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    • 6. 发明申请
    • A CURABLE EPOXY RESIN COMPOSITION HAVING A MIXED CATALYST SYSTEM AND LAMINATES MADE THEREFROM
    • 具有混合催化剂体系的可固化环氧树脂组合物及其制备的层压体
    • WO2007075718A1
    • 2007-07-05
    • PCT/US2006/048484
    • 2006-12-19
    • DOW GLOBAL TECHNOLOGIES INC.VALETTE, LudovicAOYAMA, Tomoyuki
    • VALETTE, LudovicAOYAMA, Tomoyuki
    • C08G59/62C08G59/68
    • C08G59/621C08G59/686C08G59/688H05K1/0326Y10T428/31525Y10T428/31529Y10T442/2418
    • A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170cC; and the cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil. The laminate shows a combination of superior glass transition temperature, decomposition temperature, time to delamination at 288°C, adhesion to copper foil, and excellent flame retardancy.
    • 一种可固化含卤素的环氧树脂组合物,其包含:(a)至少一种环氧树脂; (b)至少一种硬化剂; 其中所述固化剂是含有酚羟基官能团的化合物或在加热时能够产生酚羟基官能团的化合物; 和(c)催化量的催化剂体系,其包含以下组合的组合:(i)至少包含至少一种含氮催化剂化合物的第一催化剂化合物; 和(ii)至少一种包含至少一种含磷催化剂化合物的第二催化剂化合物; 其中至少一种或多种上述组分(a) - (c)被卤化或含有卤素; 或者如果上述组分都不是卤化的,其中树脂组合物包括(d)不含氮的卤化或含卤阻燃化合物。 当在170℃下测量时,树脂组合物的冲程固化凝胶时间保持在90秒至600秒; 并且通过固化可固化环氧树脂组合物形成的固化产物包含良好平衡的性质。 该组合物可以用于通过层压上述预浸料和/或上述金属涂覆的箔来获得预浸料或金属涂覆的箔或层压体。 该叠层体表现出优异的玻璃化转变温度,分解温度,288℃下的分层时间,对铜箔的粘附性和优异的阻燃性的组合。
    • 8. 发明申请
    • USE OF FILLER THAT UNDERGOES ENDOTHERMIC PHASE TRANSITION TO LOWER THE REACTION EXOTHERM OF EPOXY BASED COMPOSITIONS
    • 使用内含物相转移的填料降低环氧化合物的反应过程
    • WO2009129084A1
    • 2009-10-22
    • PCT/US2009/039722
    • 2009-04-07
    • DOW GLOBAL TECHNOLOGIES INC.VALETTE, LudovicDEBRUYNE, ThomasOCCHIELLO, Ernesto
    • VALETTE, LudovicDEBRUYNE, ThomasOCCHIELLO, Ernesto
    • C08G59/18
    • C08L63/00C08L23/04C08L2666/06
    • Disclosed are curable epoxy-based resins having a lower peak exotherm during cure, as well as thermoset resins and epoxy-based parts formed from the curable epoxy-based compositions. The epoxy-based compositions having a lower peak exotherm during cure may include: at least one epoxy resin, at least one hardener, and at least one endothermic transition additive. The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm during cure, which may be useful when forming large epoxy-based parts, such as those including 200 grams or more of the thermoset resin. Also disclosed is a process for forming curable epoxy-based resins having a lower peak exotherm during cure, including: admixing at least one epoxy resin; at least one hardener; and at least one endothermic transition additive; to form a curable composition. The resulting curable composition may then be thermally cured at a temperature of at least 60°C to form a thermoset resin.
    • 公开了在固化期间具有较低峰值放热的可固化环氧基树脂以及由可固化环氧基组合物形成的热固性树脂和环氧基部分。 固化期间具有较低峰值放热的环氧基组合物可包括:至少一种环氧树脂,至少一种硬化剂和至少一种吸热转变添加剂。 热固性树脂可以包括在固化期间具有较低峰值放热的可固化环氧基树脂的反应产物,其可以在形成大的环氧基部分(例如包含200克或更多的热固性树脂的那些)时有用。 还公开了一种在固化期间形成具有较低峰值放热的可固化环氧基树脂的方法,包括:混合至少一种环氧树脂; 至少一种硬化剂; 和至少一种吸热转变添加剂; 以形成可固化组合物。 然后将得到的可固化组合物在至少60℃的温度下热固化,以形成热固性树脂。