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1. 发明专利

MY164532A ADHESIVE SHEET 未知
公开(公告)号：MY164532A
公开(公告)日：2017-12-29
申请号：MYPI2013004423
申请日：2012-05-28
申请人： DENKI KAGAKU KOGYO KK
发明人： SAITO TAKESHI , TAKATSU TOMOMICHI
IPC分类号： C09J133/06 , H01L21/301 , H01L21/683
摘要： AN ADHESIVE SHEET WHICH DOES NOT SUFFER FROM DETERIORATION WITH TIME IN CHIP-HOLDING ABILITY IN THE DICING PROCESS NOR CHIP-EXFOLIATING ABILITY IN THE PICKING-UP PROCESS IS PROVIDED. ACCORDING TO THE INVENTION, AN ADHESIVE SHEET FOR DICING AND/OR CONVEYING IS PROVIDED, THE ADHESIVE SHEET COMPRISING A SUBSTRATE AND AN ADHESIVE COMPOSITION LAMINATED THEREON, THE SUBSTRATE INCLUDING POLYVINYL CHLORIDE AND A POLYESTER-BASED PLASTICIZER, WHEREIN THE ADHESIVE COMPOSITION INCLUDES A (METH)ACRYLATE COPOLYMER COMPONENT (A) WITH A WEIGHT-AVERAGE MOLECULAR WEIGHT LOWER THAN 350,000 HAVING A FUNCTIONAL GROUP-CONTAINING MONOMER UNIT; AND A (METH)ACRYLATE COPOLYMER COMPONENT (B) WITH A WEIGHT-AVERAGE MOLECULAR WEIGHT OF 350,000 TO 2,000,000 HAVING A FUNCTIONAL GROUP-CONTAINING MONOMER UNIT, IN A MASS RATIO RANGING FROM 10 : 90 TO 90 : 10, WHEREIN A CONTENT OF A CROSS-LINKING AGENT WHICH REACTS WITH FUNCTIONAL GROUPS OF THE COMPONENT (A) AND THE COMPONENT (B) IS IN A RANGE OF 0.5 TO 20 MASS PARTS WITH RESPECT TO 100 MASS PARTS OF A SUM OF THE COMPONENT (A) AND THE COMPONENT (B), AND WHEREIN 10 TO 95 MASS % OF THE MONOMER UNIT COMPOSING THE COMPONENT (A) IS 2-ETHYLHEXYL ACRYLATE, AND 10 TO 95 MASS % OF THE MONOMER UNIT COMPOSING THE COMPONENT (B) IS BUTYL ACRYLATE.

2. 发明专利

SG186726A1 MULTILAYER ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 未知
公开(公告)号：SG186726A1
公开(公告)日：2013-02-28
申请号：SG2012092219
申请日：2011-07-01
申请人： DENKI KAGAKU KOGYO KK
发明人： SAITO TAKESHI , SHIKANO KAZUNORI
摘要： Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.

3. 发明专利

MY160284A ADHESIVE, ADHESIVE SHEET, AND PROCESS FOR PRODUCING ELECTRONIC COMPONENTS 未知
公开(公告)号：MY160284A
公开(公告)日：2017-02-28
申请号：MYPI2011005272
申请日：2010-05-10
申请人： DENKI KAGAKU KOGYO KK
发明人： KAWATA SATORU , SAITO TAKESHI
IPC分类号： H01L21/302
摘要： IN A CONVENTIONAL ADHESIVE SHEET (3) LAMINATED WITH A DIE ATTACHMENT FILM (4), THE DIE ATTACHMENT FILM SOMETIMES DROPS OFF FROM THE DIE CHIP (10) AT THE TIME OF PICK-UP AFTER DIE CHIP FORMATION BY DICING A WAFER (6). THE PRESENT INVENTION PROVIDES AN ADHESIVE INCLUDING A (METH) ACRYLATE ESTER POLYMER, A URETHANE ACRYLATE OLIGOMER HAVING 4 OR MORE VINYL GROUPS, AND SILICONE MICROPARTICLES. ANOTHER ASPECT OF THE INVENTION, PROVIDES A PROCESS FOR PRODUCING ELECTRONIC COMPONENTS, THE PROCESS INCLUDING: A WAFER-PASTING STEP OF PASTING A WAFER (6) ON A SURFACE OF A DIE ATTACHMENT FILM (4) OF AN ADHESIVE SHEET (1); A DICING STEP OF DICING THE WAFER INTO DIE CHIPS (10); AND A PICK-UP STEP OF PEELING THE DIE ATTACHMENT FILM (4) FROM THE ADHESIVE LAYER (1) AFTER THE DICING STEP, AND PICKING UP THE DIE CHIP (10) TOGETHER WITH THE DIE ATTACHMENT FILM (4). THE MOST ILLUSTRATIVE DRAWING IS

