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1. 发明申请

US20100158071A1 SURFACE ACOUSTIC WAVE BASED MICRO-SENSOR APPARATUS AND METHOD FOR SIMULTANEOUSLY MONITORING MULTIPLE CONDITIONS 失效
标题翻译：基于表面声波的微型传感器装置和同时监测多种条件的方法
公开(公告)号：US20100158071A1
公开(公告)日：2010-06-24
申请号：US12353069
申请日：2009-01-13
申请人： Cornel Cobianu , Ioan Pavelescu , Mihal Gologanu
发明人： Cornel Cobianu , Ioan Pavelescu , Mihal Gologanu
IPC分类号： G01H13/00 , G01K5/58 , G01P15/09
CPC分类号： H03H9/02535
摘要： A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.
摘要翻译：一种基于SAW的微传感器装置，用于利用构造为SAW器件（例如，SAW谐振器或SAW延迟线）的感测元件同时监视加速/振动和温度。相对于包括惯性质量的薄压电振动膜，SAW器件可位于基板上的不同位置。可以利用加速度敏感的SAW谐振器（例如SAW-g）和温度敏感的SAW谐振器（例如，SAW-T）之间的频率差来测量温度补偿的加速度/振动。可以使用由SAW-T和温度参考SAW谐振器（例如，SAW-R）提供的频移来测量温度。类似地，SAW延迟线的不同反射器的相位响应可以用于差分地测量加速度/振动和温度。

2. 发明授权

US08317392B2 Surface acoustic wave based micro-sensor apparatus and method for simultaneously monitoring multiple conditions 失效
标题翻译：基于声表面波的微传感器装置和方法同时监测多种条件
公开(公告)号：US08317392B2
公开(公告)日：2012-11-27
申请号：US12353069
申请日：2009-01-13
申请人： Cornel Cobianu , Ioan Pavelescu , Mihal Gologanu
发明人： Cornel Cobianu , Ioan Pavelescu , Mihal Gologanu
IPC分类号： G01K11/26 , G01P15/09 , H03H9/02
CPC分类号： H03H9/02535
摘要： A SAW-based micro-sensor apparatus for simultaneously monitoring acceleration/vibration and temperature utilizing a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line). The SAW device can be located in different locations on a substrate with respect to a thin piezoelectric diaphragm comprising an inertial mass. The temperature-compensated acceleration/vibration can be measured utilizing a frequency difference between an acceleration sensitive SAW resonator (e.g., SAW-g) and a temperature sensitive SAW resonator (e.g., SAW-T). The temperature can be measured utilizing a frequency shift provided by the SAW-T and a temperature reference SAW resonator (e.g., SAW-R). Similarly, the phase response of different reflectors of the SAW delay line can be utilized to differentially measure the acceleration/vibration and temperature.
摘要翻译：一种基于SAW的微传感器装置，用于利用构造为SAW器件（例如SAW谐振器或SAW延迟线）的感测元件同时监视加速/振动和温度。相对于包括惯性质量的薄压电振动膜，SAW器件可位于基板上的不同位置。可以利用加速度敏感的SAW谐振器（例如SAW-g）和温度敏感的SAW谐振器（例如，SAW-T）之间的频率差来测量温度补偿的加速度/振动。可以使用由SAW-T和温度参考SAW谐振器（例如，SAW-R）提供的频移来测量温度。类似地，SAW延迟线的不同反射器的相位响应可以用于差分地测量加速度/振动和温度。

