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    • 3. 发明申请
    • Candle Lighting Type Reflective Lampshade
    • 蜡烛灯类型反光灯罩
    • US20100259937A1
    • 2010-10-14
    • US12420431
    • 2009-04-08
    • Ming-Chang WUChih-Chun WenChih-Hung Wei
    • Ming-Chang WUChih-Chun WenChih-Hung Wei
    • F21V7/00F21S6/00F21V3/00
    • F21V1/00F21V7/0016F21Y2115/10
    • A candle lighting type reflective lampshade comprises a lampshade main body being made with a reverse cone body on the upper half thereof and a cover layer on the inner cone surface thereof, wherein the cone surface forming a pair of symmetrical parabolic curves includes a ring type aperture on the top thereof thereby allowing the underside light source to achieve secondary full reflection; the base of lampshade main body comprises a plurality of inclined surfaces being ringly peripherally installed thereon and being installed with a plurality of lamp source bases below the inclined surfaces, while the light source is effectively controlled by the lamp source base to beam the light on the cone top portion of the reverse cone body so as to fully reflect each light beam and to achieve uniform dispersion of the light source.
    • 蜡烛照明型反射灯罩包括:灯罩主体,其上半部具有倒锥体,在其内锥面上形成覆盖层,其中形成一对对称抛物线曲面的锥面包括环形孔 在其顶部,从而允许下侧光源实现二次全反射; 灯罩主体的基座包括多个倾斜表面,环形周边安装在其上,并且在倾斜表面下方安装有多个灯源基座,同时光源由灯源基座有效地控制,以将光束照射在 反锥体的锥形顶部,以便完全反射每个光束并实现光源的均匀分散。
    • 7. 发明申请
    • Light-Emitting Diode With High Color-Rendering Index
    • 具有高显色指数的发光二极管
    • US20110049539A1
    • 2011-03-03
    • US12549356
    • 2009-08-27
    • Chih-Hung WeiMing-Chang WuJohnny Wu
    • Chih-Hung WeiMing-Chang WuJohnny Wu
    • H01L27/15
    • H01L25/0753H01L33/50H01L2924/0002H01L2924/00
    • A light-emitting diode (LED) with high color-rendering index includes a substrate being provided on one face with a plurality of recesses; a plurality of first chips being separately disposed in the recesses and adapted to emit blue light; a plurality of fluorescent glues being separately filled in the recesses; at least one second chip being disposed on the substrate at a predetermined position to electrically connect to the first chips, and adapted to emit red light; and a light-transmittable layer provided on the substrate to protectively cover the first chips, the fluorescent glues, and the second chip. The blue light emitted from the first chips and the yellow or green light from the fluorescent glues are mixed first, and the produced light is then further mixed with the red light emitted from the second chip to produce warm white light, which is then projected through the light-transmittable layer.
    • 具有高显色指数的发光二极管(LED)包括在一个面上设置有多个凹部的基板; 多个第一芯片分别设置在凹部中并适于发射蓝光; 多个荧光胶分别填充在凹部中; 至少一个第二芯片设置在所述基板上的预定位置处以电连接到所述第一芯片,并且适于发射红光; 以及设置在所述基板上以可保护地覆盖所述第一芯片,所述荧光胶和所述第二芯片的透光层。 从第一芯片发出的蓝光和来自荧光胶的黄光或绿光首先混合,然后将所产生的光与从第二芯片发出的红光进一步混合,产生暖白光,然后将其投射通过 透光层。
    • 9. 发明申请
    • Multiple Light Source Surface Packaging Structure
    • 多光源表面包装结构
    • US20100097803A1
    • 2010-04-22
    • US12254065
    • 2008-10-20
    • Ming-Chang WUChih-Chun WenChih-Hung Wei
    • Ming-Chang WUChih-Chun WenChih-Hung Wei
    • F21V5/04
    • F21V5/045F21V5/007F21Y2105/10F21Y2115/10
    • The preferred embodiment the invention proposes pertains to a light source system structure, claimticularly referring to a multiple light-source source packaging structure, which is comprised of a surface wrapped with a multiple number of packagers, and inside the packagers is a placement space, and the surface of the packager is of a smooth surface; a micro-Fresnel lens unit, which is mounted in the placement space, and the micro-Fresnel lens unit is comprised of a multiple number of encircling micro-Fresnel lenses, with a concave slot located at the center of the encircling micro-Fresnel lens unit and a light source mounted beneath the concave slot, where the light created from the light source can be deflected and projected through the micro-Fresnel lens unit, through which to further control the angle of each light beam, together with a circuit control switch linked to the light source to further control the distance of light projection from the multiple number of packagers, enabling the distance of projection to be controlled by the varied micro-Fresnel lens unit within the packager.
    • 本发明提出的优选实施例涉及一种光源系统结构,其特征在于涉及多个光源源封装结构,该多光源源封装结构包括用多个封隔器包裹的表面,并且封隔器内部是放置空间,并且 包装机的表面是光滑的表面; 安装在放置空间中的微菲涅耳透镜单元和微菲涅耳透镜单元由多个环绕的微菲涅耳透镜组成,其中凹槽位于环绕的微菲涅尔透镜的中心 单元和安装在凹槽下方的光源,其中从光源产生的光可以偏转并通过微型菲涅尔透镜单元投射,通过该光源进一步控制每个光束的角度,以及电路控制开关 连接到光源以进一步控制来自多个打包机的光投影的距离,使投影距离能够由包装机内的不同的微型菲涅耳透镜单元控制。
    • 10. 发明申请
    • Structure of Light Emitting Diode
    • 发光二极管的结构
    • US20100096658A1
    • 2010-04-22
    • US12254049
    • 2008-10-20
    • Ming-Chang WuChih-Yang HsuMing-Yu HsuChih-Hung Wei
    • Ming-Chang WuChih-Yang HsuMing-Yu HsuChih-Hung Wei
    • H01L33/00
    • H01L33/505H01L33/486H01L33/62H01L2924/0002H01L2924/00
    • An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board.
    • 发光二极管的改进结构包括:覆铜层压板在其上形成矩形型槽,在外边界上形成环形槽,以封闭矩形型槽,而槽的侧壁形成与 覆铜层压板的表面进一步形成岛型平台; 在矩形槽和环形槽之间形成的导体穿过铜包覆层压板并由绝缘体外部包围,从而允许导体绝缘; 在其上安装发光二极管芯片; 荧光胶可选地安装在发光二极管上,覆盖范围小于矩形型槽的自然引导角,其中覆铜层压板安装在印刷电路板上。