4. 发明专利

SG188989A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 未知
公开(公告)号：SG188989A1
公开(公告)日：2013-05-31
申请号：SG2013018643
申请日：2011-09-14
申请人： DENKI KAGAKU KOGYO KK
发明人： SAITO TAKESHI , TAKATSU TOMOMICHI
摘要： Provided is a method for manufacturing electronic component improved in chip-holding efficiency, pickup efficiency and contamination resistance in a well-balanced manner, the method comprising a semi-cured adhesive layer-forming step of forming a semi-cured adhesive layer on the rear face of a wafer, a fixing step of fixing the semi-cured adhesive layer of the wafer on a ring frame with a cohesive sheet, a dicing step of dicing the wafer into semiconductor chips, a UV-irradiating step of irradiating ultraviolet ray, and a pick-up step of picking up the chips and semi-cured adhesive layers from the cohesive layer, wherein the cohesive sheet has a cohesive layer of a cohesive agent having a particular composition formed on one face of its base film.

5. 发明专利

SG188959A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 未知
公开(公告)号：SG188959A1
公开(公告)日：2013-05-31
申请号：SG2013018007
申请日：2011-09-14
申请人： DENKI KAGAKU KOGYO KK
发明人： SAITO TAKESHI , TAKATSU TOMOMICHI
摘要： A method for manufacturing electronic parts, which is characteristic in that permits reduction of contamination to the semi-cured adhesive layer firmed on semiconductor wafer and the cohesive sheet used therein is superior in adhesiveness for example to the lead frame, the method comprising a semi-cured adhesive layer-forming step of forming a se cured adhesive layer by coating a pasty adhesive entirely over the rear face of a wafer and curing the pasty adhesive partially by radiation-ray10 irradiation or heating into the sheet shape, a fixing step of fixing the semi-cured adhesive layer formed on a wafer and a ring frame by bonding them to the cohesive layer of a cohesive sheet a dicing step of dicing the wafer together with the semi-cured adhesive layer with a dicing blade into semiconductor chips, and a pick-up step of picking up the chips carrying the semi-cured adhesive layer from the cohesive layer of the cohesive sheet after radiation-ray irradiation, wherein the photopolymerization initiator in the cohesive layer of the cohesive sheet has a particular property.(no suitable figure)

6. 发明专利

SG175933A1 ADHESIVE, ADHESIVE SHEET, AND PROCESS FOR PRODUCING ELECTRONIC COMPONENTS 未知
公开(公告)号：SG175933A1
公开(公告)日：2011-12-29
申请号：SG2011081999
申请日：2010-05-10
申请人： DENKI KAGAKU KOGYO KK
发明人： KAWATA SATORU , SAITO TAKESHI
摘要： ADHESIVE, ADHESIVE SHEET, AND PROCESS FOR PRODUCING OF ELECTRONICIn a conventional adhesive sheet laminated with a die attachment film, the die attachment film sometimes drops off from the die chip at the time of pick-up after die chip formation by dicing a wafer. The present invention provides an5 adhesive including a (meth)acrylate ester polymer, a urethane acrylate oligomer having 4 or more vinyl groups, and silicone microparticles. Another aspect of the invention provides a process for producing electronic components, the process including: a wafer-pasting step of pasting a wafer on a surface of a die attachment film of an adhesive sheet; a dicing step of dicing the wafer into die10 chips; and a pick-up step of peeling the die attachment film from the adhesive layer after the dicing step, and picking up the die chip together with the die attachment film.[Fig. I]

