专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

SG189310A1 ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 未知
公开(公告)号：SG189310A1
公开(公告)日：2013-05-31
申请号：SG2013026109
申请日：2011-10-06
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , OSAWA TOMOHIRO , KAWATA MASATOSHI
摘要： -27-Disclosed is an electronic component packaging sheet comprising a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet comprises (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer comprises (D) an acrylic copolymer resin; and (E) carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.No Suitable Figure

2. 发明专利

MY163532A ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 未知
公开(公告)号：MY163532A
公开(公告)日：2017-09-15
申请号：MYPI2013001245
申请日：2011-10-06
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , OSAWA TOMOHIRO , KAWATA MASATOSHI
IPC分类号： C08L25/04 , B65D65/02 , C08J5/18 , C08L53/02
摘要： DISCLOSED IS AN ELECTRONIC COMPONENT PACKAGING SHEET COMPRISING A SURFACE CONDUCTIVE LAYER FORMED ON THE SURFACE OF AT LEAST ONE SIDE OF A SUBSTRATE SHEET. THE SUBSTRATE SHEET COMPRISES (A) 80,000 TO 220,000 MW OF A STYRENE-CONJUGATED DIENE BLOCK COPOLYMER; (B) 200,000 TO 400,000 MW OF A POLYSTYRENE RESIN; AND (C) 150,000 TO 210,000 MW OF AN IMPACT RESISTANT POLYSTYRENE RESIN. THE SURFACE CONDUCTIVE LAYER COMPRISES (D) AN ACRYLIC COPOLYMER RESIN; AND (E) A POLYTHIOPHENE TYPE POLYMER, PARTICULARLY A POLYTHIOPHENE TYPE POLYMER/ANIONIC POLYMER ION COMPLEX. THE ELECTRONIC COMPONENT PACKAGING SHEET IS A TRANSPARENT CONDUCTIVE SHEET HAVING EXCELLENT THERMOFORMING PROPERTIES, GOOD TRANSPARENCY AFTER THERMOFORMING, AND SUFFICIENT ELECTROSTATIC DIFFUSION PERFORMANCE TO MAINTAIN A LOW SURFACE RESISTANCE VALUE. THE ELECTRONIC COMPONENT PACKAGING SHEET IS PARTICULARLY SUITED FOR THE MANUFACTURE OF EMBOSSED CARRIER TAPE.

3. 发明专利

SG189852A1 STYRENE RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF 未知
公开(公告)号：SG189852A1
公开(公告)日：2013-06-28
申请号：SG2013026125
申请日：2011-10-06
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , KAWATA MASATOSHI
摘要： -1 7-Provided are a styrene resin composition for use in electronic component packaging such as embossed carrier tape, a sheet which has a large drawing ratio (pocket depth) and in which pockets exhibiting superior transparency and strength and can be thermoformed, and a carrier tape which is thermoformed from the sheet and which allows the verification of letters and the like formed on packaged electronic components from outside the pockets. The electronic component packaging sheet comprises: (A) 29-65 mass parts of a styrene-conjugated diene block copolymer; (B) 51-15 mass parts of a polystyrene resin; and (C) 20-9 mass parts of an impact resistant polystyrene resin. Components (A)-(C) each have a weight average molecular weight (Mw) within a specified range.No suitable figure

4. 发明专利

SG184193A1 SURFACE CONDUCTIVE LAMINATED SHEET AND ELECTRONIC PART PACKAGING CONTAINER 未知
公开(公告)号：SG184193A1
公开(公告)日：2012-10-30
申请号：SG2012070223
申请日：2011-03-18
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , KAWATA MASATOSHI , MIYAMURA YASUSHI
摘要： -19 -Disclosed is a surface conductive laminated sheet which comprises a base material layer containing an ABS resin as a main component, and a surface layer laminated on the surface of at least one side of the base material layer. In the laminated sheet, the ABS resin in the base material layer includes a composition made of 5-15 mass% of vinyl cyanide monomer, 45-65 mass% of diene-based rubber, and 50-20 mass% of aromatic vinyl monomer, and includes a graft rubber having a graft rate of 50-80%. The graft rubber has a mass average molecular weight (Mw) of a graft chain of 18,000-56,000, and/or has a volume average particle diameter of 0.3 to 2.0 um. By using the laminated sheet, it is possible to obtain an electronic part packaging container, such as carrier tape etc., which has extremely few punch burrs regardless of the type of forming apparatus when punched by means of a slit method or embossing.(Figure 1)

5. 发明专利

CA2399039C HYALURONIC ACID GEL, METHOD OF ITS PRODUCTION AND MEDICAL MATERIAL CONTAINING IT 未知
公开(公告)号：CA2399039C
公开(公告)日：2009-09-22
申请号：CA2399039
申请日：2000-02-03
申请人： DENKI KAGAKU KOGYO KK
发明人： KAWATA MASATOSHI , MIYOSHI TERUZOU , YAMAMOTO OSAMU , OHSHIMA KAZUHIRO , OKAMOTO AKIO , MIYATA YOSHIAKI , KITAGAWA HIRONOSHIN , ARAI KAZUHIKO , UMEDA TOSHIHIKO , KANEKO HIROSHI
IPC分类号： C08B37/08 , A61L24/00 , A61L24/08 , A61L27/20 , A61L27/52 , A61L31/04 , A61L31/14 , C08L5/08
摘要： Production of a hyaluronic acid gel, which comprises keeping hyaluronic acid in water at a hyaluronic acid concentration of at least 5 wt% in the presence of an acid component in an amount at least equimolar with the carboxyl groups in the hyaluronic acid.

