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1. 发明公开

EP2840603A1 REFRIGERATION DEVICE 有权
标题翻译：制冷设备
公开(公告)号：EP2840603A1
公开(公告)日：2015-02-25
申请号：EP13778035.9
申请日：2013-04-08
申请人： Daikin Industries, Ltd.
发明人： OGURI, Akihiko , TERAKI, Junichi , KITA, Masanobu , DOUMAE, Hiroshi , IKEDA, Motonobu , FUJIWARA, Masahide
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： F25D23/00 , F24F1/24 , F25D31/00 , H01L23/367 , H01L23/4006 , H01L23/473 , H01L2023/405 , H01L2924/0002 , H05K1/0203 , H05K7/20927 , H01L2924/00
摘要： A facing surface (52) of a refrigerant jacket (40) includes: a contact portion (520) which contacts a device main body (200), a first recessed portion (521) which faces a first lead section (201) and secures an insulation distance to the first lead section (201) due to being positioned further away from a power device (20) than the contact portion (520), and a second recessed portion (522) which faces the second lead section (202) and secures an insulation distance to the second lead section (202) due to being positioned further away from the power device (20) than the contact portion (520).
摘要翻译：制冷剂套（40）的相对面（52）包括：与装置主体（200）接触的接触部（520）;面向第一引线部（201）的第一凹部（521）由于位于比接触部分（520）更远离功率器件（20）的位置，所以与第一引线部分（201）的绝缘距离以及面对第二引线部分（202）的第二凹陷部分（522）由于离接触部分（520）远离功率器件（20）而与第二引线部分（202）的绝缘距离。

2. 发明公开

EP2857764A1 REFRIGERATION DEVICE 有权
标题翻译：制冷设备
公开(公告)号：EP2857764A1
公开(公告)日：2015-04-08
申请号：EP13781690.6
申请日：2013-04-26
申请人： Daikin Industries, Ltd.
发明人： TERAKI, Junichi , OGURI, Akihiko
IPC分类号： F24F1/24 , F25B1/00
摘要： A printed board (51) on which a power module (53) is mounted, a cooling pipe (15) that is a refrigerant pipe of a refrigerant circuit, and a cooler (60) attached to the power module (53) and the cooling pipe (15) are disposed in a casing (40). A support member (63) by which the cooler (60) is attached to the printed board (51) and supported on the printed board (51), and a fixing member (55) by which the printed board (51) is fixed to the casing (40) and supported on the casing (40) are used.
摘要翻译：其上安装有功率模块（53）的印刷电路板（51），作为制冷剂回路的制冷剂管的冷却管（15），以及安装在该功率模块（53）上的冷却器（60）管（15）设置在壳体（40）中。一个支撑部件（63），通过该支撑部件（63），冷却器（60）安装在印刷电路板（51）上并支撑在印刷电路板（51）上;以及固定部件（55），通过该固定部件（55）使用壳体（40）并支撑在壳体（40）上。

3. 发明公开

EP4224654A1 POWER CONVERSION DEVICE 审中-实审
公开(公告)号：EP4224654A1
公开(公告)日：2023-08-09
申请号：EP21875768.0
申请日：2021-09-30
申请人： Daikin Industries, Ltd.
发明人： FUJIWARA, Masahide , ITOU, Taku , KOTERA, Keito , OGURI, Akihiko , KOUNO, Masaki , KAWASHIMA, Reiji , HIRAOKA, Nobuyasu , KOYAMA, Yoshitsugu , KOYAMA, Kenji , YAMAMOTO, Masahiro
IPC分类号： H02J3/01 , H02M1/12 , H02M7/12 , H02M7/48
摘要： A problem to be solved by the present disclosure is integration of an active filter circuit and an inverter circuit into one board. In a power conversion device (10), an active filter circuit (60) and an inverter circuit (40) are mounted on one printed wiring board (70), so that the power conversion device (10) can be reduced in size, weight, and cost.

4. 发明授权

EP2860463B1 REFRIGERATION DEVICE 有权
公开(公告)号：EP2860463B1
公开(公告)日：2018-03-21
申请号：EP13778167.0
申请日：2013-04-08
申请人： Daikin Industries, Ltd.
发明人： OGURI, Akihiko , TERAKI, Junichi , KITA, Masanobu , DOUMAE, Hiroshi , IKEDA, Motonobu , FUJIWARA, Masahide
IPC分类号： F24F1/24 , F24F1/22 , F25B1/00
CPC分类号： F25D23/003 , F24F1/22 , F24F1/24 , F25D19/00 , F28D2021/0029 , F28F1/00 , F28F2275/08 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In a refrigeration apparatus, a main surface of a printed wiring board (90) has a heavy electric region (R1), which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region (R2), which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket (40) contacts a power device (20) which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe (10) includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion (10A) contacts the refrigerant jacket.

5. 发明授权

EP2844050B1 COOLER, ELECTRICAL COMPONENT UNIT, AND REFRIGERATION DEVICE 有权
公开(公告)号：EP2844050B1
公开(公告)日：2017-09-20
申请号：EP13782260.7
申请日：2013-04-26
申请人： Daikin Industries, Ltd.
发明人： TERAKI, Junichi , OGURI, Akihiko , KITA, Masanobu
IPC分类号： H05K7/20 , H01L23/473 , F24F1/24
CPC分类号： H05K7/20381 , F24F1/24 , F25B31/006 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H05K1/0203 , H05K7/20254 , H05K7/20354 , H05K7/20936 , H01L2924/00
摘要： A cooler (60) is placed on a power module (53) to cool the power module (53) with refrigerant through a refrigerant pipe (15), and includes a heat transfer plate (62) having a groove (61) into which a cooling pipe (15) is fitted, and a presser plate (64) configured to press the cooling pipe (15) against the groove (61). The cooler (60) includes a hinge mechanism (77) configured to rotatably attach the presser plate (64) to the heat transfer plate (62) such that the presser plate (64) is switched between an open position at which the groove (61) is exposed and a closed position at which the presser plate (64) covers the groove (61).