3. 发明授权

US09437933B2 Sensor device with helical antenna and related system and method 有权
标题翻译：带螺旋天线的传感器装置及相关系统及方法
公开(公告)号：US09437933B2
公开(公告)日：2016-09-06
申请号：US12755123
申请日：2010-04-06
申请人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
发明人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
IPC分类号： H01Q11/08 , H01Q1/38 , H01Q1/32
CPC分类号： H01Q11/08 , H01Q1/3233 , H01Q1/38
摘要： An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
摘要翻译：一种装置包括传感器，其接收第一电信号并响应于第一电信号提供第二电信号。第二电信号基于由传感器监测的至少一个参数。该装置还包括天线，其将第一无线信号转换成第一电信号并将第二电信号转换成第二无线信号。天线包括基板，导电迹线和导电互连。导电迹线形成在基板的第一和第二表面上。导电互连件耦合导电迹线，并且导电互连和导电迹线形成天线的至少一个螺旋臂。导电迹线可以以各种方式形成，例如通过蚀刻或直接印刷。导电互连也可以以各种方式形成，例如通过在基板中填充通孔或直接印刷。

4. 发明申请

US20110241959A1 SENSOR DEVICE WITH HELICAL ANTENNA AND RELATED SYSTEM AND METHOD 有权
标题翻译：带有天线的传感器装置及相关系统及方法
公开(公告)号：US20110241959A1
公开(公告)日：2011-10-06
申请号：US12755123
申请日：2010-04-06
申请人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
发明人： Ion Georgescu , Dana E. Guran , Ioan Pavelescu , Cornel Cobianu
IPC分类号： H01Q1/36 , H01Q9/16 , H01B13/00
CPC分类号： H01Q11/08 , H01Q1/3233 , H01Q1/38
摘要： An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing.
摘要翻译：一种装置包括传感器，其接收第一电信号并响应于第一电信号提供第二电信号。第二电信号基于由传感器监测的至少一个参数。该装置还包括天线，其将第一无线信号转换成第一电信号并将第二电信号转换成第二无线信号。天线包括基板，导电迹线和导电互连。导电迹线形成在基板的第一和第二表面上。导电互连件耦合导电迹线，并且导电互连和导电迹线形成天线的至少一个螺旋臂。导电迹线可以以各种方式形成，例如通过蚀刻或直接印刷。导电互连也可以以各种方式形成，例如通过在基板中填充通孔或直接印刷。

5. 发明申请

US20070126072A1 SURFACE ACOUSTIC WAVE PRESSURE SENSORS 失效
标题翻译：表面声波式压力传感器
公开(公告)号：US20070126072A1
公开(公告)日：2007-06-07
申请号：US11164845
申请日：2005-12-07
申请人： Cornel Cobianu , Ioan Pavelescu , Viorel Avramescu , James Cook , Leonard McNally
发明人： Cornel Cobianu , Ioan Pavelescu , Viorel Avramescu , James Cook , Leonard McNally
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： G01L9/0025 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
摘要翻译：改进的SAW压力传感器及其制造方法。可以提供包括设置在其上的多个SAW换能器的SAW晶片。还可以提供覆盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。覆盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。在一些情况下，玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。也可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置在上方并且被固定时，轮廓中的至少一个围绕至少一个SAW换能器。

6. 发明申请

US20060086188A1 Vacuum sealed surface acoustic wave pressure sensor 有权
标题翻译：真空密封声表面波压力传感器
公开(公告)号：US20060086188A1
公开(公告)日：2006-04-27
申请号：US10971140
申请日：2004-10-21
申请人： Viorel Avramescu , Cornel Cobianu , Ioan Pavelescu
发明人： Viorel Avramescu , Cornel Cobianu , Ioan Pavelescu
IPC分类号： B23P17/04 , G01R3/00
CPC分类号： G01L9/0025 , H01L2224/48091 , H01L2224/48247 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , Y10T29/49 , Y10T29/49007 , H01L2924/00014 , H01L2924/00012
摘要： A vacuum sealed SAW pressure sensor is disclosed herein, which includes a sensing element configured as a SAW device (e.g., SAW resonator or SAW delay line) supported by a thin diaphragm. The substrate material can be implemented as a quartz wafer (i.e., a “base” wafer). The SAW device can be configured on one side of the wafer and the diaphragm etched on the opposite side. A quartz micromachined pressure sensor can thus be realized, which operates based on a variation of the surface wave velocity of a SAW device situated on the thin diaphragm. The SAW sensor is generally sealed in a vacuum and diaphragm sustains the sensor, thereby implementing a sensor on a wafer scale while allowing for a cost reduction per chip.
摘要翻译：本文公开了一种真空密封的SAW压力传感器，其包括被配置为由薄隔膜支撑的SAW器件（例如，SAW谐振器或SAW延迟线）的感测元件。衬底材料可以实现为石英晶片（即，“基底”晶片）。 SAW器件可以配置在晶片的一侧，并且隔膜在相对侧蚀刻。因此可以实现基于位于薄隔膜上的SAW器件的表面波速度的变化而操作的石英微加工压力传感器。 SAW传感器通常在真空中密封并且隔膜维持传感器，从而在晶片秤上实现传感器，同时允许每个芯片的成本降低。

