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1. 发明申请

US20100146863A1 POLISHING PAD HAVING INSULATION LAYER AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有绝缘层的抛光垫及其制造方法
公开(公告)号：US20100146863A1
公开(公告)日：2010-06-17
申请号：US12536164
申请日：2009-08-05
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang , Wei-Te Liu
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang , Wei-Te Liu
IPC分类号： B24D11/00 , B24D3/00
CPC分类号： B24B37/22
摘要： The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality.
摘要翻译：本发明涉及一种具有绝缘层的抛光垫及其制造方法。抛光垫包括底层，绝缘层和磨料层。底层包括缠绕在高聚合物中的织物层。绝缘层设置在底层上。研磨层设置在绝缘层上。研磨层是高聚物弹性体，并且具有多个柱状细胞。绝缘层可以防止浆料在抛光过程中渗入底层，以提高抛光效果和质量。

2. 发明申请

US20090258587A1 POLISHING PAD HAVING GROOVE STRUCTURE FOR AVOIDING THE POLISHING SURFACE STRIPPING 有权
标题翻译：用于避免抛光表面剥落的抛光结构的抛光垫
公开(公告)号：US20090258587A1
公开(公告)日：2009-10-15
申请号：US12139525
申请日：2008-06-16
申请人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
发明人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
IPC分类号： B24D11/00
CPC分类号： B24B37/26
摘要： The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved.
摘要翻译：本发明涉及一种具有用于避免抛光表面剥离的凹槽结构的抛光垫。本发明的抛光垫包括基材和研磨层。基材具有表面。磨削层设置在表面上，并且暴露基体材料边缘周围的一部分表面。研磨层具有多个第一凹槽和第二凹槽，并且第一凹槽与第二凹槽交叉以限定多个研磨区域。围绕基材边缘的表面的暴露部分位于第一凹槽，第二凹槽和抛光垫的边缘之间。因此，本发明的抛光垫能够容纳更多的研磨液，并且有助于清洁小的研磨件。此外，研磨层不具有尖锐的结构，并且不容易剥离以形成小的研磨件。因此，可以提高研磨质量和研磨效果。

3. 发明授权

US07662028B2 Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad 有权
标题翻译：抛光垫具有用于避免剥离抛光垫的抛光表面的凹槽结构
公开(公告)号：US07662028B2
公开(公告)日：2010-02-16
申请号：US12139525
申请日：2008-06-16
申请人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
发明人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
IPC分类号： B24D11/00
CPC分类号： B24B37/26
摘要： A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.
摘要翻译：一种用于避免剥离抛光垫的抛光表面的凹槽结构，所述抛光垫包括基底材料和研磨层。基材具有表面。磨削层设置在表面上，并且暴露基体材料边缘周围的一部分表面。研磨层具有多个第一凹槽和第二凹槽，并且第一凹槽与第二凹槽交叉以限定多个研磨区域。围绕基材边缘的表面的暴露部分位于第一凹槽，第二凹槽和抛光垫的边缘之间。抛光垫包含更多的研磨液，以清洁小磨碎的碎片。研磨层不具有尖锐的结构，并且不容易剥离以形成小的研磨件。因此，磨削质量和磨削效果得到提高。

4. 发明申请

US20090258578A1 POLISHING PAD AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：抛光垫及其制造方法
公开(公告)号：US20090258578A1
公开(公告)日：2009-10-15
申请号：US12208520
申请日：2008-09-11
申请人： Chung-Chih Feng , Chun-Ta Wang , Yung-Chang Hung , I-Peng Yao
发明人： Chung-Chih Feng , Chun-Ta Wang , Yung-Chang Hung , I-Peng Yao
IPC分类号： B24D11/00
CPC分类号： B24B37/24 , B24B37/22 , B24D18/00
摘要： The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved.
摘要翻译：抛光垫及其制造方法技术领域本发明涉及抛光垫及其制造方法。在本发明中，在基材的表面上直接形成液态聚合物材料，然后使液态聚合物材料固化，形成平坦的研磨层。因此，抛光垫具有高的一体性和平坦度。研磨层具有衰减结构和多个孔，从而增加了分布在抛光液中的抛光颗粒的储存能力。此外，抛光垫具有高压缩比，因此抛光垫可以紧密接触抛光工件，并且不会刮擦抛光工件的表面划伤。因此，抛光效果和质量将得到提高。

5. 发明授权

US08343586B2 Conductive polishing pad and method for making the same 有权
标题翻译：导电抛光垫及其制造方法
公开(公告)号：US08343586B2
公开(公告)日：2013-01-01
申请号：US12427259
申请日：2009-04-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
IPC分类号： B05D1/36 , B05D7/00
CPC分类号： B24B37/22 , B23H5/08 , B24B37/24 , B32B3/266 , B32B5/022 , B32B27/08 , B32B27/12 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2255/26 , B32B2307/7265 , B32B2307/728 , D06M15/227 , D06M15/263 , D06M15/507 , D06M15/564 , D06N3/042 , D06N3/045 , D06N3/123 , D06N3/14 , D06N2209/041 , D06N2209/105 , D06N2209/141 , D06N2213/04 , D06P1/5221 , D06P1/5271 , D06P1/5285 , Y10T428/249981
摘要： The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
摘要翻译：导电性抛光垫及其制造方法技术领域本发明涉及导电性抛光垫及其制造方法。导电抛光垫包括底层，导电膜和抛光层。底层包括第一高聚物和纤维基质。第一高分子聚合物覆盖纤维基底，并具有多个第一孔。导电膜设置在底层上。抛光层设置在导电膜上，并包括第二高聚物。第二高分子具有多个第二孔。即使底层和抛光层是不良导体，其导电性也被导电膜提高，因此抛光垫具有良好的导电性。此外，抛光垫具有柔性表面，其防止抛光时工件表面被抛光而被划伤。