6. 发明授权

EP2840603B1 REFRIGERATION DEVICE 有权
公开(公告)号：EP2840603B1
公开(公告)日：2016-11-02
申请号：EP13778035.9
申请日：2013-04-08
申请人： Daikin Industries, Ltd.
发明人： OGURI, Akihiko , TERAKI, Junichi , KITA, Masanobu , DOUMAE, Hiroshi , IKEDA, Motonobu , FUJIWARA, Masahide
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： F25D23/00 , F24F1/24 , F25D31/00 , H01L23/367 , H01L23/4006 , H01L23/473 , H01L2023/405 , H01L2924/0002 , H05K1/0203 , H05K7/20927 , H01L2924/00

7. 发明公开

EP3872930A1 CONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARD AND TERMINAL BLOCK, TERMINAL BLOCK, AND AIR-CONDITIONER 审中-实审转让
公开(公告)号：EP3872930A1
公开(公告)日：2021-09-01
申请号：EP19877501.7
申请日：2019-10-21
申请人： DAIKIN INDUSTRIES, LTD.
发明人： FUKAGAWA, Kazunari , OGAWA, Hironori , OGURI, Akihiko , TOYOTA, Ryuuichi , KITAGAWA, Natsuko
IPC分类号： H01R9/00 , F24F1/22 , F24F13/20 , H01R9/28 , H01R12/51
摘要： A connection structure between a printed circuit board and a terminal block according to the present disclosure includes a printed circuit board in which a pattern is drawn out near an end portion serving as an insertion portion, a terminal-block main body having a space serving as a receiving port for the insertion portion, a nut held in the terminal-block main body, and a screw tightened into the nut with the pattern interposed between the screw and the nut while the insertion portion is inserted into the space.

8. 发明授权

EP2857764B1 REFRIGERATION DEVICE 有权
公开(公告)号：EP2857764B1
公开(公告)日：2020-11-04
申请号：EP13781690.6
申请日：2013-04-26
申请人： Daikin Industries, Ltd.
发明人： TERAKI, Junichi , OGURI, Akihiko
IPC分类号： H05K7/20 , H05K1/02

9. 发明公开

EP2860463A1 REFRIGERATION DEVICE 有权
标题翻译：制冷设备
公开(公告)号：EP2860463A1
公开(公告)日：2015-04-15
申请号：EP13778167.0
申请日：2013-04-08
申请人： Daikin Industries, Ltd.
发明人： OGURI, Akihiko , TERAKI, Junichi , KITA, Masanobu , DOUMAE, Hiroshi , IKEDA, Motonobu , FUJIWARA, Masahide
IPC分类号： F24F1/24 , F24F1/22 , F25B1/00
CPC分类号： F25D23/003 , F24F1/22 , F24F1/24 , F25D19/00 , F28D2021/0029 , F28F1/00 , F28F2275/08 , H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In a refrigeration apparatus, a main surface of a printed wiring board (90) has a heavy electric region (R1), which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region (R2), which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket (40) contacts a power device (20) which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe (10) includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion (10A) contacts the refrigerant jacket.
摘要翻译：在制冷装置中，印刷线路板（90）的主表面具有作为印刷线路板的配置有较重的电气元件组的下部的区域的较重的电气区域（R1）电气区域（R2）是位于重电气区域上方的区域，其中布置有轻电部件组。制冷剂套（40）接触设置在重电区域中的动力装置（20）。制冷剂管道10的液体管道包括朝向制冷剂套管向上延伸的部分，并且冷却部分10A与制冷剂套管接触。

10. 发明公开

EP2844050A1 COOLER, ELECTRICAL COMPONENT UNIT, AND REFRIGERATION DEVICE 有权
标题翻译：冷却器，电子部件单元和制冷设备
公开(公告)号：EP2844050A1
公开(公告)日：2015-03-04
申请号：EP13782260.7
申请日：2013-04-26
申请人： Daikin Industries, Ltd.
发明人： TERAKI, Junichi , OGURI, Akihiko , KITA, Masanobu
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H05K7/20381 , F24F1/24 , F25B31/006 , H01L23/4093 , H01L23/473 , H01L2924/0002 , H05K1/0203 , H05K7/20254 , H05K7/20354 , H05K7/20936 , H01L2924/00
摘要： A cooler (60) is placed on a power module (53) to cool the power module (53) with refrigerant through a refrigerant pipe (15), and includes a heat transfer plate (62) having a groove (61) into which a cooling pipe (15) is fitted, and a presser plate (64) configured to press the cooling pipe (15) against the groove (61). The cooler (60) includes a hinge mechanism (77) configured to rotatably attach the presser plate (64) to the heat transfer plate (62) such that the presser plate (64) is switched between an open position at which the groove (61) is exposed and a closed position at which the presser plate (64) covers the groove (61).
摘要翻译：在功率模块（53）上配置冷却器（60），通过制冷剂管（15）以冷媒对冷却功率模块（53）进行冷却，该冷却器（60）包括具有槽（61）的传热板（62）冷却管15以及将冷却管15按压在槽61上的压板64。冷却器60包括铰链机构77，该铰链机构77构造成将压板64可旋转地附接到传热板62，使得压板64在开启位置和开启位置之间切换，）暴露在压力板（64）覆盖槽（61）的关闭位置。

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