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    • 5. 发明授权
    • Heat-seal resin and package formed therefrom
    • 热封树脂和由此形成的包装
    • US08173748B1
    • 2012-05-08
    • US12972035
    • 2010-12-17
    • David John LohseThomas Tungshi SunAspy K. MehtaGabor KissRobert Patrick Reynolds, Jr.John W. ChuManika Varma-Nair
    • David John LohseThomas Tungshi SunAspy K. MehtaGabor KissRobert Patrick Reynolds, Jr.John W. ChuManika Varma-Nair
    • C08F8/00C08L23/00C08L23/04C08L23/10
    • C08L23/142C08L2205/025
    • Provided is a heat-seal resin. The resin includes 5 wt % to 95 wt % of a first copolymer and 95 wt % to 5 wt % of a second copolymer based on the total weight of the resin. The first copolymer and the second copolymer together are 90 wt % or more of the total weight of the resin. The first copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the first copolymer are different. The first copolymer has an MFR of from 5 to 1000 g/10 minutes and a Tfm of 66° C. to 80° C. The second copolymer includes a first monomer of an alphaolefin of 2 to 4 carbon atoms and a second monomer selected from a second monomer of an alphaolefin of 2 to 8 carbon atoms. The first monomer and the second monomer of the second copolymer are different. The second copolymer has an MFR of from 0.5 to 5 g/10 minutes and a Tfm of 45° C. to 66° C., wherein the first copolymer has an MFR of at least 2 g/10 minutes greater and a Tfm of at least 10° C. greater than the second copolymer. There is also a package formed partly or entirely of the resin.
    • 提供一种热封树脂。 基于树脂的总重量,树脂包含5重量%至95重量%的第一共聚物和95重量%至5重量%的第二共聚物。 第一共聚物和第二共聚物一起是树脂总重量的90重量%以上。 第一共聚物包括2至4个碳原子的α-烯烃的第一单体和选自2至8个碳原子的α-烯烃的第二单体的第二单体。 第一共聚物的第一单体和第二单体是不同的。 第一共聚物的MFR为5至1000g / 10分钟,Tfm为66℃至80℃。第二共聚物包括第一单体,其具有2至4个碳原子的α-烯烃,第二单体选自 2至8个碳原子的α-烯烃的第二单体。 第二共聚物的第一单体和第二单体是不同的。 第二共聚物的MFR为0.5〜5g / 10分钟,Tfm为45〜66℃,其中第一共聚物的MFR为2g / 10分钟以上, 比第二共聚物大至少10℃。 还有一部分或全部由树脂形成的包装。