6. 发明申请

US20100119811A1 CONDUCTIVE POLISHING PAD AND METHOD FOR MAKING THE SAME 有权
标题翻译：导电抛光垫及其制造方法
公开(公告)号：US20100119811A1
公开(公告)日：2010-05-13
申请号：US12427259
申请日：2009-04-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
IPC分类号： B24B29/00 , B05D1/36 , B05D5/00 , B32B3/26
CPC分类号： B24B37/22 , B23H5/08 , B24B37/24 , B32B3/266 , B32B5/022 , B32B27/08 , B32B27/12 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2255/26 , B32B2307/7265 , B32B2307/728 , D06M15/227 , D06M15/263 , D06M15/507 , D06M15/564 , D06N3/042 , D06N3/045 , D06N3/123 , D06N3/14 , D06N2209/041 , D06N2209/105 , D06N2209/141 , D06N2213/04 , D06P1/5221 , D06P1/5271 , D06P1/5285 , Y10T428/249981
摘要： The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
摘要翻译：导电性抛光垫及其制造方法技术领域本发明涉及导电性抛光垫及其制造方法。导电抛光垫包括底层，导电膜和抛光层。底层包括第一高聚物和纤维基质。第一高分子聚合物覆盖纤维基底，并具有多个第一孔。导电膜设置在底层上。抛光层设置在导电膜上，并包括第二高聚物。第二高分子具有多个第二孔。即使底层和抛光层是不良导体，其导电性也被导电膜提高，因此抛光垫具有良好的导电性。此外，抛光垫具有柔性表面，其防止抛光时工件表面被抛光而被划伤。

7. 发明申请

US20080200105A1 Carrier film for mounting polishing workpiece and method for making the same 审中-公开
标题翻译：用于安装抛光工件的载体膜及其制造方法
公开(公告)号：US20080200105A1
公开(公告)日：2008-08-21
申请号：US11706226
申请日：2007-02-15
申请人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
发明人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
IPC分类号： B24B19/00 , C09J5/06
CPC分类号： C09J5/06 , B24B9/146 , B24B37/30 , B24B41/068 , C09J2423/006 , C09J2427/006 , C09J2475/006
摘要： The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate comprises holes, and the material of the surface substrate comprises elastomer. The buffer substrate comprises holes, and the material of the buffer substrate comprises the elastomer. The surface substrate and the buffer substrate are adhered with adhesive comprising the elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
摘要翻译：本发明涉及一种用于安装抛光工件的载体膜。载体膜包括表面基板和缓冲基板。表面基材包括孔，表面基材的材料包括弹性体。缓冲基板包括孔，缓冲基板的材料包括弹性体。表面基板和缓冲基板用包含弹性体的粘合剂粘合。还提供了制造载体膜的方法。当抛光时，载体膜提供良好的缓冲性能以传导和释放施加在抛光工件上的下压力。

8. 发明授权

US09862071B2 Method for manufacturing polishing pad and polishing pad 有权
公开(公告)号：US09862071B2
公开(公告)日：2018-01-09
申请号：US12887363
申请日：2010-09-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang
IPC分类号： C09K3/14 , B24B37/24
CPC分类号： B24B37/24
摘要： The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.

9. 发明授权

US08414669B2 Polishing pad, the use thereof and the method for manufacturing the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08414669B2
公开(公告)日：2013-04-09
申请号：US12883446
申请日：2010-09-16
申请人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
发明人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung
IPC分类号： B24D11/00
CPC分类号： B24D18/00 , B24B37/22 , B24B37/24 , B24D3/26
摘要： The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
摘要翻译：本发明主要涉及一种包括由纤维构成的基材的抛光垫; 具有低渗透性的第一膜; 在所述第一膜的上表面上形成低渗透性的双组分糊料，用于将所述基材粘附到所述第一膜，所述第一膜具有低渗透性; 以及形成在第一膜的下表面上的低渗透性的聚氨酯浆料。还提供了一种抛光包括使用抛光垫的基板的方法和如上所述的用于制造抛光垫的方法。如上所述的抛光垫防止抛光垫从抛光台板或头部分离。抛光垫易于更换，而不会在研磨台板或头部上留下残留物。

10. 发明申请

US20110003536A1 Polishing Pad and Method of Producing the Same 审中-公开
标题翻译：抛光垫及其生产方法
公开(公告)号：US20110003536A1
公开(公告)日：2011-01-06
申请号：US12883509
申请日：2010-09-16
申请人： Chung-Chih Feng , I-Peng Yao , Chen-Hsiang Chao , Yung-Chang Hung
发明人： Chung-Chih Feng , I-Peng Yao , Chen-Hsiang Chao , Yung-Chang Hung
IPC分类号： B24D11/02 , B24B1/00 , B24D3/20
CPC分类号： B24B37/24 , B24D3/22 , B24D11/02 , B32B5/022 , B32B5/024 , B32B5/06 , B32B5/08 , B32B5/18 , B32B5/245 , B32B5/26 , B32B2260/021 , B32B2260/048 , B32B2262/0246 , B32B2262/0261 , B32B2262/0276 , B32B2262/12 , B32B2262/14 , B32B2266/0207 , B32B2307/50 , D04H3/105 , D04H3/12
摘要： The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
摘要翻译：本发明主要涉及一种抛光垫及其制造方法。抛光垫包括具有用于抛光基底的表面的基材，其中该表面包括无纺织物和弹性体。弹性体嵌入到织物中，无纺布包括彼此无规缠结的多个第一长纤维。

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