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1. 发明申请

WO2003011945A2 SILOXANE RESINS 审中-公开
标题翻译：硅氧烷树脂
公开(公告)号：WO2003011945A2
公开(公告)日：2003-02-13
申请号：PCT/US2002/019283
申请日：2002-06-18
申请人： DOW CORNING CORPORATION , DOW CORNING S.A. , DOW CORNING ASIA, LTD. , ALBAUGH, John , BOISVERT, Ronald , BUJALSKI, Duane , CHEVALIER, Pierre , EGUCHI, Katsuya , KING, Russell , OU, Duan-Li , SU, Kai
发明人： ALBAUGH, John , BOISVERT, Ronald , BUJALSKI, Duane , CHEVALIER, Pierre , EGUCHI, Katsuya , KING, Russell , OU, Duan-Li , SU, Kai
IPC分类号： C08G77/00
CPC分类号： H01L21/31695 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/04 , C09D4/00 , C09D183/04 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/3122 , C08G77/04
摘要： This invention pertains to a siloxane resin composition comprising R 1 SiO 3/2 siloxane units R 2 SiO 3/2 siloxane units and (R 3 O) b SiO (4-b)/2 siloxane units wherein R 1 is an alkyl group having 1 to 5 carbons, hydrogen, or mixtures thereof; R 2 is a monovalent organic group having 6 to 30 carbons; R 3 is a branched alkyl group having 3 to 30 carbons, b is from 1 to 3; and the siloxane resin contains from 2.5 to 85 mole percent R 1 SiO 3/2 units, 2.5 to 50 mole percent R 2 SiO 3/2 units and 5 to 95 mole percent (R 3 O) b SiO (4-b)/2 units. The siloxane resin is useful to make insoluble porous resin and insoluble porous resin and insoluble porous coatings. Heating a substrate coated with the siloxane resin at a sufficient temperature effects removal of the R 2 and R 3 O groups to form an insoluble insoluble porous coating having a porosity of 1 to 60 volume percent and a dielectric constant in the range of 1.5 to 3.0.
摘要翻译：本发明涉及包含R 1 SiO 3/2硅氧烷单元R 2 SiO 2的硅氧烷树脂组合物，（4-b）/ 2硅氧烷单元和（R 3 O）SiO 1/2（4-b）/ 2硅氧烷单元，其中 R 1是具有1至5个碳的烷基，氢或其混合物; R 2是具有6至30个碳的一价有机基团; R 3是具有3至30个碳的支链烷基，b是1至3; 并且硅氧烷树脂含有2.5至85摩尔％的R 1 / SiO 3/2单元，2.5至50摩尔％的R 2 SiO _{（3/3）单元和5至95摩尔％（R 3 O）b SiO（4-b）/ 2 单位。硅氧烷树脂用于制备不溶性多孔树脂和不溶性多孔树脂以及不溶性多孔涂层。在足够的温度下加热涂覆有硅氧烷树脂的基材，除去R 2和R 3 O基团，形成孔隙率为1到3的不溶性不溶性多孔涂层 60体积％，介电常数在1.5-3.0范围内。}

2. 发明公开

EP1412435A2 SILOXANE RESINS 审中-公开
标题翻译： SILOXANHARZE
公开(公告)号：EP1412435A2
公开(公告)日：2004-04-28
申请号：EP02756227.1
申请日：2002-06-18
申请人： DOW CORNING CORPORATION , DOW CORNING S.A. , Dow Corning Asia, Ltd.
发明人： ALBAUGH, John , BOISVERT, Ronald , BUJALSKI, Duane , CHEVALIER, Pierre , EGUCHI, Katsuya , KING, Russell , OU, Duan-Li , SU, Kai
IPC分类号： C09D4/00
CPC分类号： H01L21/31695 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/24 , C08L83/04 , C09D4/00 , C09D183/04 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/3122 , C08G77/04
摘要： This invention pertains to a siloxane resin composition comprising R1SiO3/2 siloxane units R2SiO3/2 siloxane units and (R3O)bSiO(4-b)/2 siloxane units wherein R1 is an alkyl group having 1 to 5 carbons, hydrogen, or mixtures thereof; R2 is a monovalent organic group having 6 to 30 carbons; R3 is a branched alkyl group having 3 to 30 carbons, b is from 1 to 3; and the siloxane resin contains from 2.5 to 85 mole percent R1SiO3/2 units, 2.5 to 50 mole percent R2SiO3/2 units and 5 to 95 mole percent (R3O)bSiO(4-b)/2 units. The siloxane resin is useful to make insoluble porous resin and insoluble porous resin and insoluble porous coatings. Heating a substrate coated with the siloxane resin at a sufficient temperature effects removal of the R?2 and R3¿O groups to form an insoluble insoluble porous coating having a porosity of 1 to 60 volume percent and a dielectric constant in the range of 1.5 to 3.0.

