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1. 发明申请

WO2006043763A1 METHOD FOR ALLEVIATING TOXICITY OF BAMBUASE CAULIS IN LIQUAMEN AND THE TOXICITY-ALLEVIATED BAMBUASE CAULIS IN LIQUAMEN OBTAINED THEREBY 审中-公开
标题翻译：用于清除液体中的BAMBUASE CAULIS的毒性和获得的LIQUAMEN的毒性受体BAMBUASE CAULIS的方法
公开(公告)号：WO2006043763A1
公开(公告)日：2006-04-27
申请号：PCT/KR2005/003453
申请日：2005-10-17
申请人： DAMYANGKUN , KIM, Sang-jin , KIM, Sang-hee
发明人： KIM, Sang-jin , KIM, Sang-hee
IPC分类号： A61K36/899
CPC分类号： A61K36/15 , A61K36/899 , A61K2300/00
摘要： Disclosed are a method for alleviating toxicity of Bambusae Caulis in Liquamen and the toxicity-alleviated Bambusae Caulis in Liquamen prepared thereby. In particular, this invention discloses a method for alleviating toxicity of Bambusae Caulis in Liquamen comprising the step of adding powder of pine leaves, fragments of pine leaves, and/ or pine leaves themselves to Bambusae Caulis in Liquamen and the toxicity-alleviated Bambusae Caulis in Liquamen prepared thereby.
摘要翻译：本发明公开了一种减轻柳叶酚的毒性的方法，由此制备了Liquamen中的毒性缓解的Bambusae Caulis。特别是本发明公开了一种减轻柳叶of的毒性的方法，其特征在于：将松树叶，松叶片和/或松叶本身的粉末本身加入到Liquamen中的Bambusae Caulis和毒性缓解的Bambusae Caulis中李加根。

2. 发明申请

WO2008133369A9 THE MANUFACTURING METHOD OF THE THIN FILM CERAMIC MULTI LAYER SUBSTRATE 审中-公开
公开(公告)号：WO2008133369A9
公开(公告)日：2008-11-06
申请号：PCT/KR2007/002846
申请日：2007-06-13
申请人： TOP ENGINEERING CO., LTD , KIM, Sang-hee
发明人： KIM, Sang-hee
IPC分类号： H05K3/46
摘要： Provided is a thin film ceramic multilayer wiring board that is appropriate for use as a highly - integrated multilayer wiring board for a probe card which tests a highfrequency module for mobile communication, a microwave connector, a cable assembly, a semiconductor chip, etc., and a method of manufacturing the thin film ceramic multilayer wiring board. The thin film ceramic multilayer wiring board includes: a first conductive structure and a first insulating structure surrounding the first conductive structure, both constituting a multilayer wiring board body; a second insulating structure surrounding the first insulating structure; and a second conductive structure formed on an output pad of the first conductive structure. Here, the second conductive structure is formed by sequentially plating Cu, Ni and Au. According to the thin film ceramic multilayer wiring board and method of manufacturing the same, the second conductive structure is formed using a thin film conductive structure. Therefore, a fine pattern is readily implemented and high integration can be achieved.

3. 发明申请

WO2008133369A1 THE MANUFACTURING METHOD OF THE THIN FILM CERAMIC MULTI LAYER SUBSTRATE 审中-公开
标题翻译：薄膜陶瓷多层基板的制造方法
公开(公告)号：WO2008133369A1
公开(公告)日：2008-11-06
申请号：PCT/KR2007/002846
申请日：2007-06-13
申请人： TOP ENGINEERING CO., LTD , KIM, Sang-hee
发明人： KIM, Sang-hee
IPC分类号： H05K3/46
CPC分类号： H05K3/4007 , H01L23/498 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/113 , H05K3/243 , H05K3/388 , H05K3/4611 , H05K3/4629 , H05K2201/0179 , H05K2201/0367 , H05K2201/09436 , H05K2201/09709 , H05K2203/054 , H05K2203/162 , H01L2924/00
摘要： Provided is a thin film ceramic multilayer wiring board that is appropriate for use as a highly - integrated multilayer wiring board for a probe card which tests a highfrequency module for mobile communication, a microwave connector, a cable assembly, a semiconductor chip, etc., and a method of manufacturing the thin film ceramic multilayer wiring board. The thin film ceramic multilayer wiring board includes: a first conductive structure and a first insulating structure surrounding the first conductive structure, both constituting a multilayer wiring board body; a second insulating structure surrounding the first insulating structure; and a second conductive structure formed on an output pad of the first conductive structure. Here, the second conductive structure is formed by sequentially plating Cu, Ni and Au. According to the thin film ceramic multilayer wiring board and method of manufacturing the same, the second conductive structure is formed using a thin film conductive structure. Therefore, a fine pattern is readily implemented and high integration can be achieved.
摘要翻译：本发明提供一种薄膜陶瓷多层布线板，其适合用作测试用于移动通信的高频模块，微波连接器，电缆组件，半导体芯片等的探针卡的高度集成的多层布线板，以及薄膜陶瓷多层布线基板的制造方法。薄膜陶瓷多层布线板包括：第一导电结构和围绕第一导电结构的第一绝缘结构，均构成多层布线板主体; 围绕所述第一绝缘结构的第二绝缘结构; 以及形成在所述第一导电结构的输出焊盘上的第二导电结构。这里，第二导电结构通过依次镀Cu，Ni和Au而形成。根据薄膜陶瓷多层布线板及其制造方法，使用薄膜导电结构形成第二导电结构。因此，可以容易地实现精细图案，并且可以实现高集成度。

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