会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Semiconductor device and method of manufacturing such a device
    • 半导体装置及其制造方法
    • US06201291B1
    • 2001-03-13
    • US09209063
    • 1998-12-10
    • Srdjan KordicCornelis A. H. A. MutsaersMareike K. KleeWilhelm A. Groen
    • Srdjan KordicCornelis A. H. A. MutsaersMareike K. KleeWilhelm A. Groen
    • H01L2900
    • H01L21/28537H01L21/76801H01L21/76829H01L23/485H01L23/5329H01L23/53295H01L29/452H01L2924/0002H01L2924/3011H01L2924/00
    • A semiconductor device, for example an IC, having conductor tracks (3) of a metal (3) exhibiting a better conductance than aluminium, such as copper, silver, gold or an alloy thereof. The tracks are situated on an insulating layer (2) and are connected to a semiconductor region (1A) or to an aluminium conductor track by means of a metal plug (5), for example of tungsten, which is situated in an aperture (4) in the insulating layer (2). The bottom and walls of the aperture (4) are provided with an electroconductive material (6), such as titanium nitride, which forms a diffusion barrier for the metal (3). In accordance with the invention, the insulating layer (2) comprises a sub-layer (2A), which forms a diffusion barrier for the metal (3) and which extends, outside the aperture (4), throughout the surface of the semiconductor body (10). As a result, the conductor tracks (3) no longer have to be provided with a sheath serving as a diffusion barrier for the metal (3). The conductor tracks (3) may thus have a cross-section of very small dimensions, while the electric resistance will is still be sufficiently low. The same applies for any further conductor tracks (8), which may be present above the conductor tracks (3) and which are electrically insulated therefrom. Preferably, the electrically insulating sub-layer (2A) is situated approximately in the middle of the insulating layer (2). By virtue thereof, the contribution of the sub-layer (2A) to capacitances threatening the velocity of the IC is minimized. Suitable materials for the sub-layer (2A) are oxides, nitrides, fluorides and carbides, for example aluminium oxide, magnesium fluoride or silicon carbide. The insulating layers (2, 7, 11, 12) preferably comprise silicon dioxide.
    • 具有导体轨迹(3)的半导体器件,例如具有比铝更好的导电性的金属(3)的导体轨迹(3),例如铜,银,金或其合金。 轨道位于绝缘层(2)上,并且通过位于孔(4)中的金属插塞(5)(例如钨)连接到半导体区域(1A)或铝导体轨道 )在绝缘层(2)中。 开口(4)的底部和壁上设置有形成用于金属(3)的扩散阻挡层的导电材料(6),例如氮化钛。 根据本发明,绝缘层(2)包括形成用于金属(3)的扩散阻挡层并且在孔(4)的外部延伸穿过半导体本体的表面的子层(2A) (10)。 结果,导体轨迹(3)不再需要设置有用作金属(3)的扩散阻挡层的护套。 因此,导体轨迹(3)可以具有非常小尺寸的横截面,而电阻仍然足够低。 同样适用于可能存在于导体轨道(3)上方并且与其电绝缘的任何另外的导体轨道(8)。 优选地,电绝缘子层(2A)大致位于绝缘层(2)的中间。 由此,子层(2A)对威胁IC速度的电容的贡献被最小化。 用于子层(2A)的合适材料是氧化物,氮化物,氟化物和碳化物,例如氧化铝,氟化镁或碳化硅。 绝缘层(2,7,11,12)优选包含二氧化硅。