3. 发明申请

WO2006031455A2 LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS 审中-公开
标题翻译：使用硅胶的光刻技术
公开(公告)号：WO2006031455A2
公开(公告)日：2006-03-23
申请号：PCT/US2005/031150
申请日：2005-08-31
申请人： DOW CORNING CORPORATION , BAHADUR, Maneesh , CHEN, Wei , ALBAUGH, John , HARKNESS, Brian , TONGE, James
发明人： BAHADUR, Maneesh , CHEN, Wei , ALBAUGH, John , HARKNESS, Brian , TONGE, James
IPC分类号： G03F7/00 , G03F7/027 , G03F7/004
CPC分类号： B82Y10/00 , B82Y40/00 , C08F220/18 , C08F220/22 , C08F222/1006 , G03F7/0002 , G03F7/0046 , G03F7/027
摘要： A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
摘要翻译：一种方法包括以下步骤：A）用可固化（甲基）丙烯酸酯配方填充具有图案化表面的硅酮模具，B）固化可固化（甲基）丙烯酸酯配方以形成图案化特征，C）将硅氧烷模具和图案化特征，任选地D）蚀刻图案化特征，以及任选地E）重复步骤A）至D）重新使用硅酮模具。可固化（甲基）丙烯酸酯配方含有氟官能（甲基）丙烯酸酯，（甲基）丙烯酸酯和光引发剂。

4. 发明申请

WO2007145711A1 ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME 审中-公开
标题翻译：电子封装及其制备方法
公开(公告)号：WO2007145711A1
公开(公告)日：2007-12-21
申请号：PCT/US2007/009917
申请日：2007-04-24
申请人： DOW CORNING CORPORATION , ALBAUGH, John , CAMILLETTI, Robert
发明人： ALBAUGH, John , CAMILLETTI, Robert
IPC分类号： H01L23/29 , G03F7/075 , H01L23/31
CPC分类号： H01L23/296 , G03F7/0757 , G03F7/0758 , H01L23/3192 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/13055 , H01L2924/13063 , H01L2924/13091 , H01L2924/19041 , Y10T428/265 , Y10T428/31504 , H01L2924/00
摘要： An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.
摘要翻译：一种包括在第一无机阻挡涂层和第二无机阻挡涂层之间的界面涂层的电子封装，其中所述界面涂层包括硅树脂的固化产物; 以及制备电子包装的方法。

5. 发明申请

WO2014143627A1 CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME 审中-公开
标题翻译：可固化的硅酮组合物，导电硅胶粘合剂，制造和使用它们的方法以及包含它们的电气装置
公开(公告)号：WO2014143627A1
公开(公告)日：2014-09-18
申请号：PCT/US2014/025149
申请日：2014-03-13
申请人： DOW CORNING CORPORATION
发明人： ALBAUGH, John , CHISLEA, Brian , ZAMBOVA, Adriana
IPC分类号： C09J183/04 , H01B1/22 , C09J9/02 , H01R4/04
CPC分类号： C09J9/02 , C08K3/08 , C08K9/02 , C08K9/10 , C08K2003/0806 , C08K2003/085 , C08K2201/001 , C08L83/00 , C09J183/04 , H01R4/04
摘要： A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu-Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu-Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
摘要翻译：包含可固化的有机硅氧烷组合物，铜 - 银（Cu-Ag）核 - 壳颗粒和烃载体的可固化的硅氧烷组合物; 可固化的有机硅组合物可以通过以下方法表征：Cu-Ag核 - 壳颗粒的浓度为70-89％（重量），银的总浓度为7.0至14％（重量），均以可固化的有机硅组合物的重量计; 其中所述组合物可保持固化至根据体积电阻率测试方法测量的体积电阻率小于0.020欧姆厘米的导电硅酮粘合剂。

6. 发明申请

WO2014159792A1 CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME 审中-公开
标题翻译：可固化的硅氧烷组合物，导电硅胶粘合剂，制造和使用它们的方法以及包含其的电气装置
公开(公告)号：WO2014159792A1
公开(公告)日：2014-10-02
申请号：PCT/US2014/025151
申请日：2014-03-13
申请人： DOW CORNING CORPORATION
发明人： ALBAUGH, John , CHISLEA, Brian , ZAMBOVA, Adriana
IPC分类号： H01B1/22 , C08L83/04
CPC分类号： H01B1/22 , C08G77/12 , C08G77/20 , C08K3/08 , C08K5/01 , C08K2003/0806 , C08L83/04
摘要： A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total concentration of silver of less than 45 weight percent and lacking gold and copper metals while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.003 Ohm-centimeter without increasing the concentration of silver in the curable silicone composition to 45 weight percent or higher and without increasing total concentration of electrically conductive metal in the curable silicone composition to 80 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device; wherein the total concentration of all solids in the curable silicone composition is at least 60 weight percent.
摘要翻译：含有可固化的有机硅氧烷组合物，银以及除了银以外的至少一种导电金属的可固化的硅氧烷组合物，所述可固化的有机硅组合物可以由小于45重量％的银的总浓度表征，并且不含金和铜金属，而组合物仍然可固化成具有小于0.003欧姆厘米的体积电阻率的导电硅氧烷粘合剂，而不将可固化有机硅组合物中的银浓度增加至45重量％或更高，并且不增加可固化有机硅组合物中的导电金属的总浓度至80重量％或更高，导电硅树脂粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法; 其中可固化硅氧烷组合物中所有固体的总浓度为至少60重量％。