7. 发明申请

US20060075820A1 MEMS SAW sensor 有权
标题翻译： MEMS SAW传感器
公开(公告)号：US20060075820A1
公开(公告)日：2006-04-13
申请号：US10964519
申请日：2004-10-13
申请人： Cornel Cobianu , Ioan Pavelescu , James Cook
发明人： Cornel Cobianu , Ioan Pavelescu , James Cook
IPC分类号： G01L11/00
CPC分类号： G01L9/0025
摘要： Devices and methods for acoustically measuring temperature and pressure are disclosed. A SAW sensor in accordance with an illustrative embodiment can include an electrode structure adapted to transmit and receive surface acoustic waves along a SAW delay line, temperature sensing means for measuring temperature along a first direction of the SAW delay line, and pressure sensing means for measuring pressure along a second direction of the SAW delay line. The SAW sensor can include an antenna adapted to wirelessly transmit and receive RF signals to and from an electrical interrogator unit that can be used to power the SAW sensor.
摘要翻译：公开了用于声学测量温度和压力的装置和方法。根据说明性实施例的SAW传感器可以包括适于沿着SAW延迟线发送和接收表面声波的电极结构，用于沿SAW延迟线的第一方向测量温度的温度感测装置，以及用于测量沿着SAW延迟线的第二方向施加压力。 SAW传感器可以包括适于无线地向能够用于为SAW传感器供电的电询问器单元的RF信号发送和接收RF信号的天线。

8. 发明申请

US20050231067A1 Pressure sensor methods and systems 有权
标题翻译：压力传感器的方法和系统
公开(公告)号：US20050231067A1
公开(公告)日：2005-10-20
申请号：US10828142
申请日：2004-04-20
申请人： James Cook , Cornel Cobianu , Vlad Buiculescu , Ioan Pavelescu , Brian Speldrich , James Liu , Brian Marsh
发明人： James Cook , Cornel Cobianu , Vlad Buiculescu , Ioan Pavelescu , Brian Speldrich , James Liu , Brian Marsh
IPC分类号： G01L9/00 , H02N2/00
CPC分类号： G01L9/0025 , Y10T29/42 , Y10T29/43 , Y10T29/49005 , Y10T29/4913
摘要： A quartz sensor method and system are disclosed in which a plurality of SAW sensing resonators can be mechanically simulated for implementation upon a quartz wafer substrate. The quartz wafer substrate can thereafter be appropriately etched to produce a quartz diaphragm from the quartz wafer substrate. A plurality of SAW sensing resonators (e.g., pressure, reference and/or temperature SAW resonators) can then be located upon the quartz wafer substrate, which is based upon the previously mechanically simulated for implementation upon the substrate to thereby produce a quartz sensor package from the quartz wafer substrate.
摘要翻译：公开了一种石英传感器方法和系统，其中可以机械地模拟多个SAW感测谐振器以在石英晶片衬底上实现。此后可以适当地蚀刻石英晶片衬底，以从石英晶片衬底产生石英膜。然后可以将多个SAW感测谐振器（例如，压力，参考和/或温度的SAW谐振器）定位在石英晶片衬底上，其基于在衬底上的先前机械模拟实现，从而从衬底上产生石英传感器封装，石英晶片基板。

