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1. 发明公开

KR20180018573A 전자부품 봉지 금형, 트랜스퍼 성형기 및 전자부품 봉지 방법 审中-公开
标题翻译：电子零件袋模具，传递模塑机和电子零件袋方法
公开(公告)号：KR20180018573A
公开(公告)日：2018-02-21
申请号：KR20177036319
申请日：2016-01-08
申请人： DAI ICHI SEIKO CO LTD
发明人： MASUDA KOSAKU , NISHIMOTO MASAKAZU , MIYAHARA HIROAKI
IPC分类号： H01L21/56 , B29C43/18 , B29C43/34 , B29C43/36 , B29C43/58
CPC分类号： B29C45/02 , B29C45/26 , H01L21/56
摘要： 전자부품봉지금형(2)은, 전자부품이표면실장된기판(91)을재치하기위한하형캐비티블록(53)과하형캐비티블록(53)의상하이동에연동하여상하이동하고, 하형캐비티블록(53)과함께기판(91)을협지하는상형캐비티홀더(27)와, 상형캐비티홀더(27)의상하이동에연동하여상하이동하고또한관통공을갖는상형체이스홀더(22)와, 상형체이스홀더(22)의상하이동에연동하여신축하는상형스프링(28)과, 상형캐비티홀더(27) 내에서상하이동가능하게위치결정되고또한하형캐비티블록(53)과의사이에캐비티를형성하는상형캐비티블록(27)과, 상형체이스홀더(22)의관통공에슬라이드이동가능하게삽통되고또한상형캐비티블록(27)의상면에고정된연결부재(25)를구비한다. 하형캐비티블록(53)에는, 캐비티내에전자부품의표면을피복하는용융수지를주입하기위한플런저를삽입가능한포트부가설치되어있다.
摘要翻译：随着下模腔模块53和下模腔模块53的向下移动，电子部件封装模具2上下移动，用于将其上安装有电子部件的基板91安装在表面上，与上模腔固定器53一起固定基板91的上模腔固定器27和与上模腔固定器27向上移动相关联地上下移动并具有通孔的上模腔固定器22， 22个服装和模具弹簧28相关联伸展与移动模腔保持器27被确定为可移动并在位置也模腔时形成的下模模腔块53之间的空腔并且，连结部件25以能够滑动的方式插入到上模具框架座22的通孔中，并固定在上模腔模块27的上表面。下模腔模块53设置有端口部分，用于注入熔融树脂的柱塞可以插入到该端口部分中以覆盖电子部件的表面。

2. 发明专利

MY184538A RESIN SEALING APPARATUS AND METHOD OF DETECTING ABNORMALITY OF RESIN SEALING APPARATUS 未知
公开(公告)号：MY184538A
公开(公告)日：2021-04-01
申请号：MYPI2017701079
申请日：2017-03-28
申请人： DAI ICHI SEIKO CO LTD
发明人： MIYAHARA HIROAKI
摘要： Provided are a resin sealing apparatus (52) and a method of detecting abnormality of a resin sealing apparatus which are capable of appropriately detecting whether a sliding defect of an exposing pin (30) occurs in respect to a resin sealed package in which an exposed portion is formed at a surface of an electronic component. A first mold (2) includes an upper die set (6) and an upper mold chase (7). A spring pin (13) is provided in the upper mold chase. The spring pin is a member which has a tip that comes into contact with a surface of a sensor element of a substrate with the sensor element (38) which is a base material with electronic components, and forms an exposed portion. A light shielding sensors (14) is provided on an upper end surface of a holder base (9). The light shielding sensor detects a tip of a to-be-detected pin (37) that constitutes the spring pin. Further, the load measuring loader (40) of the resin sealing apparatus (52) includes a base portion (41), and a load detection pin holder (42). The load detection pin holder is a portion which is pushed up by a second mold (3) operated by a mold driving device, the load detection pin holder moves upward through a guide portion (44), and approaches the cavity (11) of the first mold. In addition, the load detection pin holder includes a load detection pin (45) as a load sensor, and a detection signal cable (46). The load detection pin measures a load when a tip of the load detection pin (47) comes into contact with the tip of the exposing pin (35), and pushes up the exposing pin. Figure 1

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