7. 发明申请

WO2014099639A1 CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME 审中-公开
标题翻译：可固化的硅氧烷组合物，导电硅胶粘合剂，制造和使用它们的方法以及包含其的电气装置
公开(公告)号：WO2014099639A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/074868
申请日：2013-12-13
申请人： DOW CORNING CORPORATION
发明人： ALBAUGH, John , CHISLEA, Brian , ZAMBOVA, Adriana
IPC分类号： C08K3/08 , C08L83/04 , C08K9/02 , C09J9/02 , C09J183/04 , H01B1/22
CPC分类号： C08K3/08 , C08G77/12 , C08G77/14 , C08G77/20 , C08K3/04 , C08K3/041 , C08K5/56 , C08K9/02 , C08K2003/0806 , C08K2201/001 , C08L83/00 , C09J9/02 , C09J183/04 , C09J2201/602 , H01B1/22 , H05K1/0373 , C08L83/04
摘要： A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to Tl Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
摘要翻译：一种含有可固化的有机硅氧烷组合物，银和除了银以外的至少一种导电金属的可固化的硅氧烷组合物，可固化的有机硅组合物可以由总银浓度为50至小于60重量％表征，触变指数可调根据Tl测试方法测量的3至10，而组合物可固化至根据体积电阻率测试方法测量的体积电阻率小于0.001欧姆厘米的导电硅氧烷粘合剂，而不增加导电性金属的总浓度可固化硅氧烷组合物至72重量％或更高，导电硅氧烷粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法。

8. 发明公开

EP2935429A1 CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME 有权转让
标题翻译：固化硅组合物，导电性有机硅胶粘剂，方法的生产和使用，以及它们的电气设备THAT
公开(公告)号：EP2935429A1
公开(公告)日：2015-10-28
申请号：EP13814378.9
申请日：2013-12-13
申请人： Dow Corning Corporation
发明人： ALBAUGH, John , CHISLEA, Brian , ZAMBOVA, Adriana
IPC分类号： C08K3/08 , C08L83/04 , C08K9/02 , C09J9/02 , C09J183/04 , H01B1/22
CPC分类号： C08K3/08 , C08G77/12 , C08G77/14 , C08G77/20 , C08K3/04 , C08K3/041 , C08K5/56 , C08K9/02 , C08K2003/0806 , C08K2201/001 , C08L83/00 , C09J9/02 , C09J183/04 , C09J2201/602 , H01B1/22 , H05K1/0373 , C08L83/04
摘要： A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
摘要翻译：一种可固化的有机硅组合物含有固化性有机硅氧烷组合物，银和银以外的至少一种导电金属，可固化的硅氧烷组合物，其表征通过从50的总银浓度降低至小于60％（重量）和触变指数确实是可调节的从3到10测量雅丁到TI测试方法而组合物保持可固化成在导电性有机硅粘合剂具有测量的雅丁到体积电阻率的测试方法小于0001欧姆 - 厘米的体积电阻率而不会在增加导电金属的总浓度可固化的硅氧烷组合物到72％（重量）或更高，则导电性的有机硅粘合剂，电气设备包含导电有机硅粘合剂，以及制造该电气设备的方法。

9. 发明公开

EP2970728A1 CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME 审中-实审转让
标题翻译：固化硅组合物，导电性有机硅胶粘剂，方法的生产和使用，以及它们的电气设备THAT
公开(公告)号：EP2970728A1
公开(公告)日：2016-01-20
申请号：EP14725564.0
申请日：2014-03-13
申请人： Dow Corning Corporation
发明人： ALBAUGH, John , CHISLEA, Brian , ZAMBOVA, Adriana
IPC分类号： C09J183/04 , H01B1/22 , C09J9/02 , H01R4/04
CPC分类号： C09J9/02 , C08K3/08 , C08K9/02 , C08K9/10 , C08K2003/0806 , C08K2003/085 , C08K2201/001 , C08L83/00 , C09J183/04 , H01R4/04
摘要： A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.

10. 发明公开

EP2024998A1 ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME 审中-公开
标题翻译：电子产品外壳及其制备方法
公开(公告)号：EP2024998A1
公开(公告)日：2009-02-18
申请号：EP07776086.6
申请日：2007-04-24
申请人： Dow Corning Corporation
发明人： ALBAUGH, John , CAMILLETTI, Robert
IPC分类号： H01L23/29 , G03F7/075 , H01L23/31
CPC分类号： H01L23/296 , G03F7/0757 , G03F7/0758 , H01L23/3192 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/13055 , H01L2924/13063 , H01L2924/13091 , H01L2924/19041 , Y10T428/265 , Y10T428/31504 , H01L2924/00
摘要： An electronic package comprising an interfacial coating between a first inorganic barrier coating and a second inorganic barrier coating, wherein the interfacial coating comprises a cured product of a silicone resin; and methods of preparing the electronic package.

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