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1. 发明申请

WO2012166343A2 GLASS-PLASTIC LAMINATE DEVICE, PROCESSING LINE AND METHODS THEREFOR 审中-公开
标题翻译：玻璃 - 塑料层压装置，加工线及其方法
公开(公告)号：WO2012166343A2
公开(公告)日：2012-12-06
申请号：PCT/US2012/037911
申请日：2012-05-15
申请人： CORNING INCORPORATED , CHOWDHURY, Dipakbin Qasem , GERBER, Kurt Edward , KANG, Kiat Chyai , XIAO, Yu
发明人： CHOWDHURY, Dipakbin Qasem , GERBER, Kurt Edward , KANG, Kiat Chyai , XIAO, Yu
IPC分类号： B32B17/10 , B32B37/02 , H05K5/02
CPC分类号： B32B17/1055 , B32B3/28 , B32B17/064 , B32B2250/02 , B32B2250/03 , B32B2250/40 , B32B2457/20 , B65H20/02 , H05K5/0217 , Y10T428/24628
摘要： A laminate including a glass sheet (10) and a first polymer layer (20) laminated to a first surface of the glass sheet. The glass sheet has a thickness of from 5 to 500 microns, and the first polymer layer provides a coating factor (F) to the glass sheet, wherein the coating factor (F) is defined by the following formula F = (1 - γβ 2 ) / (1 + γβ 2 ), wherein γ = [Ep1 (1 - vg 2 )] / [Eg (1 - vp1 2 )], β = tp1 / tg, Ep1 = Young's Modulus of the first polymer, tp1 = thickness of the first polymer, vp1 = Poisson's Ratio of the first polymer, Eg = Young's Modulus of the glass, tg = thickness of the glass, and vg = Poisson's Ratio of the glass. The laminate is curved so that a second surface of the glass sheet is disposed in a concave shape; and the coating factor (F) is less than 1. A second polymer layer (30) may be disposed on the second surface of the glass sheet, and its properties may be chosen relative to those of the first polymer layer so as to reduce the maximum principle stress-due to a bending moment-in the glass as compared to a bare glass sheet.
摘要翻译：一种层压体，其包括层压到所述玻璃板的第一表面上的玻璃板（10）和第一聚合物层（20）。玻璃板的厚度为5至500微米，第一聚合物层为玻璃板提供涂层因子（F），其中涂层因子（F）由下式定义：F =（1-β2 ）/（1 +αβ2），其中 = [Ep1（1-vg2）] / [Eg（1-vp12）]，ß= tp1 / tg，Ep1 =第一聚合物的杨氏模量，tp1 =第一聚合物的厚度，vp1 =第一聚合物的泊松比，Eg =玻璃的杨氏模量，tg =玻璃的厚度，vg =玻璃的泊松比。层压体是弯曲的，使得玻璃板的第二表面被设置成凹形; 并且涂层因子（F）小于1.可以在玻璃板的第二表面上设置第二聚合物层（30），并且可以相对于第一聚合物层的性质选择其性质，以便减少与裸露的玻璃板相比，玻璃中的弯矩的最大主应力。

2. 发明申请

WO2013082076A1 CARRIER FOR THIN GLASS SHEETS AND METHOD OF USING 审中-公开
标题翻译：薄玻璃板的载体和使用方法
公开(公告)号：WO2013082076A1
公开(公告)日：2013-06-06
申请号：PCT/US2012/066741
申请日：2012-11-28
申请人： CORNING INCORPORATED , CHOWDHURY, Dipakbin Qasem , OTT, Terry Jay
发明人： CHOWDHURY, Dipakbin Qasem , OTT, Terry Jay
IPC分类号： B65G49/06 , H01L21/683
CPC分类号： B65G49/061 , B65G2249/02 , B65G2249/045 , H01L21/6838
摘要： A portable jig (10) for carrying a thin glass sheet (2). The jig includes a body (11) having a top planar surface (20), the top planar surface having a sheet mounting section (22), wherein the sheet mounting section has a perimeter (24), and the perimeter encloses an area that is larger than or equal to the area of the thin glass sheet to be carried. A pressure cavity (40) is disposed in the body and is in fluid communication with the sheet mounting section. A conduit (50) is coupled to the body and is in fluid communication with the pressure cavity. Also, a method of processing a thin glass sheet on the jig is disclosed. The pressure in the pressure cavity is reduced by drawing a vacuum through the conduit and, thereby, the thin glass sheet is held fast to the top planar surface of the jig.
摘要翻译：一种用于承载薄玻璃板（2）的便携式夹具（10）。所述夹具包括具有顶部平坦表面（20）的主体（11），所述顶部平坦表面具有片材安装部分（22），其中所述片材安装部分具有周边（24），并且所述周边包围大于或等于待运送的薄玻璃板的面积。压力腔（40）设置在主体内并且与片材安装部分流体连通。导管（50）联接到主体并与压力腔流体连通。另外，公开了一种在夹具上加工薄玻璃板的方法。压力腔中的压力通过通过导管抽真空而减少，因此，薄玻璃板被快速地保持在夹具的顶部平坦表面上。

