND ARTICLES COMPRISING THE SAME 审中-公开
标题翻译：乙烯氯化物聚合物组合物和包含该组合物的制品
公开(公告)号：WO2017040036A8
公开(公告)日：2017-03-09
申请号：PCT/US2016/047232
申请日：2016-08-17
申请人： DOW GLOBAL TECHNOLOGIES LLC
发明人： ZHANG, Huiqing , BEYER, Douglas E. , NAUMOVITZ, John A.
IPC分类号： C08L27/08 , C08L33/06 , C08L91/06 , C08L23/30
摘要： The present invention relates generally to vinylidene chloride polymer compositions. In one embodiment, a vinylidene chloride polymer composition comprises (a) a vinylidene chloride polymer formed from a monomer mixture comprising from 60 to 99 weight percent vinylidene chloride monomer and from 40 to 1 weight percent of a monoethylenically unsaturated monomer copolymerizable therewith; (b) 0.3 to 5 weight percent of an acrylic polymer based on the total weight of the polymer composition; and (c) 0.2 to 7 weight percent of at least one additive comprising (i) at least one wax in an amount of from 0.01 to 2 weight percent based on the total weight of the polymer composition, (ii) at least one polyethylene having a density greater than 0.940 g/cm3 in an amount of from 0.1 to 5 weight percent based on the total weight of the polymer composition, or combinations thereof.
摘要翻译：本发明一般涉及偏二氯乙烯聚合物组合物。在一个实施方案中，偏二氯乙烯聚合物组合物包含（a）由包含60-99重量％偏二氯乙烯单体和40-1重量％可与其共聚的单烯键式不饱和单体的单体混合物形成的偏二氯乙烯聚合物; （b）基于所述聚合物组合物的总重量，0.3-5重量％的丙烯酸类聚合物; （c）0.2至7重量％的至少一种添加剂，所述添加剂包含（i）基于聚合物组合物的总重量，0.01至2重量％的至少一种蜡，（ii）至少一种聚乙烯，基于聚合物组合物的总重量为0.1-5重量％的大于0.940g / cm 3的密度，或其组合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式