7. 发明公开

EP1564238A4 TAPE FOR BIDING ELECTRIC WIRE 有权
标题翻译：磁带电线的约束力
公开(公告)号：EP1564238A4
公开(公告)日：2011-05-04
申请号：EP02775445
申请日：2002-10-31
申请人： DENKI KAGAKU KOGYO KK
发明人： SAITA SEIJI , SUZUKI KAZUO , KAWASAKI SHIGEO , SAITO TAKESHI
IPC分类号： C08L23/08 , C08L23/10 , H01B3/44 , H01B7/295 , C08J5/18 , B65D63/10 , C09J7/02 , H01B7/00
CPC分类号： H01B3/441 , C08L23/0815 , C08L23/0869 , C08L23/10 , C08L2312/00 , H01B7/295 , Y10T428/25 , Y10T428/254 , Y10T428/2852 , Y10T428/2857 , C08L2666/04

8. 发明专利

JP2013173852A Conductive adhesive sheet, and method of manufacturing electronic component 有权
标题翻译：导电胶粘剂和制造电子元件的方法
公开(公告)号：JP2013173852A
公开(公告)日：2013-09-05
申请号：JP2012039387
申请日：2012-02-24
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： SAITO TAKESHI , TSUKUI TOMOYA
IPC分类号： C09J7/02 , C09J9/02 , C09J11/04 , C09J133/00 , H01B5/14 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a conductive adhesive sheet which has conductivity, wherein luminance of a semiconductor chip can be measured before a pickup in a method of manufacturing electronic components; and to provide a method of manufacturing the electronic components, using the conductive adhesive sheet.SOLUTION: A conductive adhesive sheet is formed by laminating a base material and an adhesive layer, wherein the adhesive layer contains: an adhesive that comprises as a principal component an acrylic polymer having a hydroxyl group; and a conductive agent consisting of carbon black or a carbon nano fiber.
摘要翻译：要解决的问题：提供一种具有导电性的导电性粘合片，其中，在制造电子部件的方法中，可以在拾取之前测量半导体芯片的亮度; 并提供使用导电性粘合片的电子部件的制造方法。导电性粘合片通过层叠基材和粘合剂层而形成，其中粘合层包含：粘合剂，其包含作为主要成分的粘合剂具有羟基的丙烯酸类聚合物; 以及由炭黑或碳纳米纤维构成的导电剂。

