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    • 7. 发明专利
    • THERMOSETTING RESIN COMPOSITION
    • JPH10130368A
    • 1998-05-19
    • JP28384396
    • 1996-10-25
    • DAINIPPON INK & CHEMICALS
    • KONNO EIJUSEIKE NAOYUKIISHIKAWA HIDENORI
    • C08K5/54C08G59/20C08G59/42C08K5/541C08L63/00G02B5/20
    • PROBLEM TO BE SOLVED: To obtain the subject new composition capable of readily providing a cured coated firm excellent in storage stability, coating performance, luster, adhesiveness to substrate, sputtering resistance, etc., by using a polymer comprising a specific epoxy-containing monomer as a polymerization component. SOLUTION: This composition comprises (A) a polymer composed of a monomer (e.g. acrylic acid 3,4-epoxycyclohexyl) containing a polymerizable unsaturated double bond and an alicyclic epoxy group and (B) a compound (preferably an aromatic polyfunctional carboxylic acid anhydride) selected from a polyfunctional carboxylic acid and its anhydride. When a monomer of the formula (R1 is H or a lower alkyl; R2 is a lower alkyl; (n) is 1-5) is introduced into the component A, adhesiveness and storage stability are preferably improved. Preferably, the objective composition is further mixed with a coupling agent. An epoxy-containing silane coupling agent such as γ- glycidoxypropyltrimethoxysilane is preferable as the coupling agent. Preferably, the components are blended by a solvent blending method for dissolving the components in a solvent and mixing.