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1. 发明申请

WO2016065016A1 VACUUM LAMINATION METHOD FOR FORMING A CONFORMALLY COATED ARTICLE AND ASSOCIATED CONFORMALLY COATED ARTICLES FORMED THEREFROM 审中-公开
标题翻译：用于形成一体化涂层物品的真空层压方法及其形成的相关的一体涂层制品
公开(公告)号：WO2016065016A1
公开(公告)日：2016-04-28
申请号：PCT/US2015/056682
申请日：2015-10-21
申请人： DOW CORNING CORPORATION
发明人： CUMMINGS, Michelle , NISHIDA, Fumito , SHEPHARD, Nick
IPC分类号： H01L33/52 , H01L33/20
CPC分类号： H01L25/0753 , B32B38/10 , B32B38/1866 , B32B2457/00 , H01L33/50 , H01L33/52 , H01L2924/0002 , H01L2924/00
摘要： Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.
摘要翻译：提供了用于形成具有共形涂覆在诸如LED阵列之类的物体上的预成型层压层的共形涂覆制品的真空层压方法。这些真空层压方法利用单个加热步骤将预成型层压层的中间部分加热至预先形成的层压层之前的可流动状态，该预成型层压层被共形地涂覆在制品上，例如设置在制品的内部上的发光二极管阵列底座晶片的第一侧。

2. 发明申请

WO2014075073A1 METHOD OF FORMING AN ELECTRONIC ARTICLE 审中-公开
标题翻译：形成电子文章的方法
公开(公告)号：WO2014075073A1
公开(公告)日：2014-05-15
申请号：PCT/US2013/069689
申请日：2013-11-12
申请人： DOW CORNING CORPORATION
发明人： FISHER, Mark , JUEN, Don , KETOLA, Barry , SHEPHARD, Nick
IPC分类号： C08L83/04 , H01L31/048
CPC分类号： H01L31/0481 , B32B37/1009 , B32B37/1292 , B32B37/18 , B32B2037/1253 , B32B2307/20 , B32B2307/40 , B32B2457/12 , C08G77/12 , C08G77/20 , C08L83/04 , H01L31/048 , H01L31/18 , Y02E10/50
摘要： An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25°C as measured at 1 radian per second at 1 to 5% strain. During lamination, the curable silicone composition cures to form the silicone encapsulant and air escapes from through the at least one passage.
摘要翻译：电子制品具有周边并且包括上覆层，设置在覆盖层上的光电子元件以及由可固化的硅氧烷组合物形成并且设置在光电元件上的硅树脂密封剂，所述光电子元件将所述光电子元件夹在所述覆盖层和所述硅树脂密封剂之间。电子制品是使用包括以可限定从电子制品的内部延伸到电子制品的周边的至少一个通道的图案的方式将可固化的硅氧烷组合物沉积在光电子元件上的步骤的方法形成的。该方法还包括层压上覆层，光电子元件和可固化硅氧烷组合物。可固化的有机硅组合物在25℃下的复数粘度为10,000至50,000,000cPs，以1弧度每秒1％至5％的应变测量。在层压期间，可固化的硅氧烷组合物固化以形成硅氧烷密封剂，空气通过至少一个通道逸出。

3. 发明公开

EP2917282A1 METHOD OF FORMING AN ELECTRONIC ARTICLE 有权转让
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES ELEKTRONISCHEN ARTIKELS
公开(公告)号：EP2917282A1
公开(公告)日：2015-09-16
申请号：EP13798474.6
申请日：2013-11-12
申请人： Dow Corning Corporation
发明人： FISHER, Mark , JUEN, Don , KETOLA, Barry , SHEPHARD, Nick
IPC分类号： C08L83/04 , H01L31/048
摘要： An electronic article has a perimeter and includes a superstrate, an optoelectronic element disposed on the superstrate, and a silicone encapsulant that is formed from a curable silicone composition and that is disposed on the optoelectronic element sandwiching the optoelectronic element between the superstrate and the silicone encapsulant. The electronic article is formed using a method that includes the step of depositing the curable silicone composition on the optoelectronic element in a pattern defining at least one passage extending from an interior of the electronic article to a perimeter of the electronic article. The method also includes laminating the superstrate, the optoelectronic element, and the curable silicone composition. The curable silicone composition has a complex viscosity of from 10,000 to 50,000,000 cPs at 25° C. as measured at 1 radian per second at 1 to 5% strain. During lamination, the curable silicone composition cures to form the silicone encapsulant and air escapes from through the at least one passage.
摘要翻译：电子制品具有周边并且包括上覆层，设置在覆层上的光电子元件和由可固化的硅氧烷组合物形成的硅氧烷密封剂，并且设置在光电子元件上，所述光电子元件将所述光电元件夹在所述覆盖层和所述硅树脂密封剂之间。该电子制品是使用包括将可固化硅氧烷组合物沉积在光电子元件上的方式形成的，该方法是限定从电子制品的内部延伸到电子制品的周边的至少一个通道的图案。该方法还包括层压上覆层，光电子元件和可固化硅氧烷组合物。可固化的硅氧烷组合物在25℃下具有10,000至50,000,000cPs的复数粘度，以1弧度/秒的1％至5％的应变测量。在层压期间，可固化的硅氧烷组合物固化以形成硅氧烷密封剂，空气通过至少一个通道逸出。

4. 发明公开

EP3210245A1 VACUUM LAMINATION METHOD FOR FORMING A CONFORMALLY COATED ARTICLE AND ASSOCIATED CONFORMALLY COATED ARTICLES FORMED THEREFROM 有权转让
标题翻译：形成共形涂层制品的真空层压方法及由其形成的相关共形涂层制品
公开(公告)号：EP3210245A1
公开(公告)日：2017-08-30
申请号：EP15851759.9
申请日：2015-10-21
申请人： Dow Corning Corporation
发明人： CUMMINGS, Michelle , NISHIDA, Fumito , SHEPHARD, Nick
IPC分类号： H01L33/52 , H01L33/20
CPC分类号： H01L33/54 , B32B37/003 , B32B37/1018 , B32B38/10 , B32B38/1866 , B32B2309/02 , B32B2309/04 , B32B2309/12 , B32B2457/00 , B32B2457/14 , B32B2457/20 , H01L24/93 , H01L25/0753 , H01L33/44 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/507 , H01L33/52 , H01L2924/0002 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2924/00
摘要： Vacuum lamination methods for forming conformally coated articles having a preformed lamination layer conformally coated to or on an object such as an LED array are provided. These vacuum lamination methods utilize a single heating step to heat a middle portion of the preformed lamination layer to a flowable condition prior to the preformed lamination layer being conformally coated over the article, such as the array of light emitting diodes disposed on an inner portion of a first side of a submount wafer.
摘要翻译：提供了用于形成共形涂覆制品的真空层压方法，该制品具有共形地涂覆到诸如LED阵列之类的物体上或物体上的预成型层合层。这些真空层压方法利用单个加热步骤将预先形成的层压层的中间部分加热到可流动状态，然后将预先形成的层压层共形地涂覆在制品上，例如布置在制品的内部部分上的发光二极管阵列基座晶片的第一侧。

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