9. 发明专利

JP2012039053A Multilayer adhesive sheet and method of manufacturing electronic component 有权
标题翻译：多层粘合片和制造电子元件的方法
公开(公告)号：JP2012039053A
公开(公告)日：2012-02-23
申请号：JP2010227361
申请日：2010-10-07
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： SAITO TAKESHI , SHIKANO KAZUNORI
IPC分类号： H01L21/52 , C09J4/00 , C09J7/02 , C09J133/06 , C09J175/04 , C09J175/14 , H01L21/301
CPC分类号： H01L21/78 , C08F220/18 , C08F222/1006 , C08F265/04 , C08F290/147 , C08F2222/104 , C08F2222/1086 , C08G18/673 , C08G18/792 , C08G18/8029 , C08G77/442 , C08L75/14 , C09D4/06 , C09J7/02 , C09J7/0246 , C09J7/0275 , C09J7/20 , C09J7/22 , C09J7/243 , C09J7/38 , C09J151/003 , C09J2203/326 , C09J2205/114 , C09J2423/006 , C09J2433/00 , C09J2475/00 , C09J2483/00 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/274 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/83191 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01025 , H01L2924/01033 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , Y10T156/1052 , Y10T428/14 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , C08F2220/1808 , C08F2220/1825 , C08F2220/281 , C08F220/06 , C08F220/20
摘要： PROBLEM TO BE SOLVED: To provide a multilayer adhesive sheet which ensures easy peeling between an adhesive layer and a die attach film during pickup even when an acrylic acid ester copolymer is used in the die attach film, thus facilitating pickup work of a semiconductor chip after dicing.SOLUTION: The multilayer adhesive sheet has an adhesive layer laminated on one surface of a base film, a die attach film laminated on the exposed surface of the adhesive layer. An adhesive composing the adhesive layer has a (meta)acrylic acid ester copolymer (A), an ultraviolet ray polymerizable compound (B), a polyfunctional isocyanate hardener (C), a photopolymerization initiator (D), and a silicon polymer (E).
摘要翻译：要解决的问题：为了提供一种多层粘合片，其在拾取期间即使在丙烯酸酯共聚物用于管芯附着膜时也能够容易地在粘合层和芯片附着膜之间剥离，从而便于拾取工作半导体芯片切割后。解决方案：多层粘合片具有层压在基膜的一个表面上的粘合剂层，层压在粘合剂层的暴露表面上的管芯附着膜。构成粘合剂层的粘合剂具有（甲基）丙烯酸酯共聚物（A），紫外线聚合性化合物（B），多官能异氰酸酯硬化剂（C），光聚合引发剂（D）和硅聚合物（E）。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2011233632A Adhesive sheet and method of manufacturing electronic component 有权
标题翻译：粘合片及制造电子元件的方法
公开(公告)号：JP2011233632A
公开(公告)日：2011-11-17
申请号：JP2010101105
申请日：2010-04-26
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： SHIKANO KAZUNORI , SAITO TAKESHI
IPC分类号： H01L21/301 , C09J4/00 , C09J7/02 , C09J11/06 , C09J133/04 , C09J163/00 , C09J175/16 , H01L21/60 , H01L21/67 , H01L21/683
CPC分类号： H01L24/27 , H01L2224/83191 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of improving the adhesion of a die attach film and an adhesive material by the drawing of the adhesive material in a dicing process by improving a dicing property of the adhesive material and improving a pickup property.SOLUTION: In an adhesive sheet 1, an adhesive material forming an adhesive material layer 3 contains a (meta) acrylic ester polymer (A), an ultraviolet polymerizable component (B), a photopolymerization initiator (C), and a curing agent (D). (A) contains 2-ethylhexyl acrylate for 90 to 99% and hydroxyl group containing (meta) acrylate for 10 to 1% while weight-average molecular weight is 200,000 to 700,000, (B) is polyfunctional urethane (meta) acrylate having at least ten acryloyl groups and polyfunctional (meta) acrylate. (C) has a hydroxyl group. (D) has at least three isocyanate groups, and isocyanate group mol amount of (D)/(hydroxyl group mol amount of (A)+(B))=0.6 to 1.2.
摘要翻译：解决的问题：提供一种粘合片，其能够通过提高粘合剂材料的切割性能，通过在切割工艺中拉伸粘合剂材料，从而提高模片附着膜和粘合剂材料的粘合性，并改善拾取财产。解决方案：在粘合片1中，形成粘合剂层3的粘合剂材料包含（甲基）丙烯酸酯聚合物（A），紫外线可聚合组分（B），光聚合引发剂（C）和固化代理（D）。（A）含有丙烯酸2-乙基己酯90〜99％，羟基（甲基）丙烯酸酯占10〜1％，重均分子量为200,000〜700,000，（B）为多官能氨基甲酸酯十个丙烯酰基和多官能（甲基）丙烯酸酯。（C）具有羟基。（D）具有至少三个异氰酸酯基，异氰酸酯基摩尔量的（D）/（（A）+（B））的羟基摩尔量= 0.6〜1.2。版权所有（C）2012，JPO＆INPIT

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