6. 发明专利

AU742675B2 Hyaluronic acid gel, method of its production and medical material containing it 未知
公开(公告)号：AU742675B2
公开(公告)日：2002-01-10
申请号：AU8561698
申请日：1998-08-07
申请人： DENKI KAGAKU KOGYO KK
发明人： MIYATA YOSHIAKI , OKAMOTO AKIO , KAWATA MASATOSHI , OSHIMA KAZUHIRO , HASHIMOTO MASAMICHI , ARAI KAZUHIKO , SAWADA TOMIO
IPC分类号： A61L15/28 , A61L27/20 , A61L31/04 , C08B37/08 , C08L5/08 , A61L27/00 , A61L31/00
摘要： A gel made of hyaluronic acid alone which is hardly soluble in a neutral aqueous solution. The hyaluronic acid gel according to Claim 1, which keeps its shape for at least one day in a neutral aqueous solution at 25 DEG C.

7. 发明专利

SG192127A1 LAMINATED SHEET FOR PACKAGING ELECTRONIC COMPONENT AND MOLDED BODY THEREOF 未知
公开(公告)号：SG192127A1
公开(公告)日：2013-08-30
申请号：SG2013056585
申请日：2012-01-25
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , KAWATA MASATOSHI , MIYAMURA YASUSHI
摘要： -20-The present invention discloses a laminated sheet for packaging electronic components comprising a front surface layer, a center core layer and a rear surface layer, wherein the front surface layer and the rear surface layer each contains a rubber-modified styrenic copolymer (A) having a graft ratio of grafted rubber of 30 to 50%, a grafted rubber particle diameter of 0.1 to 0.5 µm and a butadiene content of 5 to 25% by weight, and polyetheresteramide (B), and the center core layer contains a rubber-modified styrenic copolymer (C) having a graft ratio of grafted rubber of 70 to 90%, a grafted rubber particle diameter of 0.4 to 1.0 F.A.m, and a butadiene content of 5 to 15% by weight, and 5 to 50 % by weight of a recycled material of this laminated sheet. The laminated sheet is well balanced in physical properties such as antistatic properties, transparency, folding strength, etc., and even if a recycled material is added to the center core layer, visibility in the inspection through a carrier tape is favorable, and thus, the laminated sheet can be preferably used for preparing a sheet for packaging electronic components, such as embossed carrier tape, etc.No Figure

8. 发明专利

AU781105B2 Hyaluronic acid gel, process for producing the same, and medical material containing the same 未知
公开(公告)号：AU781105B2
公开(公告)日：2005-05-05
申请号：AU2325000
申请日：2000-02-03
申请人： DENKI KAGAKU KOGYO KK
发明人： KAWATA MASATOSHI , OKAMOTO AKIO , MIYATA YOSHIAKI , OHSHIMA KAZUHIRO , YAMAMOTO OSAMU , MIYOSHI TERUZOU , KITAGAWA HIRONOSHIN , UMEDA TOSHIHIKO , KANEKO HIROSHI , ARAI KAZUHIKO
IPC分类号： A61L24/00 , A61L24/08 , A61L27/20 , A61L27/52 , A61L31/04 , A61L31/14 , C08B37/08 , C08L5/08
摘要： Production of a hyaluronic acid gel, which comprises keeping hyaluronic acid in water at a hyaluronic acid concentration of at least 5 wt% in the presence of an acid component in an amount at least equimolar with the carboxyl groups in the hyaluronic acid.

9. 发明专利

SG10201508314RA ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 未知
公开(公告)号：SG10201508314RA
公开(公告)日：2015-11-27
申请号：SG10201508314R
申请日：2011-10-06
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , OSAWA TOMOHIRO , KAWATA MASATOSHI
摘要： Disclosed is an electronic component packaging sheet including a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet includes (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer includes (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.

10. 发明专利

SG189854A1 ELECTRONIC COMPONENT PACKAGING SHEET, AND FORMED ARTICLE THEREOF 未知
公开(公告)号：SG189854A1
公开(公告)日：2013-06-28
申请号：SG2013026141
申请日：2011-10-06
申请人： DENKI KAGAKU KOGYO KK
发明人： FUJIWARA JUNPEI , OSAWA TOMOHIRO , KAWATA MASATOSHI
摘要： -30-Disclosed is an electronic component packaging sheet comprising a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet comprises (A) 80,000 to 220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000 to 400,000 Mw of a polystyrene resin; and (C) 150,000 to 210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer comprises (D) an acrylic copolymer resin; and (E) a polythiophene type polymer, particularly a polythiophene type polymer/anionic polymer ion complex. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.No suitable figure

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式