9. 发明申请

US20060213275A1 MICRO-MACHINED PRESSURE SENSOR WITH POLYMER DIAPHRAGM 有权
标题翻译：具有聚合物膜片的微型压力传感器
公开(公告)号：US20060213275A1
公开(公告)日：2006-09-28
申请号：US10907176
申请日：2005-03-23
申请人： Cornel Cobianu , Mihai Gologanu , Ioan Pavelescu , Bogdan Serban
发明人： Cornel Cobianu , Mihai Gologanu , Ioan Pavelescu , Bogdan Serban
IPC分类号： G01L9/00
CPC分类号： G01L1/18 , G01L1/2287 , G01L9/0052
摘要： A piezoresistive pressure and/or strain sensor micro-machined primarily from plastic and/or glass. In one illustrative embodiment, the piezoresistive pressure sensor is formed on a polymer substrate. A first selectively implanted region is provided in the polymer substrate to create a piezoresistive region in the polymer substrate. A second selectively implanted region is then provided in at least part of the first selectively implanted region to modulate the electrical conductivity of the first selectively implanted region. The illustrative sensor may be selectively implanted with, for example, nitrogen to create the piezoresistive region, and boron to modulate the electrical conductivity of the piezoresistive region. Phosphorus or any other suitable material may also be used to modulate the electrical conductivity of the piezoresistive region, as desired. The piezoresistive pressure/strain sensor may be formed from a single substrate, or two or more substrates, and the resulting pressure/strain sensor may be mounted in a plastic package, if desired.
摘要翻译：主要由塑料和/或玻璃微加工的压阻压力和/或应变传感器。在一个说明性实施例中，压阻式压力传感器形成在聚合物基板上。在聚合物衬底中提供第一选择性注入区域，以在聚合物衬底中产生压阻区域。然后在第一选择性注入区域的至少一部分中提供第二选择注入区域，以调制第一选择性注入区域的电导率。说明性传感器可以选择性地植入例如氮气以产生压阻区域和硼以调节压阻区域的导电性。根据需要，磷或任何其它合适的材料也可用于调节压阻区域的导电性。压阻压力/应变传感器可以由单个基板或两个或更多个基板形成，并且如果需要，所得到的压力/应变传感器可以安装在塑料封装中。

10. 发明授权

US07651879B2 Surface acoustic wave pressure sensors 失效
标题翻译：表面声波压力传感器
公开(公告)号：US07651879B2
公开(公告)日：2010-01-26
申请号：US11164845
申请日：2005-12-07
申请人： Cornel P. Cobianu , Ioan Pavelescu , Viorel V. Avramescu , James D. Cook , Leonard J. McNally
发明人： Cornel P. Cobianu , Ioan Pavelescu , Viorel V. Avramescu , James D. Cook , Leonard J. McNally
IPC分类号： H01L21/00
CPC分类号： G01L9/0025 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908
摘要： Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
摘要翻译：改进的SAW压力传感器及其制造方法。可以提供包括设置在其上的多个SAW换能器的SAW晶片。还可以提供覆盖晶片，其中玻璃壁位于盖晶片和SAW晶片之间。覆盖晶片可以固定到SAW晶片，使得玻璃壁围绕SAW换能器。在一些情况下，玻璃壁可以至少部分地限定覆盖晶片和SAW晶片之间的间隔。也可以在盖晶片和SAW晶片之间提供一个或多个轮廓，使得当盖晶片相对于SAW晶片设置在上方并且被固定时，轮廓中的至少一个围绕至少一个SAW换能器。

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