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1. 发明授权

US06404050B2 Commonly housed diverse semiconductor 有权
标题翻译：通常安置的各种半导体
公开(公告)号：US06404050B2
公开(公告)日：2002-06-11
申请号：US09966092
申请日：2001-10-01
申请人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
发明人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
IPC分类号： H01L2348
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48744 , H01L2224/49111 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , Y10S257/901 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A MOSFET die and a Schottky diode die are mounted on a common lead frame pad and their drain and cathode, respectively, are connected together at the pad. The pad has a plurality of pins extending from one side thereof. The lead frame has insulated pins on its opposite side which are connected to the FET source, the FET gate and the Schottky diode anode respectively by wire bonds. The lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface-mount package.
摘要翻译： MOSFET管芯和肖特基二极管管芯安装在公共引线框架焊盘上，其漏极和阴极分别在焊盘处连接在一起。垫具有从其一侧延伸的多个销。引线框架的相对侧有绝缘引脚，分别通过引线连接到FET源极，FET栅极和肖特基二极管阳极。引线框架和模具被模制在绝缘壳体中，并且引线框架销向下弯曲以限定表面安装封装。

2. 发明授权

US6133632A Commonly housed diverse semiconductor die 有权
标题翻译：常用的多种半导体芯片
公开(公告)号：US6133632A
公开(公告)日：2000-10-17
申请号：US161790
申请日：1998-09-28
申请人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
发明人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
IPC分类号： H01L25/18 , H01L23/495 , H01L23/50 , H01L25/04 , H01L23/34 , H01L23/48 , H01L23/52 , H01L27/088 , H01L29/40
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/49 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48744 , H01L2224/49111 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , Y10S257/901
摘要： A MOSFET die and a Schottky diode die are mounted on a common lead frame pad and their drain and cathode, respectively, are connected together at the pad. The pad has a plurality of pins extending from one side thereof. The lead frame has insulated pins on its opposite side which are connected to the FET source, the FET gate and the Schottky diode anode respectively by wire bonds. The lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface-mount package.
摘要翻译： MOSFET管芯和肖特基二极管管芯安装在公共引线框架焊盘上，其漏极和阴极分别在焊盘处连接在一起。垫具有从其一侧延伸的多个销。引线框架的相对侧有绝缘引脚，分别通过引线连接到FET源极，FET栅极和肖特基二极管阳极。引线框架和模具被模制在绝缘壳体中，并且引线框架销向下弯曲以限定表面安装封装。

3. 发明授权

US5814884A Commonly housed diverse semiconductor die 失效
公开(公告)号：US5814884A
公开(公告)日：1998-09-29
申请号：US816829
申请日：1997-03-18
申请人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
发明人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
IPC分类号： H01L25/18 , H01L23/495 , H01L23/50 , H01L25/04 , H01L23/24 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/49 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48744 , H01L2224/49111 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , Y10S257/901
摘要： A MOSFET die and a Schottky diode die are mounted on a common lead frame pad and their drain and cathode, respectively, are connected together at the pad. The pad has a plurality of pins extending from one side thereof. The lead frame has insulated pins on its opposite side which are connected to the FET source, the FET gate and the Schottky diode anode respectively by wire bonds. The lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface-mount package.

4. 发明授权

US06297552B1 Commonly housed diverse semiconductor die 有权
标题翻译：常用的多种半导体芯片
公开(公告)号：US06297552B1
公开(公告)日：2001-10-02
申请号：US09645060
申请日：2000-08-24
申请人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
发明人： Christopher Davis , Chuan Cheah , Daniel M. Kinzer
IPC分类号： H01L23043
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/48744 , H01L2224/49111 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12032 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , Y10S257/901 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A MOSFET die and a Schottky diode die are mounted on a common lead frame pad and their drain and cathode, respectively, are connected together at the pad. The pad has a plurality of pins extending from one side thereof. The lead frame has insulated pins on its opposite side which are connected to the FET source, the FET gate and the Schottky diode anode respectively by wire bonds. The lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface-mount package.
摘要翻译： MOSFET管芯和肖特基二极管管芯安装在公共引线框架焊盘上，其漏极和阴极分别在焊盘处连接在一起。垫具有从其一侧延伸的多个销。引线框架的相对侧有绝缘引脚，分别通过引线连接到FET源极，FET栅极和肖特基二极管阳极。引线框架和模具被模制在绝缘壳体中，并且引线框架销向下弯曲以限定表面安装封装。