3. 发明申请

WO2022133162A1 GLASS SUBSTRATE HEAT CHAMFERING METHOD AND APPARATUS 审中-公开
公开(公告)号：WO2022133162A1
公开(公告)日：2022-06-23
申请号：PCT/US2021/063942
申请日：2021-12-17
申请人： CORNING INCORPORATED
发明人： CHOWDHURY, Dipakbin Qasem , KIM, EuiHo , KIM, Euisoo , RYOO, Seong-ryong
IPC分类号： C03B33/09 , B23K26/362 , B23K26/364 , C03B33/00 , C03B33/02 , C03B33/10
摘要： Provided is a glass substrate heat chamfering method. An edge of a glass substrate (100) is chamfered by applying thermal shock to the edge of the glass substrate (100), thereby peeling a strip (100a) off from the edge of the glass substrate (100). The strip is cut at a predetermined point thereon before being broken due to the weight thereof. The strip (100a) is cut by applying at least one of heat and a laser beam to the predetermined point or by applying a flame (300a) of a torch (300) to the predetermined point. The application of the thermal shock includes brining a heating element (210) into contact with the edge of the glass substrate (100). In the chamfering, the heating element (210) is relatively moved along the edge of the glass substrate (100) while being brought into contact with the edge of the glass substrate (100).

4. 发明申请

WO2020022920A1 LIGHT EXTRACTION STRUCTURE WITH HIGH INDEX NANOPARTICLES FOR AN ORGANIC LIGHT EMITTING DIODE 审中-公开
公开(公告)号：WO2020022920A1
公开(公告)日：2020-01-30
申请号：PCT/RU2018/000484
申请日：2018-07-23
申请人： CORNING INCORPORATED
发明人： KUCHINSKY, Sergey Anatol'evich , CHOWDHURY, Dipakbin Qasem , KUKSENKOV, Dmitri Vladislavovich , LEE, JooYoung , MLEJNEK, Michal , YOON, Hong
IPC分类号： H01L51/52
摘要： An organic light emitting diode (OLED) assembly (100), comprising: a diode superstructure (110) comprising a cathode (140), an anode (120) having a refractive index of na, and an organic light emitting semiconductor material (160) interposed between the cathode (140) and the anode (120); and a light diffracting substructure (150) providing a scattering cross section of light from the diode superstructure (110). The light diffracting substructure (150) comprises: a transparent substrate (156), a plurality of nanoparticles (154) in contact with the substrate (156) and having a refractive index of n s , and a planarization layer (152) over the nanoparticles (154) and having a refractive index of n p . Further, n p is within 25% of n a and n s > n p In addition, n s > about 1.9.

5. 发明公开

EP3827467A1 LIGHT EXTRACTION STRUCTURE WITH HIGH INDEX NANOPARTICLES FOR AN ORGANIC LIGHT EMITTING DIODE 审中-实审
公开(公告)号：EP3827467A1
公开(公告)日：2021-06-02
申请号：EP18766396.8
申请日：2018-07-23
申请人： Corning Incorporated
发明人： KUCHINSKY, Sergey Anatol'evich , CHOWDHURY, Dipakbin Qasem , KUKSENKOV, Dmitri Vladislavovich , LEE, JooYoung , MLEJNEK, Michal , YOON, Hong
IPC分类号： H01L51/52

6. 发明公开

EP4263451A1 GLASS SUBSTRATE HEAT CHAMFERING METHOD AND APPARATUS 审中-实审
公开(公告)号：EP4263451A1
公开(公告)日：2023-10-25
申请号：EP21907863.1
申请日：2021-12-17
申请人： Corning Incorporated
发明人： CHOWDHURY, Dipakbin Qasem , KIM, EuiHo , KIM, Euisoo , RYOO, Seong-ryong
IPC分类号： C03B33/09 , B23K26/362 , B23K26/364 , C03B33/00 , C03B33/02 , C03B33/10

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