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1. 发明授权

US4802276A Apparatus for printed wiring board component assembly 失效
标题翻译：印刷电路板组件装置
公开(公告)号：US4802276A
公开(公告)日：1989-02-07
申请号：US32429
申请日：1987-03-30
申请人： Corey H. Bowcutt , John J. Buckley, Jr. , James A. Rew
发明人： Corey H. Bowcutt , John J. Buckley, Jr. , James A. Rew
IPC分类号： H05K3/30 , H05K3/34 , H05K13/04
CPC分类号： H05K13/0465 , H05K3/303 , H05K3/3478 , H05K2201/10393 , H05K2201/10689 , H05K2201/2018 , H05K2203/0156 , H05K2203/0165 , H05K2203/0278 , H05K2203/0338 , H05K2203/0405 , H05K3/305 , H05K3/3421 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/53174 , Y10T29/53178 , Y10T29/53252
摘要： An apparatus for printed wiring board assembly provides for the populating with components of a printed wiring board having at least one adjacent pair of pad rows onto which solder has been deposited. A curable adhesive strip is applied between the adjacent pair of pad rows. The adhesive strip has a first adhesive side which adheres to the printed wiring board and an opposed, second adhesive side onto which the components are selectively mounted so that the component's leads are aligned with the pad rows. A predetermined constant force is applied to the components and the adhesive strip is cured. The apparatus supports the printed wiring board and maintains a predetermined constant force on the components. A frame defining a generally U-shaped member has an upper and a lower surface. The U-shaped member has a slot therein for receiving the printed wiring board therein. An upper and a lower cover member are removably secured to the U-shaped member to generally enclose the printed wiring board. Resilient biasing is disposed between the printed wiring board and the cover members, whereby a predetermined constant force is maintained on the mounted components.
摘要翻译：一种用于印刷线路板组件的设备提供了具有至少一个相邻的一对垫排的印刷线路板的部件，焊料已经被沉积到其上。在相邻的一对垫排之间施加可固化的粘合带。粘合带具有粘附到印刷线路板的第一粘合剂侧和相对的第二粘合剂侧，其上选择性地安装所述部件，使得部件的引线与焊盘排对齐。对组件施加预定的恒定力，并且固化粘合带。该装置支撑印刷线路板并且在组件上保持预定的恒定力。限定大致U形构件的框架具有上表面和下表面。 U形部件在其中具有用于在其中接收印刷线路板的槽。上盖构件和下盖构件可拆卸地固定到U形构件以大致封闭印刷线路板。弹性偏置设置在印刷线路板和盖构件之间，由此在安装的部件上保持预定的恒定力。

2. 发明授权

US4840305A Method for vapor phase soldering 失效
标题翻译：气相焊接方法
公开(公告)号：US4840305A
公开(公告)日：1989-06-20
申请号：US32426
申请日：1987-03-30
申请人： Michael J. Ankrom , Corey H. Bowcutt , John J. Buckley, Jr. , James A. Rew
发明人： Michael J. Ankrom , Corey H. Bowcutt , John J. Buckley, Jr. , James A. Rew
IPC分类号： B23K1/015 , B23K3/06 , H05K3/34
CPC分类号： H05K3/3494 , B23K1/015 , B23K3/06 , H05K2203/088 , H05K2203/163 , H05K3/3489
摘要： A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.
摘要翻译：将预先沉积焊料的PWB上的气相成分焊接到PWB上的方法包括在PWB上施加助熔剂并将PWB引入气相环境的步骤。助焊剂的应用是一个多步骤过程，其中包括向PWB顺序施加助焊剂。气相环境限定了大约环境温度和第一选定流体的饱和蒸气的温度之间的温度梯度，该温度限定了沸点大于焊料熔点的初级饱和气相。利用具有低于第一流体的沸点的第二流体来产生二次蒸气层，以防止限定初级气相的流体的过度损失。 PWB根据控制过程进行加热，其中PWB的温度连续监测。

3. 发明授权

US5293983A Transport/stacker module for mail processing system 失效
标题翻译：邮件处理系统的运输/堆垛机模块
公开(公告)号：US5293983A
公开(公告)日：1994-03-15
申请号：US742753
申请日：1991-08-09
申请人： Thomas F. Grapes , James A. Rew , Charles M. Miller , John J. Buckley, Jr. , Stanley K. Wakamiya , David J. Tilles , William L. DeHaven
发明人： Thomas F. Grapes , James A. Rew , Charles M. Miller , John J. Buckley, Jr. , Stanley K. Wakamiya , David J. Tilles , William L. DeHaven
IPC分类号： B07C3/08 , B65G37/00
CPC分类号： B07C3/082 , Y10S209/90
摘要： A transport/stacker module provides for a vertical stacking of mail bins. Carriers traveling in a transport path have openable and closable doors at both ends, and a frame of the transport/stacker module is provided with cam actuators to open the doors after the carriers pass turnaround areas and close the doors before the carriers enter the turnaround areas. A rake mechanism disposed above each bin is provided with a snubber which engages a mail piece prior to rake tines of the rake mechanism.
摘要翻译：运输/堆垛机模块提供邮箱的垂直堆叠。在运输路径中行进的运输工具在两端具有可打开和关闭的门，并且运输/堆垛机模块的框架设置有凸轮致动器，在载体经过周转区域之后打开门，并且在承载件进入周转区域之前关闭门。设置在每个箱体上方的耙式机构设置有在耙机构的耙齿之前接合邮件的缓冲器。

4. 发明授权

US5038201A Wafer scale integrated circuit apparatus 失效
标题翻译：晶圆级集成电路设备
公开(公告)号：US5038201A
公开(公告)日：1991-08-06
申请号：US268909
申请日：1988-11-08
申请人： Joe E. Brewer , John J. Buckley, Jr.
发明人： Joe E. Brewer , John J. Buckley, Jr.
IPC分类号： H01L23/12 , H01L23/52 , H01L25/065 , H05K7/20
CPC分类号： H01L25/0657 , H01L2225/06589 , H01L2924/0002 , H01L2924/3011
摘要： Wafer scale integrated circuit apparatus wherein a full wafer scale semiconductor integrated wafer is adhesively secured to an essentially flat heat conducting non-metallic base member with the wafer and base member having coefficients of thermal expansion approximately equal to one another. A cable adapter assembly connected to an edge of the base member secures one or more multiconductor flat cables in position such that the conductors thereof, by means of a clamping arrangement make positive pressure contacts with contact points connected to electronic circuitry of the semiconductor wafer. Another wafer may be placed on an opposed surface of the base member and a second cable adapter assembly may be utilized to secure another multiconductor flat cable for making interconnection between contact points of the wafer on one surface with contact points of the wafer on the opposed surface of the base member. The arrangement constitutes a wafer module and a plurality of such identical wafer modules may be stacked one upon the other and placed in a housing which has heat conducting side walls for heat dissipation purposes. A cable link assembly traverses the flat cables held in position by the first cable adapter assemblies of the wafer modules in order to serve for the inputting and outputting of electrical signals.

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