5. 发明申请

US20100317641A1 THIAZOLES AND PYRAZOLES USEFUL AS KINASE INHIBITORS 失效
标题翻译：噻唑和吡唑可用作激酶抑制剂
公开(公告)号：US20100317641A1
公开(公告)日：2010-12-16
申请号：US12598275
申请日：2009-10-30
申请人： Michael Mortimore , Julian Golec , Christopher Davis , Daniel Robinson , John Studley
发明人： Michael Mortimore , Julian Golec , Christopher Davis , Daniel Robinson , John Studley
IPC分类号： A61K31/4439 , C07D417/14 , C07D401/14 , C12N9/99 , A61P35/00 , A61P35/02
CPC分类号： C07D417/14 , C07D401/14
摘要： The present invention relates to compounds useful as inhibitors of Aurora protein kinases. The invention also provides pharmaceutically acceptable compositions comprising those compounds and methods of using the compounds and compositions in the treatment of various disease, conditions, and disorders. The invention also provides processes for preparing compounds of the invention.
摘要翻译：本发明涉及可用作Aurora蛋白激酶抑制剂的化合物。本发明还提供包含这些化合物的药学上可接受的组合物和使用该化合物和组合物治疗各种疾病，病症和障碍的方法。本发明还提供了制备本发明化合物的方法。

6. 发明授权

US07820767B2 Aromatic polyimide composition 有权
标题翻译：芳香族聚酰亚胺组合物
公开(公告)号：US07820767B2
公开(公告)日：2010-10-26
申请号：US12281033
申请日：2007-03-06
申请人： Mohammad Jamal El-Hibri , Leslie J. Myrick , David B. Thomas , Roy L. Carter , Nikica Maljkovic , Christopher Davis , Scott A. Harding
发明人： Mohammad Jamal El-Hibri , Leslie J. Myrick , David B. Thomas , Roy L. Carter , Nikica Maljkovic , Christopher Davis , Scott A. Harding
IPC分类号： C08F283/00 , C08F283/04
CPC分类号： C08J5/18 , C08G2261/312 , C08J2365/02 , C08J2379/08 , C08L65/00 , C08L65/02 , C08L79/08 , C08L2205/02 , Y10T428/31504 , Y10T428/31507 , Y10T428/31786 , C08L2666/22 , C08L2666/20
摘要： The present invention relates to a new aromatic polyimide composition containing an aromatic polyimide and a polyarylene of a specific type, and to articles and parts of articles made thereof.
摘要翻译：本发明涉及含有芳香族聚酰亚胺和特定类型的聚亚芳基的新型芳香族聚酰亚胺组合物及其制品及其制品。

7. 发明申请

US20050288031A1 OPTICAL WIRELESS NETWORKS WITH ADJUSTABLE TOPOLOGIES 有权
标题翻译：光学无线网络与可调拓扑
公开(公告)号：US20050288031A1
公开(公告)日：2005-12-29
申请号：US10615182
申请日：2003-07-09
申请人： Christopher Davis , Stuart Milner , Igor Smolyaninov
发明人： Christopher Davis , Stuart Milner , Igor Smolyaninov
IPC分类号： H04L12/56 , H04W40/06 , H04W40/24 , H04W84/18 , H04Q7/20
CPC分类号： H04W40/06 , H04W40/24 , H04W84/18 , Y02D70/164 , Y02D70/322
摘要： In a free space communication network in which different communication nodes are linked together by directed beams, a method for dynamically configuring the topology of the network allows the transmission directions of the communication nodes to be autonomously changed to communicate with a new node as dictated by the needs of the network. Moreover, the nodes can be switched from directional to broadcast and back again on an as-needed basis. The network consists of a topology that can be rapidly and physically reconfigured as required to provide multiple connectivity, a desired quality of service, or to compensate with the loss of communication links between nodes. The loss of direct communication between any two nodes in an optical network can occur because of obscuration of the atmospheric path between the two nodes. The directed beam which provides the communication channel between the two nodes can, in this situation, be steered to direct its energy towards another accessible node.
摘要翻译：在通过定向波束将不同的通信节点链接在一起的自由空间通信网络中，用于动态地配置网络的拓扑的方法允许通信节点的传输方向被自主地改变以与新的节点进行通信，如网络需求。此外，节点可以根据需要从方向切换到广播，并重新进行重传。该网络包括可以根据需要快速和物理地重新配置以提供多个连接性，期望的服务质量或者为了弥补节点之间的通信链路的损失而进行补偿的拓扑。由于两个节点之间的大气路径的遮蔽，可能会发生光网络中任何两个节点之间的直接通信丢失。在这种情况下，提供两个节点之间的通信信道的定向波束被引导以将其能量引向另一可访问节点。

8. 外观设计

USD381207S Hairbrush 失效
公开(公告)号：USD381207S
公开(公告)日：1997-07-22
申请号：US36866
申请日：1995-03-29
申请人： Kathy Gertsma , Christopher Davis
设计人： Kathy Gertsma , Christopher Davis

9. 发明授权

US08826918B2 Start, style, and finish hairstyling system 有权
标题翻译：开始，风格和完成发型系统
公开(公告)号：US08826918B2
公开(公告)日：2014-09-09
申请号：US11935890
申请日：2007-11-06
申请人： Angela Marie Hornbach , Christopher Davis
发明人： Angela Marie Hornbach , Christopher Davis
IPC分类号： A45D24/00 , A45D44/02 , A46B15/00 , A45D44/00 , A45D7/00
CPC分类号： A45D44/02 , A45D7/00 , A45D24/00 , A45D44/005 , A46B15/0085 , A46B15/0091 , A46B2200/104
摘要： A first method of systematizing hairstyling tools includes defining hairstyling steps, defining indicia for the steps, determining hairstyling tools to perform the steps, and displaying the indicia on the corresponding tools. A second method of systematizing hairstyling tools includes additionally defining hairstyles, selecting the hairstyling steps to implement the hairstyle, and packaging the corresponding hairstyling tools together as a set. Also within the scope of the invention are hairstyling tools, sets of hairstyling tools, and systems of hairstyling tools according to the first and second methods.
摘要翻译：系统化发型工具的第一种方法包括定义发型步骤，定义步骤的标记，确定执行步骤的发型工具，以及在对应的工具上显示标记。系统化发型工具的第二种方法包括另外定义发型，选择实施发型的发型步骤，以及将相应的发型工具作为一组包装在一起。在本发明的范围内也是根据第一和第二种方法的发型工具，发型工具组和发型工具系统。

10. 发明授权

US07875696B2 Use of a kinked rigid-rod polyarylene, and articles made from said kinked rigid-rod polyarylene 有权
标题翻译：新型使用扭结的刚性棒聚亚芳基，以及由所述扭结刚性棒聚亚芳基制成的制品
公开(公告)号：US07875696B2
公开(公告)日：2011-01-25
申请号：US12281027
申请日：2007-03-06
申请人： Leslie J. Myrick , David B. Thomas , Roy L. Carter , Nikica Maljkovic , Christopher Davis , Scott A. Harding , Mohammad Jamal El-Hibri
发明人： Leslie J. Myrick , David B. Thomas , Roy L. Carter , Nikica Maljkovic , Christopher Davis , Scott A. Harding , Mohammad Jamal El-Hibri
IPC分类号： C08G8/26
CPC分类号： C08L65/00 , C08G2261/312 , C08G2650/40 , C08J5/043 , C08J5/18 , C08J2365/02 , C08J2371/10 , C08L65/02 , C08L71/00 , C08L2205/02 , Y10T428/31504 , Y10T428/31678 , C08L2666/22
摘要： Use of at least one kinked rigid-rod polyarylene of a specific type for its fire resistance properties. Films and coatings consisting of a material comprising the same kinked rigid-rod polyarylene.
摘要翻译：使用至少一种特定类型的扭结刚性棒聚亚芳基的耐火性能。由包含相同的扭结刚性棒聚亚芳基的材料组成的薄膜和涂层。

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